JPS6457675A - Vertical field-effect transistor - Google Patents
Vertical field-effect transistorInfo
- Publication number
- JPS6457675A JPS6457675A JP62214231A JP21423187A JPS6457675A JP S6457675 A JPS6457675 A JP S6457675A JP 62214231 A JP62214231 A JP 62214231A JP 21423187 A JP21423187 A JP 21423187A JP S6457675 A JPS6457675 A JP S6457675A
- Authority
- JP
- Japan
- Prior art keywords
- regions
- semiconductor substrate
- base
- conductivity type
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005669 field effect Effects 0.000 title 1
- 239000004065 semiconductor Substances 0.000 abstract 8
- 239000000758 substrate Substances 0.000 abstract 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 230000015556 catabolic process Effects 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 239000011229 interlayer Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0873—Drain regions
- H01L29/0878—Impurity concentration or distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/42376—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the length or the sectional shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
PURPOSE:To provide a low input capacity and high breakdown strength vertical FET with lower input capacity and lower on-resistance by a method wherein source regions are formed in base regions; gate electrodes are formed on the base regions between a semiconductor substrate and the source regions; and high concentration drain regions are formed on the surface around the base regions of the semiconductor substrate. CONSTITUTION:The title vertical FET is composed of the first conductivity type semiconductor substrate 7, the second conductivity type base regions 2 selectively provided on the surface part of semiconductor substrate 7 with each other, the first conductivity type source regions 3 provided on the base regions 2, gate electrodes 4 provided on the base region 2 between the source regions 3 and the semiconductor substrate 7 through the intermediary of a gate oxide and the first conductivity type impurity concentrated drain regions 9 on the surface part of semiconductor substrate 7 around said base regions 2. Furthermore, for example, an aluminum made source region 6 in contact with the central parts of the source regions 3 and the base region 2 is provided on interlayer insulating films 5 formed on the semiconductor substrate 7 provided with the gate electrodes 4 while a drain electrode 8 is provided on the rear side of the semiconductor substrate 7.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62214231A JPS6457675A (en) | 1987-08-27 | 1987-08-27 | Vertical field-effect transistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62214231A JPS6457675A (en) | 1987-08-27 | 1987-08-27 | Vertical field-effect transistor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6457675A true JPS6457675A (en) | 1989-03-03 |
Family
ID=16652359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62214231A Pending JPS6457675A (en) | 1987-08-27 | 1987-08-27 | Vertical field-effect transistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6457675A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04125972A (en) * | 1990-09-17 | 1992-04-27 | Fuji Electric Co Ltd | Mos semiconductor element and manufacture thereof |
JPH05267673A (en) * | 1992-03-24 | 1993-10-15 | Nec Kansai Ltd | Vertical field effect transistor and its manufacture |
JPH08125172A (en) * | 1994-10-28 | 1996-05-17 | Nec Yamagata Ltd | Vertical field effect transistor and fabrication thereof |
JP2003046082A (en) * | 2001-05-25 | 2003-02-14 | Toshiba Corp | Semiconductor device and method of manufacturing the same |
JP2006100779A (en) * | 2004-09-02 | 2006-04-13 | Fuji Electric Holdings Co Ltd | Semiconductor device and its manufacturing method |
WO2007091360A1 (en) * | 2006-02-07 | 2007-08-16 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing same |
JP2009071082A (en) * | 2007-09-14 | 2009-04-02 | Mitsubishi Electric Corp | Semiconductor device |
JP2010225878A (en) * | 2009-03-24 | 2010-10-07 | Denso Corp | Semiconductor device with schottky barrier diode, and method of manufacturing the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57103361A (en) * | 1980-10-29 | 1982-06-26 | Siemens Ag | Mis controlled semiconductor element |
-
1987
- 1987-08-27 JP JP62214231A patent/JPS6457675A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57103361A (en) * | 1980-10-29 | 1982-06-26 | Siemens Ag | Mis controlled semiconductor element |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04125972A (en) * | 1990-09-17 | 1992-04-27 | Fuji Electric Co Ltd | Mos semiconductor element and manufacture thereof |
JPH05267673A (en) * | 1992-03-24 | 1993-10-15 | Nec Kansai Ltd | Vertical field effect transistor and its manufacture |
JPH08125172A (en) * | 1994-10-28 | 1996-05-17 | Nec Yamagata Ltd | Vertical field effect transistor and fabrication thereof |
JP2003046082A (en) * | 2001-05-25 | 2003-02-14 | Toshiba Corp | Semiconductor device and method of manufacturing the same |
JP2006100779A (en) * | 2004-09-02 | 2006-04-13 | Fuji Electric Holdings Co Ltd | Semiconductor device and its manufacturing method |
WO2007091360A1 (en) * | 2006-02-07 | 2007-08-16 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing same |
JPWO2007091360A1 (en) * | 2006-02-07 | 2009-07-02 | 三菱電機株式会社 | Semiconductor device and manufacturing method thereof |
JP2010045388A (en) * | 2006-02-07 | 2010-02-25 | Mitsubishi Electric Corp | Silicon carbide semiconductor device |
JP4545800B2 (en) * | 2006-02-07 | 2010-09-15 | 三菱電機株式会社 | Silicon carbide semiconductor device and manufacturing method thereof |
US8222649B2 (en) | 2006-02-07 | 2012-07-17 | Mitsubishi Electric Corporation | Semiconductor device and method of manufacturing the same |
JP2009071082A (en) * | 2007-09-14 | 2009-04-02 | Mitsubishi Electric Corp | Semiconductor device |
JP2010225878A (en) * | 2009-03-24 | 2010-10-07 | Denso Corp | Semiconductor device with schottky barrier diode, and method of manufacturing the same |
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