JPS648057A - Thermal head substrate and its manufacturing method - Google Patents
Thermal head substrate and its manufacturing methodInfo
- Publication number
- JPS648057A JPS648057A JP16245087A JP16245087A JPS648057A JP S648057 A JPS648057 A JP S648057A JP 16245087 A JP16245087 A JP 16245087A JP 16245087 A JP16245087 A JP 16245087A JP S648057 A JPS648057 A JP S648057A
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- head substrate
- etching
- diameter
- feeder layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electronic Switches (AREA)
Abstract
PURPOSE:To enable low-cost manufacturing and prevent generation of etching pinholes in a feeder layer by providing a specific amount of ceramic particles of small diameter which contain a specific valve weight % of main component to exist among a specific amount of ceramic particles of large diameter. CONSTITUTION:A thermal head substrate 1 contains almost 96-97wt.% of alumina and has a surface structure in which a large amount of small particles 11 having a granular diameter of 0.5-2mum exist among large particles 10 having a granular diameter of 2-15mum. Under this constitution, no large space exists on the thermal head substrate 1, even if photoregist is applied to the surface of the thermal head substrate 1 and baked prior to etching when a partly glazed layer 2 is formed on the thermal head substrate 1 and a feeder layer 4 is formed by photoengraving process. Consequently, there is almost no drip or cut of photoregist which in turn, allows no permeation of an etching liquid. Thus the feeder layer 4 of high quality without etching pinholes can be manufactured.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62162450A JPH0813547B2 (en) | 1987-07-01 | 1987-07-01 | Thermal head substrate and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62162450A JPH0813547B2 (en) | 1987-07-01 | 1987-07-01 | Thermal head substrate and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS648057A true JPS648057A (en) | 1989-01-12 |
JPH0813547B2 JPH0813547B2 (en) | 1996-02-14 |
Family
ID=15754842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62162450A Expired - Fee Related JPH0813547B2 (en) | 1987-07-01 | 1987-07-01 | Thermal head substrate and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0813547B2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57182462A (en) * | 1981-05-08 | 1982-11-10 | Toshiba Corp | Manufacture of heat dissipating substrate |
JPS6135158A (en) * | 1984-07-24 | 1986-02-19 | Matsushita Electric Ind Co Ltd | Zero volt detector |
-
1987
- 1987-07-01 JP JP62162450A patent/JPH0813547B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57182462A (en) * | 1981-05-08 | 1982-11-10 | Toshiba Corp | Manufacture of heat dissipating substrate |
JPS6135158A (en) * | 1984-07-24 | 1986-02-19 | Matsushita Electric Ind Co Ltd | Zero volt detector |
Also Published As
Publication number | Publication date |
---|---|
JPH0813547B2 (en) | 1996-02-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |