JPS59185062U - jet solder bath - Google Patents
jet solder bathInfo
- Publication number
- JPS59185062U JPS59185062U JP7827583U JP7827583U JPS59185062U JP S59185062 U JPS59185062 U JP S59185062U JP 7827583 U JP7827583 U JP 7827583U JP 7827583 U JP7827583 U JP 7827583U JP S59185062 U JPS59185062 U JP S59185062U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- solder bath
- jet solder
- plate
- reservoir
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案噴流はんだ槽の平面図、第２図は第１図
■−■線断面拡大図である。
１・・・・・・はんだ槽、２・・・・・・ノズル、３，
４・・・・・・ノ゛ズル板、５・・・・・・側板、６・
・・・・・はんだ溜め、７．８・・・・・・整流板。FIG. 1 is a plan view of the jet solder bath of the present invention, and FIG. 2 is an enlarged cross-sectional view taken along the line ■--■ in FIG. 1...Solder bath, 2...Nozzle, 3,
4... Nozzle plate, 5... Side plate, 6...
・・・Solder reservoir, 7.8 ・・・Rectifier plate.
Claims (1)
し、またプリント基板退出側のノズルは前記進入側のノ
ズル板よりも高さを低くするとともにその先端にはんだ
溜めを設け、更に該はんだ溜めの上部に溶融はんだの流
速を緩やかにする整流板を設置したことを特徴とする噴
流はんだ槽。A steeply sloped rectifier plate is installed on the nozzle plate on the printed circuit board entry side, and the height of the nozzle on the printed board exit side is lower than that of the nozzle plate on the entry side, and a solder reservoir is provided at the tip of the nozzle. A jet solder bath characterized by having a rectifier plate installed above the reservoir to slow down the flow velocity of molten solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7827583U JPS59185062U (en) | 1983-05-26 | 1983-05-26 | jet solder bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7827583U JPS59185062U (en) | 1983-05-26 | 1983-05-26 | jet solder bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59185062U true JPS59185062U (en) | 1984-12-08 |
Family
ID=30208278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7827583U Pending JPS59185062U (en) | 1983-05-26 | 1983-05-26 | jet solder bath |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59185062U (en) |
-
1983
- 1983-05-26 JP JP7827583U patent/JPS59185062U/en active Pending
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