JPH0325259U - - Google Patents
Info
- Publication number
- JPH0325259U JPH0325259U JP8494889U JP8494889U JPH0325259U JP H0325259 U JPH0325259 U JP H0325259U JP 8494889 U JP8494889 U JP 8494889U JP 8494889 U JP8494889 U JP 8494889U JP H0325259 U JPH0325259 U JP H0325259U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- semiconductor module
- optical semiconductor
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 claims 1
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案による光半導体モジユールの実
装構造の一実施例を示す要部側断面図、第２図は
第１図の実施例の実装前の状態を示す斜視図、第
３図は従来の光半導体モジユールの実装構造例を
示す斜視図、第４図は第３図における光半導体モ
ジユールの側断面図、第５図は第３図の要部側断
面図、第６図は従来の他の実装構造を示す要部側
断面図である。
１２……光半導体モジユール、１３……印刷配
線板、１５ａ〜１５ｃ……端子、１６ａ〜１６ｃ
……接続用パツド。
FIG. 1 is a side cross-sectional view of a main part showing an embodiment of the mounting structure of an optical semiconductor module according to the present invention, FIG. 2 is a perspective view showing the state of the embodiment of FIG. 1 before mounting, and FIG. 3 is a conventional one. FIG. 4 is a side sectional view of the optical semiconductor module in FIG. 3, FIG. 5 is a side sectional view of the main part of FIG. 3, and FIG. 6 is a conventional optical semiconductor module. FIG. 2 is a side cross-sectional view of a main part showing the mounting structure of FIG. 12... Optical semiconductor module, 13... Printed wiring board, 15a-15c... Terminal, 16a-16c
...Connection pad.
Claims (1)
、光電変換機能を有する光半導体モジユールの端
子を半田付けして電気的接続を得る光半導体モジ
ユールの実装構造において、 印刷配線板の両面に前記電気回路と接続した接
続用パツドをそれぞれ印刷配線板の一辺近傍に位
置するように形成すると共に、光半導体モジユー
ルの端子の間隔を印刷配線板の厚さ以上とし、 この端子間に印刷配線板を挟み込んで、各端子
と接続用パツドを半田付けしたことを特徴とする
光半導体モジユールの実装構造。[Scope of Claim for Utility Model Registration] In a mounting structure of an optical semiconductor module in which an electrical connection is obtained by soldering the terminals of an optical semiconductor module having a photoelectric conversion function to a printed wiring board provided with an electric circuit for transmitting and receiving signals, Connecting pads connected to the electric circuit are formed on both sides of the printed wiring board so as to be located near one side of the printed wiring board, and the spacing between the terminals of the optical semiconductor module is set to be equal to or greater than the thickness of the printed wiring board, A mounting structure for an optical semiconductor module characterized by sandwiching a printed wiring board between terminals and soldering each terminal and connection pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8494889U JPH0325259U (en) | 1989-07-21 | 1989-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8494889U JPH0325259U (en) | 1989-07-21 | 1989-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0325259U true JPH0325259U (en) | 1991-03-15 |
Family
ID=31633769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8494889U Pending JPH0325259U (en) | 1989-07-21 | 1989-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325259U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06202674A (en) * | 1992-12-26 | 1994-07-22 | Kobayashi Denki:Kk | Opertation check device of karaoke playing device |
| JP2009022328A (en) * | 2007-07-17 | 2009-02-05 | Kao Corp | Absorbent article |
-
1989
- 1989-07-21 JP JP8494889U patent/JPH0325259U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06202674A (en) * | 1992-12-26 | 1994-07-22 | Kobayashi Denki:Kk | Opertation check device of karaoke playing device |
| JP2009022328A (en) * | 2007-07-17 | 2009-02-05 | Kao Corp | Absorbent article |
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