JPS5917763U - Continuous surface treatment equipment for wire materials - Google Patents
Continuous surface treatment equipment for wire materialsInfo
- Publication number
- JPS5917763U JPS5917763U JP11174182U JP11174182U JPS5917763U JP S5917763 U JPS5917763 U JP S5917763U JP 11174182 U JP11174182 U JP 11174182U JP 11174182 U JP11174182 U JP 11174182U JP S5917763 U JPS5917763 U JP S5917763U
- Authority
- JP
- Japan
- Prior art keywords
- surface treatment
- continuous surface
- treatment equipment
- wire materials
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案による装置の斜視図である。
1・・・・・・メッキ槽、2・・・・・・後壁、3・・
・・・・スリット、4・・・・・・受は皿、6・・・・
・・スリット(出口)、7・・・・・・帯板(被メッキ
材)、12・・・・・・パイプ(通路)、14・・・・
・田−ル(シール部材)、15・・・・・・ノズル。FIG. 1 is a perspective view of the device according to the invention. 1...Plating tank, 2...Rear wall, 3...
...Slit, 4...The receiver is a plate, 6...
...Slit (outlet), 7...Band plate (material to be plated), 12...Pipe (passage), 14...
- Field (sealing member), 15... Nozzle.
Claims (1)
スリットの背後に受は皿を配置し、受は皿部に向う補給
用精製水ノズルを設け、受は皿内のメッキ漏液と精製水
の混合液をメッキ槽に戻す通路を設けたことを特徴とす
る線条材の連続表面処理装置。A slit is provided in the plating tank through which the material to be plated passes, a tray is placed behind this slit, and a purified water nozzle for replenishment is installed in the tray toward the pan. A continuous surface treatment device for wire material, characterized in that a passage is provided for returning a mixed solution of the above to a plating tank.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11174182U JPS5917763U (en) | 1982-07-22 | 1982-07-22 | Continuous surface treatment equipment for wire materials |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11174182U JPS5917763U (en) | 1982-07-22 | 1982-07-22 | Continuous surface treatment equipment for wire materials |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5917763U true JPS5917763U (en) | 1984-02-03 |
JPS623390Y2 JPS623390Y2 (en) | 1987-01-26 |
Family
ID=30259315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11174182U Granted JPS5917763U (en) | 1982-07-22 | 1982-07-22 | Continuous surface treatment equipment for wire materials |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5917763U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5339224A (en) * | 1976-09-21 | 1978-04-11 | Philips Nv | Electrolytic treatment method of conductive strip and apparatus for practising said method |
-
1982
- 1982-07-22 JP JP11174182U patent/JPS5917763U/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5339224A (en) * | 1976-09-21 | 1978-04-11 | Philips Nv | Electrolytic treatment method of conductive strip and apparatus for practising said method |
Also Published As
Publication number | Publication date |
---|---|
JPS623390Y2 (en) | 1987-01-26 |
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