JPS6473646A - Bump forming substrate for transferring - Google Patents
Bump forming substrate for transferringInfo
- Publication number
- JPS6473646A JPS6473646A JP23012887A JP23012887A JPS6473646A JP S6473646 A JPS6473646 A JP S6473646A JP 23012887 A JP23012887 A JP 23012887A JP 23012887 A JP23012887 A JP 23012887A JP S6473646 A JPS6473646 A JP S6473646A
- Authority
- JP
- Japan
- Prior art keywords
- film
- electrodes
- bump
- substrate
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE:To form a transfer bump having a predetermined thickness by forming a conductive film for plating electrodes on an insulating substrate, forming a plating mask having an opening at a position corresponding to the electrode of a semiconductor element, and employing a superconducting material as the conductive film in a bump forming substrate for transferring to obtain the bump on the conductive film. CONSTITUTION:A ceramic superconducting film 2 is formed as plating electrodes on an insulating substrate 1 made of glass or ceramics. Photosensitive insulating resin is formed as a plating mask 3 on the film 2. An opening 4 is provided at a position corresponding to the electrode of a semiconductor element. Then, Au bumps 5 are formed on the superconducting film of the opening 4 by an electrolytic plating method on the bump forming substrate. The thus formed bumps 5 are transfer bonded to the leads of a film carrier, isolated from the substrate 1, bonded to the electrodes of the element, and the film carrier leads are electrically connected to the electrodes of the element.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23012887A JPS6473646A (en) | 1987-09-14 | 1987-09-14 | Bump forming substrate for transferring |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23012887A JPS6473646A (en) | 1987-09-14 | 1987-09-14 | Bump forming substrate for transferring |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6473646A true JPS6473646A (en) | 1989-03-17 |
Family
ID=16903011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23012887A Pending JPS6473646A (en) | 1987-09-14 | 1987-09-14 | Bump forming substrate for transferring |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6473646A (en) |
-
1987
- 1987-09-14 JP JP23012887A patent/JPS6473646A/en active Pending
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