JPS6447089A - Circuit board - Google Patents

Circuit board

Info

Publication number
JPS6447089A
JPS6447089A JP62204757A JP20475787A JPS6447089A JP S6447089 A JPS6447089 A JP S6447089A JP 62204757 A JP62204757 A JP 62204757A JP 20475787 A JP20475787 A JP 20475787A JP S6447089 A JPS6447089 A JP S6447089A
Authority
JP
Japan
Prior art keywords
substrate
connector
hence
metal pin
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62204757A
Other languages
Japanese (ja)
Inventor
Satoshi Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP62204757A priority Critical patent/JPS6447089A/en
Publication of JPS6447089A publication Critical patent/JPS6447089A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To miniaturize circuit components including connectors and a device taking the circuit as constituent components and hence reduce the cost of those components and manufacture of the same by partly burying metal pins in plastic and employing a part outside the plastic as a connector terminal. CONSTITUTION:A metal pin 2 is molded keeping its state that it is buried in a substrate material 1 upon formation of the substrate, and hence integrally formed with a substrate body. A part 2b is a portion of the metal pin which makes contact with a conductor pattern 3 on the substrate, and hence is electrically conducted with the latter. A part 2b is a portion of the metal pin which is conducted with an external connector. The latter portion is designed to be located at the center of substrate thickness. Hereby, the connector part is included within the thickness of the substrate. The total thickness of the connector and the substrate can be reduced compared with that in conventional cases, hereby assuring the miniature design of the device. Furthermore, the substrate is integrally formed with the connector, thereby making unnecessary a process of mounting the connector on the substrate.
JP62204757A 1987-08-18 1987-08-18 Circuit board Pending JPS6447089A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62204757A JPS6447089A (en) 1987-08-18 1987-08-18 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62204757A JPS6447089A (en) 1987-08-18 1987-08-18 Circuit board

Publications (1)

Publication Number Publication Date
JPS6447089A true JPS6447089A (en) 1989-02-21

Family

ID=16495843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62204757A Pending JPS6447089A (en) 1987-08-18 1987-08-18 Circuit board

Country Status (1)

Country Link
JP (1) JPS6447089A (en)

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