JPS6478671A - Jet type soldering device - Google Patents

Jet type soldering device

Info

Publication number
JPS6478671A
JPS6478671A JP23449287A JP23449287A JPS6478671A JP S6478671 A JPS6478671 A JP S6478671A JP 23449287 A JP23449287 A JP 23449287A JP 23449287 A JP23449287 A JP 23449287A JP S6478671 A JPS6478671 A JP S6478671A
Authority
JP
Japan
Prior art keywords
solder
side structure
work carry
out side
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23449287A
Other languages
Japanese (ja)
Inventor
Hiromi Umeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP23449287A priority Critical patent/JPS6478671A/en
Publication of JPS6478671A publication Critical patent/JPS6478671A/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To correspond the injection amt. of a solder with a work by providing a work carry-out side structure freely turnably for the work carry-in side structure fixed to the upper part of the nozzle for jetting a solder and forming a solder injection port in the space with the work carry-out side structure of a standing state. CONSTITUTION:When the work carry-out side structure 35 of the nozzle upper part is stood, the jet wave 41 in the opposing direction to the transfer direction of a substrate P between the work carry-out side structure 35 and a work carry-in side structure 34. On this jet wave 41 the solder sticking amt. to the substrate P is comparatively small. Also, when the work carry-out side structure 35 is fallen into a solder pool 24, the nozzle upper part is largely opened to the solder pool side and the plane likely solder flow 42 at the flow velocity and in the direction close to the substrate transfer speed and direction only is formed in the solder pool 24. This solder flow 42 comparatively increases the solder sticking amt. to the substrate P.
JP23449287A 1987-09-18 1987-09-18 Jet type soldering device Pending JPS6478671A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23449287A JPS6478671A (en) 1987-09-18 1987-09-18 Jet type soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23449287A JPS6478671A (en) 1987-09-18 1987-09-18 Jet type soldering device

Publications (1)

Publication Number Publication Date
JPS6478671A true JPS6478671A (en) 1989-03-24

Family

ID=16971876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23449287A Pending JPS6478671A (en) 1987-09-18 1987-09-18 Jet type soldering device

Country Status (1)

Country Link
JP (1) JPS6478671A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61126961A (en) * 1984-11-15 1986-06-14 ユテイヤージユ　サイエンテイフイク　エ　デ　ラボラトワール　エス．ア． Apparatus for generating wave of solder

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61126961A (en) * 1984-11-15 1986-06-14 ユテイヤージユ　サイエンテイフイク　エ　デ　ラボラトワール　エス．ア． Apparatus for generating wave of solder

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