JPS6454795A - Manufacture of insulating substrate with conductive layer - Google Patents

Manufacture of insulating substrate with conductive layer

Info

Publication number
JPS6454795A
JPS6454795A JP21172887A JP21172887A JPS6454795A JP S6454795 A JPS6454795 A JP S6454795A JP 21172887 A JP21172887 A JP 21172887A JP 21172887 A JP21172887 A JP 21172887A JP S6454795 A JPS6454795 A JP S6454795A
Authority
JP
Japan
Prior art keywords
substrate
layer
conductive layer
manufacture
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21172887A
Other languages
Japanese (ja)
Inventor
Masami Takagi
Koichi Koga
Shokichi Kuribayashi
Mitsuru Kayukawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP21172887A priority Critical patent/JPS6454795A/en
Publication of JPS6454795A publication Critical patent/JPS6454795A/en
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)

Abstract

PURPOSE:To form a substrate body on a conductive layer and a conductive member, to transfer the layer to the body, and to improve the reliability of connecting the member by forming the layer on a temporary substrate used to manufacture an insulating substrate with a conductive layer, and so disposing the member as to rise from the surface in the state conducted electrically with the layer. CONSTITUTION:A temporary substrate 1 is used to manufacture an insulating substrate 7 with a conductive layer, and a plurality of holes 1a corresponding to the mounting positions of pin terminals (conductive members) 2 on the substrate 1. The substrate 1 is electrically plated, a folding pattern copper layer (conductive layer) 4 is formed on the substrate 1, and the copper layer 4 is connected to the terminal 2. The terminal 2 is so disposed as to rise from the surface to conduct the layer 4. The substrate 1 is disposed in a metal mold 6 for molding the substrate, a substrate body is molded with insulting molding material P poured from an inlet 6d to improve the reliability of connecting the terminal 2 as the member.
JP21172887A 1987-08-26 1987-08-26 Manufacture of insulating substrate with conductive layer Pending JPS6454795A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21172887A JPS6454795A (en) 1987-08-26 1987-08-26 Manufacture of insulating substrate with conductive layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21172887A JPS6454795A (en) 1987-08-26 1987-08-26 Manufacture of insulating substrate with conductive layer

Publications (1)

Publication Number Publication Date
JPS6454795A true JPS6454795A (en) 1989-03-02

Family

ID=16610617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21172887A Pending JPS6454795A (en) 1987-08-26 1987-08-26 Manufacture of insulating substrate with conductive layer

Country Status (1)

Country Link
JP (1) JPS6454795A (en)

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