CA1230426A - Vibratory wave soldering of printed wiring boards - Google Patents
Vibratory wave soldering of printed wiring boardsInfo
- Publication number
- CA1230426A CA1230426A CA000494984A CA494984A CA1230426A CA 1230426 A CA1230426 A CA 1230426A CA 000494984 A CA000494984 A CA 000494984A CA 494984 A CA494984 A CA 494984A CA 1230426 A CA1230426 A CA 1230426A
- Authority
- CA
- Canada
- Prior art keywords
- solder
- solder wave
- wave
- path
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0661—Oscillating baths
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
Wave soldering process and apparatus for the soldering of elements such as, for example, printed circuit assemblies with surface mounted components and the like which yield improved soldering results by promoting the penetration of solder into narrow spaces between components, the filling of small holes in a board, filling crevices, filling corners adjacent to solder masks and all other areas where solder wetting is difficult to achieve with conventional machines.
The process provides the steps of moving an element in a predetermined path, forming a solder wave beneath the path so that at least a portion of the element passes through the solder wave, and producing an oscillation in the solder wave during the passage of the element therethrough.
Wave soldering process and apparatus for the soldering of elements such as, for example, printed circuit assemblies with surface mounted components and the like which yield improved soldering results by promoting the penetration of solder into narrow spaces between components, the filling of small holes in a board, filling crevices, filling corners adjacent to solder masks and all other areas where solder wetting is difficult to achieve with conventional machines.
The process provides the steps of moving an element in a predetermined path, forming a solder wave beneath the path so that at least a portion of the element passes through the solder wave, and producing an oscillation in the solder wave during the passage of the element therethrough.
Description
VIBRATORY WAVE SOLDERING OF
PRINTED ~TIRING BOARDS
. . _ .
The present invention relates to wave soldering of printed wiring boards. More specifically, the present invention relates to wave solderin~ of surface mounted devices or components on printecl wiring boards as well as standard components on single sided, double sided and/or multi-layer boards.
New technologies in the electronic component industry have introduced surface mounted devices such as resistors, capacitors, integrated circuits and the like, in the form of chip components. These components are mounted usually with an adhesive to the bottom side of a printed wirin~ board. These conditions present new problems for existing soldering processes.
The present methods of wave soldering surface mounted devices on printed wiring boards include systems having two solder waves. The first solder wave typically has a narrow turbulent parabolic shape. The narrow wave contacts a small area on the wiring board allowing gases -to escape.
The gases are generated by flux volatiles and the like, which can inhibit solder wetting. The narrow wave also provides a vertical pressure to force solder into the small spaces and openings be-tween the components to ensure that all circuit pads, components, terrninations, contacts, and the like, are wetted with solder.
The second solder wave is typically a solder wave as used in commercially available machines for soldering printed wiring boards with leaded components-and the like.
The second wave completes the process and provides optimum exit conditions ~or the printed wiring boards leaving the solder wave to minimize or eliminate excess solder deposits and eliminate bridges between contacts.
The dual solder wave process has proven to be ~ ;~3~
effective for soldering surface mounted devices onto printed wiring boards, but the process suffers from certain d~sadvantages. One problem is excessive dross (oxide) production. Dual wave systems typically produce up to twice as much dross as single wave systems. Another problem is the lack of fine control of a turbulent para-bolic solder wave. Best soldering results have been obtained by immersing the printed wiring board as deeply as possible in this wave. However, the turbulence of the wave makes this task di~ficult and may result in ,solder flooding onto the top side of the printed wiring boards.
It is one purpose o~ the present invention to provide an apparatus and a process for wave soldering elements such as printed wiring boards with surface mounted devices that overcome the above mentioned problems. It is a further aim of the present invention to provide a controllable vibration or oscillation to a solder wave as opposed to random turbulence. The term 'vibration'' and ''oscillation'' used throughout the specification and claims refer to frequencies below about 20 KHz.
The present invention provides a process and an apparatus ~or wave soldering elements such as surface mounted devices on a printed wiring board wherein a solder wave is subjected to an oscillation or vibration during the passage of a printed wiring board therethrough. The oscillation or vibration aids in filling small holes in a board, crevices, coxners adjacent to solder masks and all other areas where solder wetting is di~ficult to achieve with conventional machines. An additional benefit is overcoming problems that occur with thick dry film solder mask. A relatively high frequency oscillation in the solder wave displaces or dislodges gas bubbles that form beneath the boards~ allowing the solder to reach all areas ~1 ~3~
in the matrix of components on the printed wiring boards, overcoming the repelling effect of any non-metallized elements such as component bcdies, solder masks and the like.
Furthermore the vibrating or oscillating concept of the present invention can be applied to existing types of solder wave machines for wave soldering, either as a permanent installation or a temporary installation for soldering certain difficult to solder elements.
The present invention provides a process for wave soldering an element comprising the steps of: moving the element in a pre-determined path, forming a solder wave beneath the path so that at least a portion of the element passes through the solder wave, and producing an oscillation in the solder wave during the passage of the element therethrough.
Preferably frequency of the oscillation and/or the amplitude of the oscillation are controlled and at least one vibrating zone is formed in the solder wave. In one embodiment the oscillation occurs in a direction substan-tially parallel to the path of the element and in anotherembodiment, the oscillation occurs in a direction substantially perpendicular to the path of the element.
There is also provided in the present invention an app3ratus for wave solder~ng surface unted devices and the like on a printed wiring board comprising means of forming a solder wave, means for moving the wiring board in a path so that the underside of the wiring board passes through the solder wave, and oscillation means to produce oscillations in the solder wave during the passage of the wiring board therethrough.
In one embodiment the oscillating means comprises at least one vibrating vane in the solder wave, and at least one connector rod connecting the vane to a vibrator means located away from the solder wave. In another ~ 4 --embodiment at least one vibrating vane is in the form of a flat strip and extends in the solder wave substantially perpendicular to the path of the wiring board, and the vibratory means oscillates the flat s-trip in a direction substantially parallel to the path of the wiring board. In a still further embodiment, a plurality of vibrating vanes are joined by a connector rod, and the vibrator means oscillates the vanes in a direction substantially perpendicular to the path of the wiring board. Means to control the frequency and/or amplitude of vibration are preferably provided with a frequency range of about 20 to 400 cycles per second, and an amplitude up to at least about 1.5 mm 10.060 ins.). Furthermore, the position o~ the vane in the solder wave is preferably adjustable. Means are also provided in one embodiment to optionally feed a surface additive such as oil to the solder wave.
In other embodiments, the solder wave is formed from a discharge nozzle facing upwards positioned above a solder reservoir with a pump means for forming the solder wave from the nozzleO A vibrating vane is in one embodiment positioned in the solder wave and at least two zones of vibration are formed.
- In another embodiment at least one adjustable passive vane is located in the solder wave downstream from the discharge nozzle at the element exit side, the position of the passive vane provides a further zone of vibration to aid in separation of the element such as a wiring board and the like from the solder wave.
At least one liquid surface additive feeding tube may be positioned downstream of the passive vane and means are provided to supply liquid surface additive through the feeding tube to the surface of the solder wave.
- s In drawings which illustrate embodiments of the invention:
Fig. 1 shows a cross section of a solder wave applied to the underside oE a wiring board illustrating one embodiment of a vibrating vane;
Fig. 2 shows a cross section of a solder wave illustrating another embodiment of a vibrating vane;
Fig. 3 shows a plan view of the vibrating vane shown in Fig. 2;
Fig. 4 shows a cross section of a solder wave illustrating yet another embodiment of a vibrating vane;
Fig. 5 shows a cross section of a solder wave illustrating a still further embodiment of a vibrating vane with a liquid surface additive feeding tube;
Fig. 6 shows a side isometric view of the vibrating vane shown in Fig. 5.
~ eferring now to the drawings r Fig. 1 and 2 illustrate cross sections through a typical solder wave nozzle 10 such as that shown in Canadian Patent 1,002,391 to Elliott et al. The nozzle 10 is connected to a solder supply conduit 11 by means of a flange 12. Solder enters the nozzle 10 and forms the desired shape of solder wave.
The solder flows back into a solder pot 13.
Above the solder pot 13 is a wiring board path 14 along which wiring boards 15 are conveyed. The drawings illustrate a straight inclined path 14, however, the present invention may be applied to solder wave machines with horizontal or curved paths. The printed wiring boards 15 have surface mounted devices 16 with pads and contacts 17 to be coated with solder and form soldered connections. The entry side of the nozzle 10 has a guide 20 to provide a downward sloping path for a portion of the solder. The exit solder wave flows to a weir plate 21.
Fig. 1 shows a vibrating vane 30 in the form of a flat strip positioned in the nozzle 10 extending along the length o~ the nozzle. The vane 30 has a top edge shown to be substan-tially the same height as the top edge of the nozzle 10. Alternatively, the top edge of the vane 30 may be below the to~ edge of the nozzle or higher than the top edge of the nozzle provided it is not so high as to interfere with passage of the assembly being soldered.
~ connecting rod 31 which in some nozzles may be two or more rods, pass through an aperture 32 in the exit side of the nozzle 10 to support the vane 30. The rods 31 connect to a vibrator 33 positioned away from the solder noz~le 10 above the solder pot 13. The exact position of the vibrator 33 as well as the rods 31 to the vane or vanes 30 may be varied. The vibrator may be located above or below the solder wave and is supported to ensure that vibration is transmitted to the vane 30. The frequency and/or amplitude of vibration is controllable by the vibrator 33. It is preferred to vibrate the solder wave a sufficient amount 50 that gas bubbles that form beneath the wiring board 15 are displaced or dislodged, allowing solder to reach component terminations and other hard to reach areas to be soldered~ Large gas bubbles may be bro~en into smaller ones and all the bubbles are continuously shifted allowing the solder to reach all areas. The vibration is also sufficient to cause the molten solder to be forced up on either side o~ the surface mounted devices overcoming the repelling effect o~ the non-metallized component bodies. The solder then wetS the metailic areas to be soldered, such as component terminations, pads etcetera or forms solder joints as required. The vibrating frequency together with the amplitude of vibration is adjustable to suit different types of wiring boards.
Figs 2 and 3 illustrate another embodiment wherein a series of short individual vanes 40 are positioned perpendicular to the length of the nozzle 10 and have a connecting rod 41 connecting all the vanes 40 together.
Wherein one rod 41 is shown, i-t would be apparent that two or more rods may be used if necessary. The rod 41 is supported at apertures 42 in the end plates 43 of the nozzle 10 and is connected to a vibrator 44 such that vibration occurs in a diffexent plane to tha-t shown in Fig. 1. Fig. 1 illustrates that vibrations or oscillations occur substantially parallel with the travel of the wiring board path 14, and Figs. 2 and 3 show that vibrations or oscillations occur substantially perpen-dicular to the travel of the wiring board path 14. The position of the vanes 40 in the nozzle 10 may be raised or lowered and the number of vanes 40 may depend on the particular type of wave soldering machine and the particular type of printed wiring boards being soldered.
The size, shape, quantity and angle of vanes can be varied as required. The vibrations or oscillations may be applied at any angle between the two directions shown in Figs. 1 and 2.
In the embodiment shown in Fig. 4 the vibrating vane 30 is connected to the vibrator 33 by one or more connecting rods 31. As shown in this figure, the top edge of the vibrating vane 30 protrudes slightly above the top edge of the nozzle 10. The top edge of the vane 30 must not interfere with the surface mounted devices on the wiring board 15. The position of the vibrating vane 30 is adjustable for optimizing the vibrating characteristics and soldering results. The wiring board path in Fig. 4 has a slope of 6 upwards in the direction of travel. The slope angle of the path may vary from about 0 to 10 dependent upon the type of solder machine.
In the embodiment shown in Figs. 4 and 5, two ~,f~3~3~
solder wave vibrating zones 50 and 51 are sho~n, one on each side of the vibrating vane 30 under the wiring board 15.
These zones 50 and 51 allow the solder to reach all the areas requiring solder wetting. A further zone or zones of vibration 52 is formed by using a passive vane 53 on the exit side of the nozzle 10 before the weir plate 21. The passive vane 53 may be located at the most suitable position avoiding the components on the printed wiring board 15, and the further vibration zone 52 preferably occurs between the nozzle and the weir. In one embodiment the further vibration zone occurs at the point or close to the point of separation of the board 15 from the solder wave.
This further vibration applied to the board and solder wave in the further zone 52 reduces the possibilities of bridges occurring between contacts or pads. The passive vane 53 also has a damping effect on the solder located between the weir 21 and the passive vane 53. The U-shaped passive vane 53 shown in the drawing may be located at different positions in the exit trough 54 to vary the position of the further zone 52.
Figs. 5 and 6 show a modification to the apparatus shown in Fig. 4 wherein a ~eeding tube 55 for a surface additive such as oil, is positioned adjacent to the weir 21 which allows an oil reservoir 56 to be formed between the tube 55 and the surface of the solder. ~ thin coating of oil or other surface additive is created on the surface of the sol~er wave that reduces surface tension and at the same time reduces dross formation on the wave surface.
Whereas several embodiments of vanes have been shown herein~ it will be understood that the vanes need not necessarily be located in the nozzle itself, but may be positioned in the solder stream between the nozzle exit and the Weir 21. The vane may be positiorled on ~he input side of the solder wave indicated as zone 50 in Figs. 4 and 5. There are no random parameters in the vibratory wave because the frequency of oscillation and amplitude of oscillation are precisely controlled. The shape or form of the vanes may be varied in order to apply vibration at a suitable location in the solder wave.
The suitable location being one which displaces or dis-lodges gas bubbles from underneath the wiring board, and allows solder to reach all areas to be soldered. In one embodiment the vibrator can produce a frequency in the range of 20 to 400 cycles per second and can also vary the amplitude of vibration up to at least about 1.5 mm (0.060 inches). Higher frequencies can also be used. By utilizing the vibrating device with a streamline solder wave, it has been found that the quality of soldering on wiring boards is at least as good as the two solder wave type of solder machine.
Various changes may be made -to the embodiments shown herein without departing from the scope of the present invention which is limited only by the following claims.
PRINTED ~TIRING BOARDS
. . _ .
The present invention relates to wave soldering of printed wiring boards. More specifically, the present invention relates to wave solderin~ of surface mounted devices or components on printecl wiring boards as well as standard components on single sided, double sided and/or multi-layer boards.
New technologies in the electronic component industry have introduced surface mounted devices such as resistors, capacitors, integrated circuits and the like, in the form of chip components. These components are mounted usually with an adhesive to the bottom side of a printed wirin~ board. These conditions present new problems for existing soldering processes.
The present methods of wave soldering surface mounted devices on printed wiring boards include systems having two solder waves. The first solder wave typically has a narrow turbulent parabolic shape. The narrow wave contacts a small area on the wiring board allowing gases -to escape.
The gases are generated by flux volatiles and the like, which can inhibit solder wetting. The narrow wave also provides a vertical pressure to force solder into the small spaces and openings be-tween the components to ensure that all circuit pads, components, terrninations, contacts, and the like, are wetted with solder.
The second solder wave is typically a solder wave as used in commercially available machines for soldering printed wiring boards with leaded components-and the like.
The second wave completes the process and provides optimum exit conditions ~or the printed wiring boards leaving the solder wave to minimize or eliminate excess solder deposits and eliminate bridges between contacts.
The dual solder wave process has proven to be ~ ;~3~
effective for soldering surface mounted devices onto printed wiring boards, but the process suffers from certain d~sadvantages. One problem is excessive dross (oxide) production. Dual wave systems typically produce up to twice as much dross as single wave systems. Another problem is the lack of fine control of a turbulent para-bolic solder wave. Best soldering results have been obtained by immersing the printed wiring board as deeply as possible in this wave. However, the turbulence of the wave makes this task di~ficult and may result in ,solder flooding onto the top side of the printed wiring boards.
It is one purpose o~ the present invention to provide an apparatus and a process for wave soldering elements such as printed wiring boards with surface mounted devices that overcome the above mentioned problems. It is a further aim of the present invention to provide a controllable vibration or oscillation to a solder wave as opposed to random turbulence. The term 'vibration'' and ''oscillation'' used throughout the specification and claims refer to frequencies below about 20 KHz.
The present invention provides a process and an apparatus ~or wave soldering elements such as surface mounted devices on a printed wiring board wherein a solder wave is subjected to an oscillation or vibration during the passage of a printed wiring board therethrough. The oscillation or vibration aids in filling small holes in a board, crevices, coxners adjacent to solder masks and all other areas where solder wetting is di~ficult to achieve with conventional machines. An additional benefit is overcoming problems that occur with thick dry film solder mask. A relatively high frequency oscillation in the solder wave displaces or dislodges gas bubbles that form beneath the boards~ allowing the solder to reach all areas ~1 ~3~
in the matrix of components on the printed wiring boards, overcoming the repelling effect of any non-metallized elements such as component bcdies, solder masks and the like.
Furthermore the vibrating or oscillating concept of the present invention can be applied to existing types of solder wave machines for wave soldering, either as a permanent installation or a temporary installation for soldering certain difficult to solder elements.
The present invention provides a process for wave soldering an element comprising the steps of: moving the element in a pre-determined path, forming a solder wave beneath the path so that at least a portion of the element passes through the solder wave, and producing an oscillation in the solder wave during the passage of the element therethrough.
Preferably frequency of the oscillation and/or the amplitude of the oscillation are controlled and at least one vibrating zone is formed in the solder wave. In one embodiment the oscillation occurs in a direction substan-tially parallel to the path of the element and in anotherembodiment, the oscillation occurs in a direction substantially perpendicular to the path of the element.
There is also provided in the present invention an app3ratus for wave solder~ng surface unted devices and the like on a printed wiring board comprising means of forming a solder wave, means for moving the wiring board in a path so that the underside of the wiring board passes through the solder wave, and oscillation means to produce oscillations in the solder wave during the passage of the wiring board therethrough.
In one embodiment the oscillating means comprises at least one vibrating vane in the solder wave, and at least one connector rod connecting the vane to a vibrator means located away from the solder wave. In another ~ 4 --embodiment at least one vibrating vane is in the form of a flat strip and extends in the solder wave substantially perpendicular to the path of the wiring board, and the vibratory means oscillates the flat s-trip in a direction substantially parallel to the path of the wiring board. In a still further embodiment, a plurality of vibrating vanes are joined by a connector rod, and the vibrator means oscillates the vanes in a direction substantially perpendicular to the path of the wiring board. Means to control the frequency and/or amplitude of vibration are preferably provided with a frequency range of about 20 to 400 cycles per second, and an amplitude up to at least about 1.5 mm 10.060 ins.). Furthermore, the position o~ the vane in the solder wave is preferably adjustable. Means are also provided in one embodiment to optionally feed a surface additive such as oil to the solder wave.
In other embodiments, the solder wave is formed from a discharge nozzle facing upwards positioned above a solder reservoir with a pump means for forming the solder wave from the nozzleO A vibrating vane is in one embodiment positioned in the solder wave and at least two zones of vibration are formed.
- In another embodiment at least one adjustable passive vane is located in the solder wave downstream from the discharge nozzle at the element exit side, the position of the passive vane provides a further zone of vibration to aid in separation of the element such as a wiring board and the like from the solder wave.
At least one liquid surface additive feeding tube may be positioned downstream of the passive vane and means are provided to supply liquid surface additive through the feeding tube to the surface of the solder wave.
- s In drawings which illustrate embodiments of the invention:
Fig. 1 shows a cross section of a solder wave applied to the underside oE a wiring board illustrating one embodiment of a vibrating vane;
Fig. 2 shows a cross section of a solder wave illustrating another embodiment of a vibrating vane;
Fig. 3 shows a plan view of the vibrating vane shown in Fig. 2;
Fig. 4 shows a cross section of a solder wave illustrating yet another embodiment of a vibrating vane;
Fig. 5 shows a cross section of a solder wave illustrating a still further embodiment of a vibrating vane with a liquid surface additive feeding tube;
Fig. 6 shows a side isometric view of the vibrating vane shown in Fig. 5.
~ eferring now to the drawings r Fig. 1 and 2 illustrate cross sections through a typical solder wave nozzle 10 such as that shown in Canadian Patent 1,002,391 to Elliott et al. The nozzle 10 is connected to a solder supply conduit 11 by means of a flange 12. Solder enters the nozzle 10 and forms the desired shape of solder wave.
The solder flows back into a solder pot 13.
Above the solder pot 13 is a wiring board path 14 along which wiring boards 15 are conveyed. The drawings illustrate a straight inclined path 14, however, the present invention may be applied to solder wave machines with horizontal or curved paths. The printed wiring boards 15 have surface mounted devices 16 with pads and contacts 17 to be coated with solder and form soldered connections. The entry side of the nozzle 10 has a guide 20 to provide a downward sloping path for a portion of the solder. The exit solder wave flows to a weir plate 21.
Fig. 1 shows a vibrating vane 30 in the form of a flat strip positioned in the nozzle 10 extending along the length o~ the nozzle. The vane 30 has a top edge shown to be substan-tially the same height as the top edge of the nozzle 10. Alternatively, the top edge of the vane 30 may be below the to~ edge of the nozzle or higher than the top edge of the nozzle provided it is not so high as to interfere with passage of the assembly being soldered.
~ connecting rod 31 which in some nozzles may be two or more rods, pass through an aperture 32 in the exit side of the nozzle 10 to support the vane 30. The rods 31 connect to a vibrator 33 positioned away from the solder noz~le 10 above the solder pot 13. The exact position of the vibrator 33 as well as the rods 31 to the vane or vanes 30 may be varied. The vibrator may be located above or below the solder wave and is supported to ensure that vibration is transmitted to the vane 30. The frequency and/or amplitude of vibration is controllable by the vibrator 33. It is preferred to vibrate the solder wave a sufficient amount 50 that gas bubbles that form beneath the wiring board 15 are displaced or dislodged, allowing solder to reach component terminations and other hard to reach areas to be soldered~ Large gas bubbles may be bro~en into smaller ones and all the bubbles are continuously shifted allowing the solder to reach all areas. The vibration is also sufficient to cause the molten solder to be forced up on either side o~ the surface mounted devices overcoming the repelling effect o~ the non-metallized component bodies. The solder then wetS the metailic areas to be soldered, such as component terminations, pads etcetera or forms solder joints as required. The vibrating frequency together with the amplitude of vibration is adjustable to suit different types of wiring boards.
Figs 2 and 3 illustrate another embodiment wherein a series of short individual vanes 40 are positioned perpendicular to the length of the nozzle 10 and have a connecting rod 41 connecting all the vanes 40 together.
Wherein one rod 41 is shown, i-t would be apparent that two or more rods may be used if necessary. The rod 41 is supported at apertures 42 in the end plates 43 of the nozzle 10 and is connected to a vibrator 44 such that vibration occurs in a diffexent plane to tha-t shown in Fig. 1. Fig. 1 illustrates that vibrations or oscillations occur substantially parallel with the travel of the wiring board path 14, and Figs. 2 and 3 show that vibrations or oscillations occur substantially perpen-dicular to the travel of the wiring board path 14. The position of the vanes 40 in the nozzle 10 may be raised or lowered and the number of vanes 40 may depend on the particular type of wave soldering machine and the particular type of printed wiring boards being soldered.
The size, shape, quantity and angle of vanes can be varied as required. The vibrations or oscillations may be applied at any angle between the two directions shown in Figs. 1 and 2.
In the embodiment shown in Fig. 4 the vibrating vane 30 is connected to the vibrator 33 by one or more connecting rods 31. As shown in this figure, the top edge of the vibrating vane 30 protrudes slightly above the top edge of the nozzle 10. The top edge of the vane 30 must not interfere with the surface mounted devices on the wiring board 15. The position of the vibrating vane 30 is adjustable for optimizing the vibrating characteristics and soldering results. The wiring board path in Fig. 4 has a slope of 6 upwards in the direction of travel. The slope angle of the path may vary from about 0 to 10 dependent upon the type of solder machine.
In the embodiment shown in Figs. 4 and 5, two ~,f~3~3~
solder wave vibrating zones 50 and 51 are sho~n, one on each side of the vibrating vane 30 under the wiring board 15.
These zones 50 and 51 allow the solder to reach all the areas requiring solder wetting. A further zone or zones of vibration 52 is formed by using a passive vane 53 on the exit side of the nozzle 10 before the weir plate 21. The passive vane 53 may be located at the most suitable position avoiding the components on the printed wiring board 15, and the further vibration zone 52 preferably occurs between the nozzle and the weir. In one embodiment the further vibration zone occurs at the point or close to the point of separation of the board 15 from the solder wave.
This further vibration applied to the board and solder wave in the further zone 52 reduces the possibilities of bridges occurring between contacts or pads. The passive vane 53 also has a damping effect on the solder located between the weir 21 and the passive vane 53. The U-shaped passive vane 53 shown in the drawing may be located at different positions in the exit trough 54 to vary the position of the further zone 52.
Figs. 5 and 6 show a modification to the apparatus shown in Fig. 4 wherein a ~eeding tube 55 for a surface additive such as oil, is positioned adjacent to the weir 21 which allows an oil reservoir 56 to be formed between the tube 55 and the surface of the solder. ~ thin coating of oil or other surface additive is created on the surface of the sol~er wave that reduces surface tension and at the same time reduces dross formation on the wave surface.
Whereas several embodiments of vanes have been shown herein~ it will be understood that the vanes need not necessarily be located in the nozzle itself, but may be positioned in the solder stream between the nozzle exit and the Weir 21. The vane may be positiorled on ~he input side of the solder wave indicated as zone 50 in Figs. 4 and 5. There are no random parameters in the vibratory wave because the frequency of oscillation and amplitude of oscillation are precisely controlled. The shape or form of the vanes may be varied in order to apply vibration at a suitable location in the solder wave.
The suitable location being one which displaces or dis-lodges gas bubbles from underneath the wiring board, and allows solder to reach all areas to be soldered. In one embodiment the vibrator can produce a frequency in the range of 20 to 400 cycles per second and can also vary the amplitude of vibration up to at least about 1.5 mm (0.060 inches). Higher frequencies can also be used. By utilizing the vibrating device with a streamline solder wave, it has been found that the quality of soldering on wiring boards is at least as good as the two solder wave type of solder machine.
Various changes may be made -to the embodiments shown herein without departing from the scope of the present invention which is limited only by the following claims.
Claims (31)
1. Process for wave soldering a prefluxed element comprising the steps of:
moving the element in a predetermined path;
forming a solder wave having a predetermined configuration beneath the path, so that at least a portion of the element passes through the solder wave;
and, producing an oscillation in the solder wave in the range of about 20 to 400 Hz during the passage of the element therethrough, the oscillation not substantially changing the predetermined configuration of the solder wave.
moving the element in a predetermined path;
forming a solder wave having a predetermined configuration beneath the path, so that at least a portion of the element passes through the solder wave;
and, producing an oscillation in the solder wave in the range of about 20 to 400 Hz during the passage of the element therethrough, the oscillation not substantially changing the predetermined configuration of the solder wave.
2. Process for wave soldering surface mounted devices to a prefluxed printed wiring board or assembly comprising the steps of:
moving the wiring board in a predetermined path;
forming a solder wave having a predetermined configuration beneath the path so that the underside of the wiring board passes through the solder wave;
and, producing an oscillation in the solder wave in the range of about 20 to 400 Hz during the passage of the wiring board therethrough, the oscillation not substantially changing the predetermined configuration of the solder wave.
moving the wiring board in a predetermined path;
forming a solder wave having a predetermined configuration beneath the path so that the underside of the wiring board passes through the solder wave;
and, producing an oscillation in the solder wave in the range of about 20 to 400 Hz during the passage of the wiring board therethrough, the oscillation not substantially changing the predetermined configuration of the solder wave.
3. The process according to Claim 1 or Claim 2 wherein frequency of the oscillation is controllable.
4. The process according to Claim 1 or Claim 2 wherein amplitude of the oscillation is controllable.
5. The process according to Claim 1 or Claim 2 wherein at least one vibrating zone is formed in the solder wave.
6. The process according to Claim 1 or Claim 2 wherein a plurality of vibrating zones are formed in the solder wave.
7. The process according to Claim 1 or Claim 2 wherein the oscillation occurs in a direction substantially parallel to the path of the element.
8. The process according to Claim 1 or Claim 2 wherein the oscillation occurs in a direction substantially perpendicular to the path of the element.
9. The process according to Claim 1 or Claim 2 including application of a surface additive to the surface of the solder wave.
10. An apparatus for wave soldering a prefluxed element comprising:
means for forming a solder wave having a predetermined configuration;
means for moving the element in a path so that at least a portion of the element passes through the solder wave; and, oscillating means to produce oscillation in the solder wave in the range of about 20 to 400 Hz during the passage of the element therethrough, the oscillations not substantially changing the predetermined configuration of the solder wave.
means for forming a solder wave having a predetermined configuration;
means for moving the element in a path so that at least a portion of the element passes through the solder wave; and, oscillating means to produce oscillation in the solder wave in the range of about 20 to 400 Hz during the passage of the element therethrough, the oscillations not substantially changing the predetermined configuration of the solder wave.
11. An apparatus for wave soldering surface mounted devices to a prefluxed printed wiring board or assembly comprising:
means of forming a solder wave having a predetermined configuration;
means for moving the wiring board in a path so the underside of the wiring board passes through the solder wave; and, oscillating means to produce oscillations in the solder wave in the range of about 20 to 400 Hz during the passage of the wiring board therethrough, the oscillations not substantially changing the predetermined configuration of the solder wave.
means of forming a solder wave having a predetermined configuration;
means for moving the wiring board in a path so the underside of the wiring board passes through the solder wave; and, oscillating means to produce oscillations in the solder wave in the range of about 20 to 400 Hz during the passage of the wiring board therethrough, the oscillations not substantially changing the predetermined configuration of the solder wave.
12. The apparatus according to Claim 10 wherein the oscillating means comprises at least one vibrating vane in the solder wave, and at least one connector rod connecting the vane to a vibrator means located away from the solder wave.
13. The apparatus according to Claim 12 wherein at least one vibrating vane in the form of a flat strip extends in the solder wave substantially perpendicular to the path of the element, and the vibrator means oscillates the flat strip in a direction substantially parallel to the path of the element.
14. The apparatus according to Claim 12 wherein a plurality of vibrating vanes are joined by a connector rod, and the vibrator means oscillates the vanes in a direction substantially perpendicular to the path of the element.
15. The apparatus according to Claim 11 wherein the oscillating means includes a vibrator means and controllable means for frequency of vibration from the vibrator means.
16. The apparatus according to Claim 15 wherein the frequency can be varied in the range of about 20 to 400 cycles per second.
17. The apparatus according to Claim 11 wherein the oscillating means includes a vibrator means and controllable means for amplitude of vibration from the vibrator means.
18. The apparatus according to Claim 17 wherein the amplitude is controlled up to at least about 1.5 mm (0.060 ins).
19. The apparatus according to Claim 12 wherein the position of at least one vibrating vane in the solder wave is adjustable.
20. The apparatus according to Claim 10 or Claim 11 including means to feed a surface additive to the solder wave.
21. An apparatus for wave soldering surface mounted devices to a prefluxed printed wiring board or assembly comprising:
a reservoir adapted to contain molten solder;
a discharge nozzle facing upwards positioned above the reservoir;
pump means for forming a solder wave having a predetermined configuration from the nozzle;
means for moving the wiring board in a path so the underside of the wiring board passes through the solder wave; and, oscillating means to produce oscillations in the solder wave during the passage of the wiring board therethrough, the oscillations not substantially changing the predetermined configuration of the solder wave.
a reservoir adapted to contain molten solder;
a discharge nozzle facing upwards positioned above the reservoir;
pump means for forming a solder wave having a predetermined configuration from the nozzle;
means for moving the wiring board in a path so the underside of the wiring board passes through the solder wave; and, oscillating means to produce oscillations in the solder wave during the passage of the wiring board therethrough, the oscillations not substantially changing the predetermined configuration of the solder wave.
22. The apparatus according to Claim 21 wherein the oscillating means comprises at least one vibrating vane in the form of a flat strip extending in the discharge nozzle substantially perpendicular to the path of the wiring board, at least one connector rod connecting the vane to a vibrator means, the connecting rod extending in a direction substantially parallel with the path of the wiring board, and the vibrator means oscillating the vane in a direction substantially parallel to the path of the wiring board.
23. The apparatus according to Claim 22 wherein at least two zones of vibration are formed in the solder wave, one zone on each side of the vane.
24. The apparatus according to Claim 23 wherein at least one passive element is located in the solder wave downstream from the discharge nozzle at the wiring board exit side, the position of the passive element providing a further zone of vibration to aid in separation of the wiring board from the solder wave.
25. The apparatus according to Claim 24 including at least one liquid surface additive feeding tube positioned downstream of the passive element, and means to supply liquid surface additive through the feeding tube to the surface of the solder wave.
26. An apparatus for applying solder to prefluxed exposed metallic surfaces and prefluxed protruding metallic surfaces on one face of a circuit board or the like comprising:
a reservoir adapted to contain solder at a predetermined level;
a discharge nozzle facing upwards positioned above the solder level in the reservoir and having a circuit board entry side and a circuit board exit side;
means for forming a solder wave having a predetermined configuration from the nozzle, the wave contacting the lower face of the circuit board and being higher than any protruding metallic surfaces;
an upward sloping circuit board path above the reservoir passing over the nozzle;
means for moving a circuit board up the path at a predetermined speed from the entry side to the exit side of the nozzle;
the nozzle adapted to permit a greater volumetric portion of the solder wave to flow downwards at the entry side, the entry side of the nozzle having a contoured downwards sloping guide adapted to return the solder to the reservoir in a smooth flow;
the exit side of the nozzle having a substantially rectangular tray attached thereto with an adjustable weir at the edge of the tray parallel to the exit side of the nozzle, the shape of the tray together with the weir adapted to reduce feedback of flow disturbances on the solder wave, and guide the remaining volumetric portion of the solder wave in a smooth horizontal or downward sloping stream in substantially the same direction at approximately the same speed as the circuit board moving up the path, and, oscillating means to produce oscillations in the solder wave in the range of about 20 to 400 Hz during the passage of the circuit board therethrough, the oscillations not substantially changing the predetermined configuration of the solder wave.
a reservoir adapted to contain solder at a predetermined level;
a discharge nozzle facing upwards positioned above the solder level in the reservoir and having a circuit board entry side and a circuit board exit side;
means for forming a solder wave having a predetermined configuration from the nozzle, the wave contacting the lower face of the circuit board and being higher than any protruding metallic surfaces;
an upward sloping circuit board path above the reservoir passing over the nozzle;
means for moving a circuit board up the path at a predetermined speed from the entry side to the exit side of the nozzle;
the nozzle adapted to permit a greater volumetric portion of the solder wave to flow downwards at the entry side, the entry side of the nozzle having a contoured downwards sloping guide adapted to return the solder to the reservoir in a smooth flow;
the exit side of the nozzle having a substantially rectangular tray attached thereto with an adjustable weir at the edge of the tray parallel to the exit side of the nozzle, the shape of the tray together with the weir adapted to reduce feedback of flow disturbances on the solder wave, and guide the remaining volumetric portion of the solder wave in a smooth horizontal or downward sloping stream in substantially the same direction at approximately the same speed as the circuit board moving up the path, and, oscillating means to produce oscillations in the solder wave in the range of about 20 to 400 Hz during the passage of the circuit board therethrough, the oscillations not substantially changing the predetermined configuration of the solder wave.
27. The apparatus according to Claim 26 wherein a solder receiving section is provided at the circuit board entry side between the nozzle and the solder level of the reservoir r the section having an adjustable guide means for varying the cross sectional area of the section between the adjustable guide means and the contoured downward sloping guide.
28. The apparatus according to Claim 26 wherein the discharge nozzle has a vertical wall on the circuit board entry side and an inward sloping wall at the exit side.
29. The apparatus according to Claim 26 wherein the adjustable weir at the edge of the tray parallel to the exit side of the nozzle has an inward slope towards the discharge nozzle of a maximum of 15° to the vertical.
30. The apparatus according to Claim 26 including a deflector plate mounted beneath the adjustable weir adapted to guide solder to the reservoir.
31. The apparatus according to Claim 26 including at least one drain hole in the rectangular tray adjacent the nozzle.
Priority Applications (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/830,962 US4684056A (en) | 1985-05-03 | 1986-02-19 | Vibratory wave soldering |
| DE8686301258T DE3676111D1 (en) | 1985-05-03 | 1986-02-21 | VIBRANT SWALLOWING. |
| EP86301258A EP0201158B1 (en) | 1985-05-03 | 1986-02-21 | Vibratory wave soldering |
| AU56745/86A AU580236B2 (en) | 1985-05-03 | 1986-04-24 | Vibratory wave soldering |
| NZ215973A NZ215973A (en) | 1985-05-03 | 1986-04-28 | Wave soldering using wave vibrations |
| KR1019860003458A KR900006977B1 (en) | 1985-05-03 | 1986-05-02 | Vibratory wave soldering of printed wiring boards |
| CN86103013.3A CN1003975B (en) | 1985-05-03 | 1986-05-02 | Vibratory wave soldering of printed wiring boards |
| BR8601972A BR8601972A (en) | 1985-05-03 | 1986-05-02 | WAVE WELDING PROCESS AND APPLIANCE |
| MYPI87001369A MY100436A (en) | 1985-05-03 | 1987-08-18 | Vibratory wave soldering. |
| US07/182,479 USRE33197E (en) | 1985-05-03 | 1988-04-15 | Vibrator wave soldering |
| SG361/91A SG36191G (en) | 1985-05-03 | 1991-05-13 | Vibratory wave soldering |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8511280 | 1985-05-03 | ||
| GB858511280A GB8511280D0 (en) | 1985-05-03 | 1985-05-03 | Vibratory wave soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1230426A true CA1230426A (en) | 1987-12-15 |
Family
ID=10578602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000494984A Expired CA1230426A (en) | 1985-05-03 | 1985-11-08 | Vibratory wave soldering of printed wiring boards |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS61255095A (en) |
| KR (1) | KR900006977B1 (en) |
| CA (1) | CA1230426A (en) |
| GB (1) | GB8511280D0 (en) |
| IN (1) | IN167401B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019065511A1 (en) * | 2017-09-29 | 2019-04-04 | ダイキン工業株式会社 | Soldering device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5340578A (en) * | 1976-09-27 | 1978-04-13 | Hitachi Ltd | Analyzer for charged particle ray.s energy |
| JPS5828892A (en) * | 1981-08-12 | 1983-02-19 | 千住金属工業株式会社 | Method and device for soldering printed board |
| JPS59178169A (en) * | 1983-03-25 | 1984-10-09 | Osaka Asahi Kagaku Kk | Soldering device |
-
1985
- 1985-05-03 GB GB858511280A patent/GB8511280D0/en active Pending
- 1985-11-08 CA CA000494984A patent/CA1230426A/en not_active Expired
-
1986
- 1986-02-18 JP JP61034946A patent/JPS61255095A/en active Pending
- 1986-04-23 IN IN308/MAS/86A patent/IN167401B/en unknown
- 1986-05-02 KR KR1019860003458A patent/KR900006977B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| IN167401B (en) | 1990-10-20 |
| KR870005567A (en) | 1987-06-09 |
| JPS61255095A (en) | 1986-11-12 |
| GB8511280D0 (en) | 1985-06-12 |
| KR900006977B1 (en) | 1990-09-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |