JPS6424606A - High frequency module - Google Patents

High frequency module

Info

Publication number
JPS6424606A
JPS6424606A JP18200387A JP18200387A JPS6424606A JP S6424606 A JPS6424606 A JP S6424606A JP 18200387 A JP18200387 A JP 18200387A JP 18200387 A JP18200387 A JP 18200387A JP S6424606 A JPS6424606 A JP S6424606A
Authority
JP
Japan
Prior art keywords
module
connection
base
mounting
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18200387A
Other languages
Japanese (ja)
Inventor
Osamu Osawa
Kunio Arakawa
Izumi Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP18200387A priority Critical patent/JPS6424606A/en
Publication of JPS6424606A publication Critical patent/JPS6424606A/en
Pending legal-status Critical Current

Links

Landscapes

  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)

Abstract

PURPOSE:To decrease the connection resistance with small size and excellent mounting performance by providing a conductive layer for connecting inner and outer connection connected electrically via a connection part to the front and rear side of a module base in a high frequency module with an oscillation circuit mounted on the module base. CONSTITUTION:The mount base 11 is provided with six conductive lines 12 in total connected to each conductive layer 5 for external connection on its surface and with a conductive line connected to a conductive layer 6 for external connection. A module 1 is mounted flat onto the mounting base 11 so as to mate the conductive layers 5, 6 respectively to conductive lines 10, 11 and the border is soldered directly. Since no external connection member is required as a result, the size of the module 1 is made small to improve the mounting performance. Moreover, since the module 1 is mounted flat onto the mounting base 11, the mounting is made stable. Furthermore, the connection path is very short, the connection resistance is reduced and the noise characteristic is improved.
JP18200387A 1987-07-21 1987-07-21 High frequency module Pending JPS6424606A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18200387A JPS6424606A (en) 1987-07-21 1987-07-21 High frequency module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18200387A JPS6424606A (en) 1987-07-21 1987-07-21 High frequency module

Publications (1)

Publication Number Publication Date
JPS6424606A true JPS6424606A (en) 1989-01-26

Family

ID=16110621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18200387A Pending JPS6424606A (en) 1987-07-21 1987-07-21 High frequency module

Country Status (1)

Country Link
JP (1) JPS6424606A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006347434A (en) * 2005-06-17 2006-12-28 Hino Motors Ltd Vehicle height lock device
JP2008213690A (en) * 2007-03-06 2008-09-18 Nissan Diesel Motor Co Ltd Suspension device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006347434A (en) * 2005-06-17 2006-12-28 Hino Motors Ltd Vehicle height lock device
JP2008213690A (en) * 2007-03-06 2008-09-18 Nissan Diesel Motor Co Ltd Suspension device

Similar Documents

Publication Publication Date Title
CA2115553A1 (en) Plated compliant lead
JPS6437032A (en) Bendable lead frame assembly of integrated circuit and integrated circuit package
MY121435A (en) Surface mounting part
EP0301863A3 (en) Socket and connection system
EP0307844A3 (en) Semiconductor integrated circuit having interconnection with improved design flexibility
JPS6424606A (en) High frequency module
CA2041765A1 (en) Surface mounted electrical connector
JPS61111155U (en)
JPH0614379Y2 (en) Photoelectric switch
JPH0325259U (en)
JPH0168642U (en)
JPS62193797U (en)
JPS6482802A (en) Microwave integrated circuit
JPH0256483U (en)
JPS6444092A (en) Wiring substrate
JPS6210406U (en)
JPS6420473U (en)
JPH0428488U (en)
JPS6461040A (en) Integrated circuit package
JPS647561A (en) Optical sensor package
JPH0363967U (en)
JPH0286198U (en)
JPH02136980U (en)
JPH0160577U (en)
JPS6382968U (en)