JPH022539Y2 - - Google Patents

Description

[Detailed description of the invention] [Field of industrial application] This invention involves forming a notch in the jet bath of a jet soldering bath that solders the lead terminals of an IC, and passing the IC through this notch. I did it like this
This relates to IC soldering equipment.

[Conventional technology]

FIG. 3 is a configuration diagram showing the main parts of a conventional IC soldering device, in which 1 is an IC, 2 is a lead terminal, 3 is a solder bath, 4 is a jet tank of the solder bath 3, 5 is a jet port, and 6 1 is a solder melt, and 7 is a wire rail provided at a position corresponding to the solder bath 3 to allow the IC 1 to run and to facilitate soldering of the lead terminal 2 of the IC 1 by the solder melt 6 from the jet port 5. Therefore, it is formed by stretching a wire 8 such as a piano wire. Reference numeral 9 denotes a long holding plate for holding down the IC 1 so that it does not float due to the jet of the solder melt 6, 10 a conveyance chain, and 11 a claw that presses the rear end of the IC 1 as the conveyance chain 10 runs and causes it to be conveyed. , 12 is a mounting plate for the claw 11;
Its end portion is attached to the conveying chain 10 at a predetermined pitch. Note that a plurality of wire rails 7, presser plates 9, and claws 11 are provided in parallel.

A conventional IC soldering device is constructed as described above, and the claws 11 are moved by the movement of the conveyor chain 10.
The IC 1 is transferred by pushing the rear end of the IC 1 in the direction of arrow A, and is soldered to the lead terminal 2 by the jetting solder melt 6.

[Problem that the invention attempts to solve]

Conventional IC soldering equipment like the one above
Since the entire IC 1 is immersed in a large amount of solder solution 6 for a long time and is further shielded by the upper holding plate 9, heat is not radiated, and there are problems such as the IC 1 itself being damaged by the heat of the solder melt 6.

This idea was made to solve the above problem, and it is designed for ICs that can sufficiently dissipate heat from the IC heated by the solder melt without the entire IC being immersed in the solder melt. The purpose is to obtain soldering equipment.

[Means for solving problems]

The IC soldering device according to this invention has notches formed in the jet tank of the solder bath at the rear and front in the running direction of the IC, side walls along the outer edges of these notches, and lead terminals. In order to forcefully spray the solder melt in the jet tank, a jet plate with a large number of through holes for spouting the solder melt is installed in the jet tank, and a jet plate is installed in the jet tank, and a jet plate is provided in the lower part of the outside of the front notch to spray the solder melt. It is equipped with a storage tank.

[Effect]

In this invention, the entire IC is not immersed in the solder melt, but the IC is immersed in the solder melt flowing out from each notch of the jet tank and the solder melt jetting out from the through hole of the jet plate. The solder melt will fully adhere to the lead terminals.

〔Example〕

Fig. 1 is a perspective view showing one embodiment of this invention, Fig. 2a is a plan view of Fig. 1, Fig. 2b is a sectional view taken along the - line of Fig. 2a, and Fig. 2c is a B in diagram a
FIG. In these figures,
The same reference numerals as in FIG. 3 indicate the same components, 21 is a solder tank, 22 is a jet tank, 23 is a jet port, and 24 is a wire rail.When IC1 is run, the jet of solder melt 6 prevents IC1 from floating. In order to hold it down, wires 8 are stretched below and above the IC 1. In addition, wire rail 7
Multiple pieces are arranged in parallel. Reference numeral 25 denotes a jet plate, which has a small diameter through hole 26 through which the solder melt 6 is jetted to each outer portion of the lead terminals 2 on both sides of the IC 1, and a small diameter through hole 26 through which the solder melt 6 is jetted to the inner portion of the lead terminal 2 of the IC 1. A large-diameter through-hole 27 is formed through which water is ejected. Reference numerals 28 and 29 are notches formed in the jet tank 22, which allow the IC1 to pass through the position where the wire rail 24 intersects with the jet tank 22, and allow the solder melt 6 to flow out from the portion where the IC1 passes. The notch 28 is located at the rear of the IC 1 in the running direction.
9 is formed in front of IC1 in the running direction.
Reference numerals 30 and 31 denote protrusions formed at the center of each of the notches 28 and 29, and the protrusions 3 at the front
1 is lower than the rear protrusion 30 by a height h as shown in FIGS. 2b and 2c. 32, 33
are side walls formed on both sides of the outer edges of the notches 28, 29 and the projections 30, 31;
The width w of the solder melt 6 after flowing out from the solder melt 9 is kept constant. 34 is a reservoir formed to slow down the flow rate of the solder melt 6 flowing out from the front notch 29, and 35 is a discharge hole for discharging the solder melt 6 in the reservoir 34 downward. .

Next, the operation will be explained.

As the conveyance chain 10 travels, the IC is pushed by the claws 11 and advances in the direction of the arrow C inside the wire rail 24, and when it approaches the jet tank 22, the solder melt 6 is spouted with a constant width w from the notch 28 at the rear. Therefore, the lead terminals 2 are immersed in the solder melt 6.
Next, the IC 1 enters the jet tank 22 through the rear notch 28 and enters the through holes 26 and 27 of the jet plate 25.
The lead terminal 2 is completely immersed in the solder melt 6 that is strongly spouted from the
After being completely soldered with the solder melt 6 which flows out from the solder melt 6 in the same width w from 9 and is stored in the storage tank 34 so that the outflow speed becomes slow, the solder melt 6 is further transported to the next stage of cleaning (not shown). transferred to a container.

[Effect of idea]

As explained above, in this invention, notches are formed in the jet tank of the solder bath at the rear and front in the running direction of the IC, so that the entire IC is not immersed in the solder melt flowing out from the notches. ,
Since only the lead terminals are soldered, there are fewer heated parts of the IC, and side walls are provided along the outer edge of each notch in the jet tank to keep the flow of solder melt at a constant width. It is possible to prevent portions of the lead terminals to which the solder melt does not adhere. In addition, a jet plate with a through hole for spouting the solder melt is provided in the jet tank, so that the solder melt is sufficiently attached to the lead terminals in the jet tank, and furthermore, By providing a storage tank for the solder melt that flows out to the bottom, it is possible to completely adhere the solder melt to the rear part of the lead terminal, and to increase the transport speed of the IC so that the IC is immersed in the solder melt. This has the advantage that damage due to heating can be prevented because the time required for heating can be shortened.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing one embodiment of this invention, Fig. 2a is a plan view of Fig. 1, Fig. 2b is a sectional view taken along the - line of Fig. 2a, and Fig. 2c is a B in diagram a
FIG. 3 is a side view as viewed from the arrow, and is a configuration diagram showing the main parts of a conventional IC soldering device. In the figure, 1 is an IC, 2 is a lead terminal, 21 is a solder bath, 22 is a jet tank, 23 is a jet port, 24 is a wire rail, 25 is a jet plate, 26 and 27 are through holes, 2
8, 29 are notches, 30, 31 are protrusions, 32,
33 is a side wall, 34 is a storage tank, and 35 is a discharge hole.

Claims (1)

[Scope of utility model registration request] An IC soldering device that runs a wire rail on a jet-type solder tank at a position corresponding to the jet tank, runs the IC, and solders the lead terminals of the IC using the solder melt jetted from the solder tank. In this step, the wire rail intersects the jet tank to allow the IC to pass therethrough, and a notch for flowing out the solder melt in the portion where the IC passes is located in the direction of travel of the IC with respect to the jet tank. Side walls are formed along the outer edges of each of the notches to maintain a constant width of the solder melt flowing out from each of the notches; A jet plate having a through hole for spraying the solder melt in the tank is provided in the jet tank, and a reservoir tank is provided in the front notch to temporarily store the solder melt flowing out from the front notch. An IC soldering device characterized by being installed on the outside and below.