JPS6222295Y2 - - Google Patents
Info
- Publication number
- JPS6222295Y2 JPS6222295Y2 JP1982093457U JP9345782U JPS6222295Y2 JP S6222295 Y2 JPS6222295 Y2 JP S6222295Y2 JP 1982093457 U JP1982093457 U JP 1982093457U JP 9345782 U JP9345782 U JP 9345782U JP S6222295 Y2 JPS6222295 Y2 JP S6222295Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- pool
- jet nozzle
- flow
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 121
- 238000005476 soldering Methods 0.000 claims description 14
- 230000002265 prevention Effects 0.000 claims description 11
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 102000010029 Homer Scaffolding Proteins Human genes 0.000 description 1
- 108010077223 Homer Scaffolding Proteins Proteins 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、半田付装置の改良に関する。[Detailed explanation of the idea] [Industrial application field] The present invention relates to improvements in soldering equipment.
半田付不良の代表的な現象である、つらら、ブ
リツジなどは、プリント基板が半田面から離脱す
る時に発生する。この現象を防止するためには、
プリント基板面と半田流表面の相対角度を適切に
設定（通常４゜〜７゜）すること、および、プリ
ント基板と半田流の相対速度を低く抑えることが
一般に有効とされている。
Icicles and bridges, which are typical phenomena of soldering defects, occur when the printed circuit board separates from the solder surface. To prevent this phenomenon,
It is generally considered effective to appropriately set the relative angle between the printed circuit board surface and the solder flow surface (usually 4° to 7°) and to keep the relative speed between the printed circuit board and the solder flow low.
第１図に示すような、半田噴流ノズル１に対す
るプリント基板の進入側と進出側に半田の誘導板
２，３を設けた一般的な半田槽では、プリント基
板が半田から離脱する離脱点P1での半田流速が非
常に速く、これを制御することも不可能なため、
つららが発生し易い問題点がある。 In a general solder tank as shown in Fig. 1, in which solder guide plates 2 and 3 are provided on the entrance and exit sides of the printed circuit board to the solder jet nozzle 1, there is a separation point P 1 where the printed circuit board separates from the solder. The solder flow rate is very fast and it is impossible to control it.
There is a problem that icicles are likely to occur.
このような問題点を解決するために開発されて
いる第２図に示すような、半田噴流ノズル１の進
入側に半田の誘導板２を設け、進出側に半田溜り
（トレイ）４を設け、この半田溜り４の下手側上
端部に、堰板５を上下調節可能に設けた装置（一
例として特公昭53−27227号公報）は、噴流口か
ら噴流する半田を半田溜り４に溜め、堰板５の上
下動調節によつて半田流表面の流速を制御するよ
うにしたものであるため、半田付けは良好に行わ
れるが、半田溜り４における半田面をほぼ水平に
セツトすることから、プリント基板の搬送角度θ
に制約をうけるばかりでなく、プリント基板と半
田流表面の相対速度を０にするためには、プリン
ト基板の速度でしか調整できない。 In order to solve these problems, a solder jet nozzle 1, as shown in FIG. 2, has been developed with a solder guide plate 2 provided on the entry side and a solder reservoir (tray) 4 provided on the exit side. A device (for example, Japanese Patent Publication No. 53-27227) in which a weir plate 5 is vertically adjustable at the upper end of the lower side of the solder pool 4 collects the solder jetted from the jet port in the solder pool 4, and the weir plate Since the flow velocity on the surface of the solder flow is controlled by adjusting the vertical movement of the solder pool 4, the soldering is performed well. However, since the solder surface in the solder pool 4 is set almost horizontally, conveyance angle θ
Not only is there a restriction on the speed of the printed circuit board, but the relative velocity between the printed circuit board and the surface of the solder flow can be adjusted to zero only by adjusting the speed of the printed circuit board.
また、この先行技術では、プリント基板を上向
きの傾斜をもたせて半田付けし、その角度４゜〜
８゜が良いとされているが、このことは、半田付
装置の前後に設置する部品挿入ライン、半田付後
の検査ラインなどのコンベアラインとの接続に支
障を来すなどの問題点がある。 In addition, in this prior art, the printed circuit board is soldered with an upward slope, and the angle is 4° to 4°.
8° is said to be good, but this poses problems such as interfering with the connection with conveyor lines such as parts insertion lines installed before and after the soldering equipment, post-soldering inspection lines, etc. .
本考案は、このような実情に鑑みなされたもの
で、簡単な構成と合理的手段によつて従来技術の
問題点を解消せしめ、渦巻き防止板の角度調節に
よつて半田波形を調整するとともに、半田溜りの
液面下に設けた半田逃し口からの半田逃し、およ
び、堰板の移動調節により半田流表面付近の流速
の制御を行わせることにより、各種のプリント基
板に対して最適の半田付け条件が設定しうる装置
を提供せんとするものである。
The present invention was developed in view of the above circumstances, and uses a simple configuration and rational means to solve the problems of the prior art, adjust the solder waveform by adjusting the angle of the swirl prevention plate, and The solder escapes from the solder outlet provided below the liquid level of the solder pool, and the flow velocity near the solder flow surface is controlled by adjusting the movement of the weir plate, allowing for optimal soldering for various printed circuit boards. The purpose is to provide a device in which conditions can be set.
従来技術の問題点を解決する本考案の構成は、
噴流式半田槽内に、該半田槽内の半田面より高位
に半田噴流ノズルを設け、この半田噴流ノズルの
プリント基板などの被半田付物進入側に、噴流半
田の大半を半田槽内に戻流する誘導板を設けると
ともに、半田噴流ノズルの被半田付物進出側に半
田溜りを設け、該半田溜りの下手側端部に上下調
節可能な堰板を設けるとともに、上記半田溜りを
構成する底壁下部に半田逃し口を形成した半田付
装置において、上記半田溜りを構成する底壁に、
この底壁に設けた半田逃し口を開閉調節する開閉
扉をスライド可能に設け、更に、上記半田噴流ノ
ズルを構成する被半田付物進出側壁の上部外方
に、角度調節可能な渦巻き防止板を設けたことを
特徴とするものである。
The structure of the present invention that solves the problems of the conventional technology is as follows:
A solder jet nozzle is installed in the solder jet type solder tank at a higher level than the solder surface in the solder tank, and most of the jet solder is returned to the solder tank at the entrance side of the solder jet nozzle to the object to be soldered such as a printed circuit board. In addition to providing a guide plate for flowing the solder, a solder pool is provided on the side of the solder jet nozzle where the soldered object advances, and a weir plate that is vertically adjustable is provided at the lower end of the solder pool, and a bottom forming the solder pool is provided. In a soldering device in which a solder outlet is formed in the lower part of the wall, the bottom wall forming the solder pool is
A sliding door for opening and closing the solder outlet provided on the bottom wall is provided in a slidable manner, and an angle-adjustable swirl prevention plate is provided on the upper outer side of the soldering object advancing side wall that constitutes the solder jet nozzle. It is characterized by the fact that it has been provided.
第３図について本考案実施例の詳細を説明する
と、１１は、半田槽（図示略）内の半田面より高
位に設けた半田の噴流ノズルで、該噴流ノズル１
１のプリント基板１２進入側に、噴流半田の大半
を半田槽内に静かに戻流する誘導板１３を設け、
また、噴流ノズル１１のプリント基板進出側に、
半田溜り１４を形成する。
To explain the details of the embodiment of the present invention with reference to FIG. 3, reference numeral 11 denotes a solder jet nozzle provided at a higher level than the solder surface in a solder bath (not shown);
A guide plate 13 is provided on the entry side of the printed circuit board 12 of No. 1 to cause most of the solder jet to flow gently back into the solder tank.
In addition, on the printed circuit board advancing side of the jet nozzle 11,
A solder pool 14 is formed.
この半田溜り１４は、噴流ノズル１１を形成す
る進出側側壁１１ａと、傾斜底壁１５とにより構
成された平面形状が長方形のトレイ構造であり、
この半田溜り１４の進出側端縁には、オーバーフ
ローする半田を静かに半田槽内に戻すため、およ
び、出口付近での半田流表面の高さと、半田溜り
１４の長さを調整するための堰板１５ａが、上記
傾斜底壁１５にそつてスライド可能に設けてあ
る。そして、上記傾斜底壁１５の下辺部には、半
田溜り１４内の半田を半田槽内に逃すための半田
逃し口１６が形成されており、この半田逃し口１
６には、傾斜底壁１５面にそつてスライドする開
閉扉１７が設けてあり、この開閉扉１７により半
田逃し口１６の開口度合いを調整するものであ
る。 This solder pool 14 has a tray structure with a rectangular planar shape, which is composed of an advancing side wall 11a forming a jet nozzle 11 and an inclined bottom wall 15.
A weir is provided at the advancing side edge of the solder pool 14 to gently return the overflowing solder into the solder tank, and to adjust the height of the solder flow surface near the outlet and the length of the solder pool 14. A plate 15a is provided so as to be slidable along the inclined bottom wall 15. A solder escape port 16 is formed at the lower side of the inclined bottom wall 15 to release the solder in the solder pool 14 into the solder tank.
6 is provided with an opening/closing door 17 that slides along the surface of the inclined bottom wall 15, and the degree of opening of the solder escape port 16 is adjusted by this opening/closing door 17.
また、上記半田噴流ノズル１１の進出側側壁１
１ａ上部には、半田溜り内半田流の渦巻き防止板
１８の一端が軸支してある。該渦巻き防止板１８
は、角度が任意に調整できるように構成されてい
る。そして、半田逃し口１６からの半田逃し量、
および、上記堰板１５ａの高さ調整との併用作用
で、半田流の波形調整、半田流表面の流速調整、
半田溜り１４の長さ調整が行われるようにしたも
のである。 Further, the advancing side side wall 1 of the solder jet nozzle 11
One end of a plate 18 for preventing swirling of the solder flow in the solder pool is pivotally supported on the upper part 1a. The swirl prevention plate 18
is configured so that the angle can be adjusted arbitrarily. And the amount of solder released from the solder release port 16,
In combination with the height adjustment of the weir plate 15a, the waveform of the solder flow is adjusted, the flow velocity of the solder flow surface is adjusted,
The length of the solder pool 14 can be adjusted.
次に作用について説明すると、噴流ノズル１１
の噴流口から、公知の手段で噴流された半田槽内
の半田は、その大半が噴流ノズル１１の進入側に
とりつけられた誘導板１３上を通つて静かに半田
槽内に戻される。残りの噴流半田は、渦巻き防止
板１８上を経て半田溜り１４内に入る。半田溜り
１４内の半田は、これの傾斜底壁１５に設けた半
田逃し口１６から半田槽内に戻されるが、この戻
し量より噴流口からの半田供給量が多いため、半
田溜り１４内には半田が充満され、やがては、半
田は半田溜り１４の進出側端縁上を溢流して半田
槽内に戻されることになる。
Next, to explain the operation, the jet nozzle 11
Most of the solder in the solder tank that is jetted from the jet port by a known means passes over a guide plate 13 attached to the entrance side of the jet nozzle 11 and is quietly returned to the solder tank. The remaining jet solder passes over the swirl prevention plate 18 and enters the solder pool 14. The solder in the solder pool 14 is returned to the solder tank from the solder escape port 16 provided on the inclined bottom wall 15 of the solder pool, but since the amount of solder supplied from the jet port is greater than this return amount, the solder is returned to the solder pool 14. is filled with solder, and eventually the solder overflows onto the advancing side edge of the solder reservoir 14 and returns to the solder tank.
この状態が第３図に示した波形であるが、半田
逃し口１６を大きく開くことによつて、半田の逃
し量が多くなるため、半田溜り１４上面の半田流
波形は水平部が多くなり、逃し口１６を開閉扉１
７にて小さくすることにより波形の平面部は小さ
くなる。また、渦巻き防止板１８は、半田逃し口
１６から流出する半田流によつて生じようとする
渦流の発生を防止する役割を果す一方、この渦巻
き防止板１８は、波形の調整、および、半田流表
面流速の調節に大きな役割を果すもので、また、
上記逃し口１６からの流出量の調節、堰板１５の
スライド調整による半田流表面の高さと、半田溜
り１４の長さ調整作用とを有機的に併せて、更に
波形、流速の微小調整が行える。 This state is the waveform shown in FIG. 3, but by widening the solder escape port 16, the amount of solder escape increases, so the solder flow waveform on the top surface of the solder pool 14 has many horizontal parts. Door 1 that opens and closes the escape port 16
7, the flat portion of the waveform becomes smaller. Further, the swirl prevention plate 18 plays a role in preventing the generation of swirls that would otherwise occur due to the solder flow flowing out from the solder outlet 16, while the swirl prevention plate 18 serves to adjust the waveform and prevent the solder flow from occurring. It plays a major role in regulating surface flow velocity, and
By organically combining the adjustment of the amount of flow from the relief port 16, the height of the solder flow surface by adjusting the slide of the weir plate 15, and the length adjustment of the solder pool 14, it is possible to further finely adjust the waveform and flow velocity. .
このように本考案によれば、次のような効果が
得られる。
As described above, according to the present invention, the following effects can be obtained.
(a) 渦巻き防止板によつて、半田溜り内の半田流
の渦巻き発生が防止しうるとともに、半田溜り
における半田流表面を滑らかにし、半田付け効
率の向上が計れる。(a) The swirl prevention plate can prevent swirling of the solder flow in the solder puddle, and can also smooth the surface of the solder flow in the solder puddle, thereby improving soldering efficiency.
(b) 渦巻き防止板の上向き下向き調整にて半田流
の波形調整がなしうるとともに、この調整作用
と併せて、半田逃し口からの半田逃し量を調整
すること、詳しくは、逃し量を多くすることに
より表面付近の流速を遅くするとともに、水平
波形部の高さと噴流高との差を大きくすること
ができ、従つて、従来のように波形に合わせて
プリント基板の搬送速度を調節する煩雑さがな
く、半田流表面付近の流速を自由に調節し、基
板の搬送速度に適合しうる特長がある。(b) The waveform of the solder flow can be adjusted by adjusting the swirl prevention plate upward or downward, and in conjunction with this adjustment, the amount of solder released from the solder release port can be adjusted. Specifically, the amount of solder released can be increased. This makes it possible to slow down the flow velocity near the surface and increase the difference between the height of the horizontal corrugated part and the height of the jet stream, thereby eliminating the hassle of adjusting the conveyance speed of the printed circuit board according to the waveform as in the past. It has the advantage of being able to freely adjust the flow velocity near the solder flow surface and adapt it to the board conveyance speed.
(c) 渦巻き防止板の角度、および、堰板の高さを
変えることにより、半田溜りの長さ調整、半田
流表面波形と流速の調整ができ、基板を水平に
搬送しても良好な半田付けがなしうる。このと
は、半田付装置の前後に設置する部品挿入ライ
ン、半田付後の検査ラインなどのコンベアライ
ンとの接続を行うのに大きなメリツトがある。(c) By changing the angle of the swirl prevention plate and the height of the weir plate, it is possible to adjust the length of the solder pool, the solder flow surface waveform, and the flow velocity, ensuring good soldering even when the board is transported horizontally. Attachment can be done. This has a great advantage in connection with conveyor lines such as component insertion lines and post-soldering inspection lines installed before and after the soldering device.
第１図および第２図は従来例の要部の断面図、
第３図は本考案の要部の断面図である。
１１……半田噴流ノズル、１１ａ……側壁、１
３……誘導板、１４……半田溜り、１５……傾斜
壁、１５ａ……堰板、１６……半田逃し口、１７
……開閉扉、１８……渦巻き防止板（ウエーブホ
ーマー）。
Figures 1 and 2 are cross-sectional views of the main parts of the conventional example;
FIG. 3 is a sectional view of the main parts of the present invention. 11...Solder jet nozzle, 11a...Side wall, 1
3... Guidance plate, 14... Solder pool, 15... Inclined wall, 15a... Weir plate, 16... Solder escape port, 17
...Opening/closing door, 18...Swirl prevention plate (wave homer).
Claims (1)
高位に半田噴流ノズルを設け、この半田噴流ノ
ズルのプリント基板などの被半田付物進入側
に、噴流半田の大半を半田槽内に戻流する誘導
板を設けるとともに、半田噴流ノズルの被半田
付物進出側に半田溜りを設け、該半田溜りの下
手側端部に上下調節可能な堰板を設けるととも
に、上記半田溜りを構成する底壁下部に半田逃
し口を形成した半田付装置において、 (b) 上記半田溜りを構成する底壁に、この底壁に
設けた半田逃し口を開閉調節する開閉扉をスラ
イド可能に設け、 (c) 更に、上記半田噴流ノズルを構成する被半田
付物進出側壁の上部外方に、角度調節可能な渦
巻き防止板を設けたことを特徴とする半田付装
置。[Scope of Claim for Utility Model Registration] (a) A solder jet nozzle is provided in a jet type solder tank at a higher level than the solder surface in the solder tank, and the solder jet nozzle is placed on the entry side of the object to be soldered such as a printed circuit board. A guide plate is provided for directing most of the solder jet back into the solder bath, a solder pool is provided on the side of the solder jet nozzle where the object to be soldered advances, and a vertically adjustable weir plate is provided at the lower end of the solder pool. and a soldering device having a solder escape port formed at the bottom of the bottom wall constituting the solder pool, (b) a solder escape port provided in the bottom wall forming the solder pool; (c) further comprising: an angle-adjustable swirl prevention plate provided on the upper outer side of the soldering object advancing side wall constituting the solder jet nozzle; Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9345782U JPS58195469U (en) | 1982-06-22 | 1982-06-22 | soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9345782U JPS58195469U (en) | 1982-06-22 | 1982-06-22 | soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58195469U JPS58195469U (en) | 1983-12-26 |
| JPS6222295Y2 true JPS6222295Y2 (en) | 1987-06-06 |
Family
ID=30224280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9345782U Granted JPS58195469U (en) | 1982-06-22 | 1982-06-22 | soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58195469U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0730210Y2 (en) * | 1986-10-30 | 1995-07-12 | トヨタ自動車株式会社 | Solder bath structure of automatic soldering equipment |
| JPH0677815B2 (en) * | 1988-12-06 | 1994-10-05 | 権士 近藤 | Jet type solder bath |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5327227A (en) * | 1976-08-25 | 1978-03-14 | Nisshin Kogyo Kk | Waterproofing material and heat insulating waterproof material |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52127263U (en) * | 1976-03-24 | 1977-09-28 |
-
1982
- 1982-06-22 JP JP9345782U patent/JPS58195469U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5327227A (en) * | 1976-08-25 | 1978-03-14 | Nisshin Kogyo Kk | Waterproofing material and heat insulating waterproof material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58195469U (en) | 1983-12-26 |
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