JPS6479253A - Epoxy resin molding material for sealing electronic component - Google Patents
Epoxy resin molding material for sealing electronic componentInfo
- Publication number
- JPS6479253A JPS6479253A JP23697687A JP23697687A JPS6479253A JP S6479253 A JPS6479253 A JP S6479253A JP 23697687 A JP23697687 A JP 23697687A JP 23697687 A JP23697687 A JP 23697687A JP S6479253 A JPS6479253 A JP S6479253A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- melamine
- phenol novolac
- electronic component
- molding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23697687A JPS6479253A (en) | 1987-09-21 | 1987-09-21 | Epoxy resin molding material for sealing electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23697687A JPS6479253A (en) | 1987-09-21 | 1987-09-21 | Epoxy resin molding material for sealing electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6479253A true JPS6479253A (en) | 1989-03-24 |
Family
ID=17008550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23697687A Pending JPS6479253A (en) | 1987-09-21 | 1987-09-21 | Epoxy resin molding material for sealing electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6479253A (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997012925A1 (en) * | 1995-09-29 | 1997-04-10 | Toshiba Chemical Corporation | Halogen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same |
US6214455B1 (en) | 1995-09-29 | 2001-04-10 | Toshiba Chemical Corporation | Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin |
JP2001310931A (ja) * | 2000-04-27 | 2001-11-06 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP2004292791A (ja) * | 2003-03-12 | 2004-10-21 | Sumitomo Bakelite Co Ltd | トリアジン変性ノボラック型フェノール樹脂の製造方法 |
JP2005336227A (ja) * | 2004-05-24 | 2005-12-08 | Dainippon Ink & Chem Inc | 固形レゾール型フェノール樹脂の製造方法 |
JP2010031126A (ja) * | 2008-07-28 | 2010-02-12 | Panasonic Electric Works Co Ltd | 封止用エポキシ樹脂組成物および半導体装置 |
-
1987
- 1987-09-21 JP JP23697687A patent/JPS6479253A/ja active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997012925A1 (en) * | 1995-09-29 | 1997-04-10 | Toshiba Chemical Corporation | Halogen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same |
EP0795570A4 (en) * | 1995-09-29 | 2001-01-24 | Toshiba Chem Corp | HALOGEN-FREE FLAME-RESISTANT EPOXY RESIN COMPOSITION, AND PREPREG AND COMPOSITE CONTAINING THIS COMPOSITION |
US6214455B1 (en) | 1995-09-29 | 2001-04-10 | Toshiba Chemical Corporation | Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin |
JP2001310931A (ja) * | 2000-04-27 | 2001-11-06 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP2004292791A (ja) * | 2003-03-12 | 2004-10-21 | Sumitomo Bakelite Co Ltd | トリアジン変性ノボラック型フェノール樹脂の製造方法 |
JP2005336227A (ja) * | 2004-05-24 | 2005-12-08 | Dainippon Ink & Chem Inc | 固形レゾール型フェノール樹脂の製造方法 |
JP2010031126A (ja) * | 2008-07-28 | 2010-02-12 | Panasonic Electric Works Co Ltd | 封止用エポキシ樹脂組成物および半導体装置 |
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