JPS6450444U - - Google Patents
Info
- Publication number
- JPS6450444U JPS6450444U JP1987145070U JP14507087U JPS6450444U JP S6450444 U JPS6450444 U JP S6450444U JP 1987145070 U JP1987145070 U JP 1987145070U JP 14507087 U JP14507087 U JP 14507087U JP S6450444 U JPS6450444 U JP S6450444U
- Authority
- JP
- Japan
- Prior art keywords
- joint part
- electrical component
- notch
- lead
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1084—Notched leads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987145070U JPS6450444U (US06277897-20010821-C00009.png) | 1987-09-22 | 1987-09-22 | |
US07/241,597 US4991059A (en) | 1987-09-22 | 1988-09-08 | Electric component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987145070U JPS6450444U (US06277897-20010821-C00009.png) | 1987-09-22 | 1987-09-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6450444U true JPS6450444U (US06277897-20010821-C00009.png) | 1989-03-29 |
Family
ID=15376685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987145070U Pending JPS6450444U (US06277897-20010821-C00009.png) | 1987-09-22 | 1987-09-22 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4991059A (US06277897-20010821-C00009.png) |
JP (1) | JPS6450444U (US06277897-20010821-C00009.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0459914U (US06277897-20010821-C00009.png) * | 1990-09-29 | 1992-05-22 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04213867A (ja) * | 1990-11-27 | 1992-08-04 | Ibiden Co Ltd | 電子部品搭載用基板フレーム |
JPH0555438A (ja) * | 1991-08-26 | 1993-03-05 | Rohm Co Ltd | 電子部品のリード端子構造 |
JPH0620731A (ja) * | 1992-07-01 | 1994-01-28 | Mitsubishi Electric Corp | リード、集積回路装置の組立方法、集積回路装置、導電路提供用リードおよび導電路提供方法 |
JPH06188536A (ja) * | 1992-12-18 | 1994-07-08 | Mitsubishi Electric Corp | 混成集積回路装置 |
JP3297269B2 (ja) * | 1995-11-20 | 2002-07-02 | 株式会社村田製作所 | 正特性サーミスタの実装構造 |
DE19639025C2 (de) * | 1996-09-23 | 1999-10-28 | Siemens Ag | Chipmodul und Verfahren zur Herstellung eines Chipmoduls |
SE508138C2 (sv) | 1996-12-20 | 1998-08-31 | Ericsson Telefon Ab L M | Metod och anordning för anslutning av elektrisk komponent till kretskort |
SE508139C2 (sv) * | 1996-12-20 | 1998-08-31 | Ericsson Telefon Ab L M | Metod och anordning för anslutning av elektrisk komponent till kretskort |
JP2000517485A (ja) * | 1997-07-01 | 2000-12-26 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | リード線付素子を有するプリント回路板及びこの素子を固着する方法 |
US6181234B1 (en) * | 1999-12-29 | 2001-01-30 | Vishay Dale Electronics, Inc. | Monolithic heat sinking resistor |
DE10116531B4 (de) * | 2000-04-04 | 2008-06-19 | Koa Corp., Ina | Widerstand mit niedrigem Widerstandswert |
JP2002111170A (ja) * | 2000-09-29 | 2002-04-12 | Mitsumi Electric Co Ltd | プリント基板に於ける金属板の取付機構 |
JP2002305101A (ja) * | 2001-04-05 | 2002-10-18 | Murata Mfg Co Ltd | 表面実装型正特性サーミスタおよびその製造方法 |
JP4098556B2 (ja) * | 2001-07-31 | 2008-06-11 | ローム株式会社 | 端子板、この端子板を備えた回路基板、およびこの端子板の接続方法 |
US7167369B1 (en) * | 2003-12-08 | 2007-01-23 | Cisco Technology, Inc. | Methods and apparatus for installing a heat sink using surface mount technology |
US7214881B2 (en) * | 2004-04-01 | 2007-05-08 | Delphi Technologies, Inc. | High temperature electrical connection |
JP2006156819A (ja) * | 2004-11-30 | 2006-06-15 | Denso Corp | 電子部品 |
KR100782747B1 (ko) * | 2005-08-02 | 2007-12-05 | 삼성전기주식회사 | 납땜 구조를 개선한 발광다이오드, 이 발광다이오드를납땜을 통해 기판에 조립하는 방법 및 이 조립 방법에 의해제조한 발광다이오드 어셈블리 |
DE102006039817A1 (de) * | 2006-08-25 | 2008-03-13 | Erni Electronics Gmbh | Bauelement zum Verbinden mit einem zweiten Bauelement |
US9418919B2 (en) * | 2010-07-29 | 2016-08-16 | Nxp B.V. | Leadless chip carrier having improved mountability |
JP5619663B2 (ja) * | 2011-03-31 | 2014-11-05 | 古河電気工業株式会社 | シャント抵抗器の接続端子、及びバッテリー状態検知装置 |
JP6036408B2 (ja) * | 2013-02-28 | 2016-11-30 | 株式会社デンソー | 電子部品及び電子制御装置 |
JP6048215B2 (ja) * | 2013-02-28 | 2016-12-21 | 株式会社デンソー | 電子部品及び電子制御装置 |
JP5942898B2 (ja) * | 2013-02-28 | 2016-06-29 | 株式会社デンソー | 電子部品及び電子制御装置 |
JP6051947B2 (ja) * | 2013-02-28 | 2016-12-27 | 株式会社デンソー | 電子部品及び電子制御装置 |
US20190069411A1 (en) * | 2017-08-25 | 2019-02-28 | Samsung Electro-Mechanics Co., Ltd. | Electronic component and board having the same |
KR102494331B1 (ko) * | 2017-10-24 | 2023-02-02 | 삼성전기주식회사 | 적층형 전자 부품 및 그 실장 기판 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4306217A (en) * | 1977-06-03 | 1981-12-15 | Angstrohm Precision, Inc. | Flat electrical components |
JPS5851754B2 (ja) * | 1981-10-08 | 1983-11-18 | 四郎 酒井 | 高タンパク含有マスキング材料 |
JPS58144853A (ja) * | 1982-02-23 | 1983-08-29 | Fuji Xerox Co Ltd | 変倍複写機の照度むら補正装置 |
JPS596865A (ja) * | 1982-06-30 | 1984-01-13 | Nichimou Kk | 海苔食品の製造方法 |
JPS59158336A (ja) * | 1983-02-28 | 1984-09-07 | Fujitsu Ten Ltd | 電子式燃料噴射装置 |
US4661887A (en) * | 1985-10-31 | 1987-04-28 | Motorola, Inc. | Surface mountable integrated circuit packages having solder bearing leads |
DE3540517A1 (de) * | 1985-11-15 | 1987-05-21 | Basf Ag | Verfahren zur herstellung von aromatischen nitrilen |
JPS63199447A (ja) * | 1987-02-16 | 1988-08-17 | Oki Electric Ind Co Ltd | 半導体装置のリ−ド |
-
1987
- 1987-09-22 JP JP1987145070U patent/JPS6450444U/ja active Pending
-
1988
- 1988-09-08 US US07/241,597 patent/US4991059A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0459914U (US06277897-20010821-C00009.png) * | 1990-09-29 | 1992-05-22 |
Also Published As
Publication number | Publication date |
---|---|
US4991059A (en) | 1991-02-05 |