JPS647561A - Optical sensor package - Google Patents

Optical sensor package

Info

Publication number
JPS647561A
JPS647561A JP62161866A JP16186687A JPS647561A JP S647561 A JPS647561 A JP S647561A JP 62161866 A JP62161866 A JP 62161866A JP 16186687 A JP16186687 A JP 16186687A JP S647561 A JPS647561 A JP S647561A
Authority
JP
Japan
Prior art keywords
optical sensor
solid
state optical
bonding
reservior
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62161866A
Other languages
Japanese (ja)
Other versions
JPH0748532B2 (en
Inventor
Shigeru Toyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62161866A priority Critical patent/JPH0748532B2/en
Publication of JPS647561A publication Critical patent/JPS647561A/en
Publication of JPH0748532B2 publication Critical patent/JPH0748532B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

PURPOSE:To contrive to make the title package smaller in size by a method wherein a solid-state optical sensor of a rear irradiation type of which wiring is performed from the surface through bonding is mounted, where any structural element is not provided between the rear of the solid-state optical sensor and a light emitting body to support the solid-state optical sensor, which is supported by the part adjacent to the photodetecting region of the solid-state optical sensor surface through the intermediary of a bonding agent. CONSTITUTION:A frame-shaped insulator with a hole larger than a solid-state optical sensor at its center, which has a recessed part 5 formed around the central hole 4 and lower than the peripheral part, is provided as a basic component and bonding pads 6 are built on the flat part of the recessed part 5. A main part 1 with conductors 7 which are electrically connected with the bonding pads 6 and extend out of the insulator passing through it and an interim supporting part 2, which is parallel plate- shaped, with vent holes 8 provided at the part which is not covered with the solid-state optical sensor when it is temporarily bonded are provided. Moreover, a base part 3 is provided which is a parallel plate, formed of the same material as the main part 1, and provided with a bonding agent reservior 10 on the central part of its one surface and vent holes 9 formed around the reservior 10. By these processes, miniaturization can be contrived.
JP62161866A 1987-06-29 1987-06-29 Optical sensor package Expired - Lifetime JPH0748532B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62161866A JPH0748532B2 (en) 1987-06-29 1987-06-29 Optical sensor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62161866A JPH0748532B2 (en) 1987-06-29 1987-06-29 Optical sensor package

Publications (2)

Publication Number Publication Date
JPS647561A true JPS647561A (en) 1989-01-11
JPH0748532B2 JPH0748532B2 (en) 1995-05-24

Family

ID=15743450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62161866A Expired - Lifetime JPH0748532B2 (en) 1987-06-29 1987-06-29 Optical sensor package

Country Status (1)

Country Link
JP (1) JPH0748532B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004093195A1 (en) * 2003-04-16 2004-10-28 Hamamatsu Photonics K.K. Method for manufacturing backside-illuminated optical sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004093195A1 (en) * 2003-04-16 2004-10-28 Hamamatsu Photonics K.K. Method for manufacturing backside-illuminated optical sensor

Also Published As

Publication number Publication date
JPH0748532B2 (en) 1995-05-24

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