IN167401B - - Google Patents

Info

Publication number
IN167401B
IN167401B IN308/MAS/86A IN308MA1986A IN167401B IN 167401 B IN167401 B IN 167401B IN 308MA1986 A IN308MA1986 A IN 308MA1986A IN 167401 B IN167401 B IN 167401B
Authority
IN
India
Application number
IN308/MAS/86A
Inventor
A Deambrosio Carlos
Original Assignee
Electrovert Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrovert Ltd filed Critical Electrovert Ltd
Publication of IN167401B publication Critical patent/IN167401B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0661—Oscillating baths
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
IN308/MAS/86A 1985-05-03 1986-04-23 IN167401B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB858511280A GB8511280D0 (en) 1985-05-03 1985-05-03 Vibratory wave soldering

Publications (1)

Publication Number Publication Date
IN167401B true IN167401B (en) 1990-10-20

Family

ID=10578602

Family Applications (1)

Application Number Title Priority Date Filing Date
IN308/MAS/86A IN167401B (en) 1985-05-03 1986-04-23

Country Status (5)

Country Link
JP (1) JPS61255095A (en)
KR (1) KR900006977B1 (en)
CA (1) CA1230426A (en)
GB (1) GB8511280D0 (en)
IN (1) IN167401B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6465244B1 (en) * 2017-09-29 2019-02-06 ダイキン工業株式会社 Soldering equipment

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5340578A (en) * 1976-09-27 1978-04-13 Hitachi Ltd Analyzer for charged particle ray.s energy
JPS5828892A (en) * 1981-08-12 1983-02-19 千住金属工業株式会社 Method and device for soldering printed board
JPS59178169A (en) * 1983-03-25 1984-10-09 Osaka Asahi Kagaku Kk Soldering device

Also Published As

Publication number Publication date
JPS61255095A (en) 1986-11-12
GB8511280D0 (en) 1985-06-12
KR900006977B1 (en) 1990-09-25
CA1230426A (en) 1987-12-15
KR870005567A (en) 1987-06-09

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