JPS58195469U - soldering equipment - Google Patents

soldering equipment

Info

Publication number
JPS58195469U
JPS58195469U JP9345782U JP9345782U JPS58195469U JP S58195469 U JPS58195469 U JP S58195469U JP 9345782 U JP9345782 U JP 9345782U JP 9345782 U JP9345782 U JP 9345782U JP S58195469 U JPS58195469 U JP S58195469U
Authority
JP
Japan
Prior art keywords
solder
opening
soldering
puddle
jet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9345782U
Other languages
Japanese (ja)
Other versions
JPS6222295Y2 (en
Inventor
滝田　澣
幹夫 石井
Original Assignee
株式会社弘輝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社弘輝 filed Critical 株式会社弘輝
Priority to JP9345782U priority Critical patent/JPS58195469U/en
Publication of JPS58195469U publication Critical patent/JPS58195469U/en
Application granted granted Critical
Publication of JPS6222295Y2 publication Critical patent/JPS6222295Y2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は従来例の要部の断面図、第３図は本
考案の要部の断面図である。 １１・・・・・・半田噴流ノズル、ｌｌａ・・・・・・
側壁、１３・・・・・・誘導板、１４・・・・・・半田
溜り、１５・・・・・・傾斜壁、１５ａ・・・・・・セ
キ板、１６・・・・・・半田逃し口、１７・・・・・・
開閉扉、１８・・・・・・渦巻き防止板（ウェーブホー
マー）。1 and 2 are sectional views of the main parts of the conventional example, and FIG. 3 is a sectional view of the main parts of the present invention. 11...Solder jet nozzle, lla...
Side wall, 13... Guide plate, 14... Solder pool, 15... Slanted wall, 15a... Seki plate, 16... Solder Escape port, 17...
Opening/closing door, 18... Spiral prevention plate (wave homer).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 噴流式半田槽に設けた半田噴流口のプリント基板などの
被半田付物の進出側（下手側）に、半田溜りを形成し、
該半田溜りに流入する半田の波を被半田付物の移動速度
と略同−速度で流れる静かな半田流として誘導するよう
にした装置において、上記半田溜りの半田面より下方に
、開閉扉などにより開口調節可能で、かつ、半田噴流口
の流速及び液面高さを調整可能な前記半田逃し口を設け
たことを特徴とする半田付装置。A solder pool is formed on the forward side (lower side) of the solder spout provided in the jet solder tank to the soldering object such as a printed circuit board.
In a device that guides waves of solder flowing into the solder puddle as a quiet solder flow flowing at approximately the same speed as the moving speed of the soldering object, an opening/closing door or the like is provided below the solder surface of the solder puddle. 1. A soldering device characterized in that the solder outlet is provided with an opening that is adjustable, and the flow velocity and liquid level height of the solder jet opening can be adjusted.
JP9345782U 1982-06-22 1982-06-22 soldering equipment Granted JPS58195469U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9345782U JPS58195469U (en) 1982-06-22 1982-06-22 soldering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9345782U JPS58195469U (en) 1982-06-22 1982-06-22 soldering equipment

Publications (2)

Publication Number Publication Date
JPS58195469U true JPS58195469U (en) 1983-12-26
JPS6222295Y2 JPS6222295Y2 (en) 1987-06-06

Family

ID=30224280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9345782U Granted JPS58195469U (en) 1982-06-22 1982-06-22 soldering equipment

Country Status (1)

Country Link
JP (1) JPS58195469U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63174963U (en) * 1986-10-30 1988-11-14
JPH02155566A (en) * 1988-12-06 1990-06-14 Kenji Kondo Jet type soldering tank

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52127263U (en) * 1976-03-24 1977-09-28
JPS5327227A (en) * 1976-08-25 1978-03-14 Nisshin Kogyo Kk Waterproofing material and heat insulating waterproof material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52127263U (en) * 1976-03-24 1977-09-28
JPS5327227A (en) * 1976-08-25 1978-03-14 Nisshin Kogyo Kk Waterproofing material and heat insulating waterproof material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63174963U (en) * 1986-10-30 1988-11-14
JPH02155566A (en) * 1988-12-06 1990-06-14 Kenji Kondo Jet type soldering tank

Also Published As

Publication number Publication date
JPS6222295Y2 (en) 1987-06-06

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