JPS6473646A - Bump forming substrate for transferring - Google Patents

Bump forming substrate for transferring

Info

Publication number
JPS6473646A
JPS6473646A JP23012887A JP23012887A JPS6473646A JP S6473646 A JPS6473646 A JP S6473646A JP 23012887 A JP23012887 A JP 23012887A JP 23012887 A JP23012887 A JP 23012887A JP S6473646 A JPS6473646 A JP S6473646A
Authority
JP
Japan
Prior art keywords
film
electrodes
bump
substrate
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23012887A
Other languages
Japanese (ja)
Inventor
Tetsuo Kawakita
Kenzo Hatada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP23012887A priority Critical patent/JPS6473646A/en
Publication of JPS6473646A publication Critical patent/JPS6473646A/en
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To form a transfer bump having a predetermined thickness by forming a conductive film for plating electrodes on an insulating substrate, forming a plating mask having an opening at a position corresponding to the electrode of a semiconductor element, and employing a superconducting material as the conductive film in a bump forming substrate for transferring to obtain the bump on the conductive film. CONSTITUTION:A ceramic superconducting film 2 is formed as plating electrodes on an insulating substrate 1 made of glass or ceramics. Photosensitive insulating resin is formed as a plating mask 3 on the film 2. An opening 4 is provided at a position corresponding to the electrode of a semiconductor element. Then, Au bumps 5 are formed on the superconducting film of the opening 4 by an electrolytic plating method on the bump forming substrate. The thus formed bumps 5 are transfer bonded to the leads of a film carrier, isolated from the substrate 1, bonded to the electrodes of the element, and the film carrier leads are electrically connected to the electrodes of the element.
JP23012887A 1987-09-14 1987-09-14 Bump forming substrate for transferring Pending JPS6473646A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23012887A JPS6473646A (en) 1987-09-14 1987-09-14 Bump forming substrate for transferring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23012887A JPS6473646A (en) 1987-09-14 1987-09-14 Bump forming substrate for transferring

Publications (1)

Publication Number Publication Date
JPS6473646A true JPS6473646A (en) 1989-03-17

Family

ID=16903011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23012887A Pending JPS6473646A (en) 1987-09-14 1987-09-14 Bump forming substrate for transferring

Country Status (1)

Country Link
JP (1) JPS6473646A (en)

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