JPS644903B2 - - Google Patents
Info
- Publication number
- JPS644903B2 JPS644903B2 JP11774283A JP11774283A JPS644903B2 JP S644903 B2 JPS644903 B2 JP S644903B2 JP 11774283 A JP11774283 A JP 11774283A JP 11774283 A JP11774283 A JP 11774283A JP S644903 B2 JPS644903 B2 JP S644903B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- article
- drum
- frame
- pasted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002313 adhesive film Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 8
- 238000004804 winding Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11774283A JPS608045A (ja) | 1983-06-27 | 1983-06-27 | 粘着フイルム貼付方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11774283A JPS608045A (ja) | 1983-06-27 | 1983-06-27 | 粘着フイルム貼付方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS608045A JPS608045A (ja) | 1985-01-16 |
| JPS644903B2 true JPS644903B2 (forum.php) | 1989-01-27 |
Family
ID=14719176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11774283A Granted JPS608045A (ja) | 1983-06-27 | 1983-06-27 | 粘着フイルム貼付方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS608045A (forum.php) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0346046B1 (en) * | 1988-06-07 | 1993-10-27 | W.R. Grace & Co.-Conn. | Chill roll |
| JP4719790B2 (ja) * | 2006-03-03 | 2011-07-06 | 株式会社 ベアック | 補強板貼り付け装置 |
| JP5113273B2 (ja) * | 2006-03-03 | 2013-01-09 | 株式会社 ベアック | 補強板貼り付け装置、補強板型抜き用金型、補強板生成用裁断装置、フレキシブル基板及び電子機器 |
| WO2007099645A1 (ja) * | 2006-03-03 | 2007-09-07 | Beac Co., Ltd. | 補強板貼り付け装置、補強板型抜き用金型及びフレキシブル基板 |
-
1983
- 1983-06-27 JP JP11774283A patent/JPS608045A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS608045A (ja) | 1985-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR920004063B1 (ko) | 반도체 웨이퍼 표면의 연삭 방법 및 그 장치 | |
| JPH01272129A (ja) | 保護フイルムの剥離方法 | |
| CN104795309B (zh) | 薄膜片材切除装置及切除方法 | |
| JPH01143211A (ja) | ウエハーに対する保護テープの貼付け切り抜き方法および装置 | |
| JPS6317738B2 (forum.php) | ||
| JPS59174677A (ja) | 保護フイルムの剥離方法 | |
| KR20060125720A (ko) | 마운팅 장치 및 마운팅 방법 | |
| KR970002433B1 (ko) | 마스킹 필름의 부착 방법 및 이에 사용되는 마스킹 필름 부착 장치 | |
| JPS644904B2 (forum.php) | ||
| JP2002023151A (ja) | 偏光板を備える液晶表示装置の製造方法及び製造装置 | |
| JP7290814B2 (ja) | 接着テープの剥離装置及び剥離方法 | |
| JPH0234175B2 (forum.php) | ||
| JPS644903B2 (forum.php) | ||
| JPH01321257A (ja) | 薄板と粘着テープの貼着方法 | |
| JP7392964B2 (ja) | 基板の接着テープ貼り替え装置及び貼り替え方法 | |
| JPS62174940A (ja) | ウエハとリングの自動貼合せ装置 | |
| JPH0319149B2 (forum.php) | ||
| JPH10156964A (ja) | 帯状材料の供給方法及びその装置 | |
| JPH01178407A (ja) | スライシングマシンのウエハ回収装置 | |
| JPS59113636A (ja) | 全自動ウエ−ハ−のテ−プ貼着機 | |
| JPS6313903B2 (forum.php) | ||
| JPS6038897A (ja) | 薄板とリングの貼着方法 | |
| JPS628966A (ja) | ウエハとリングフレ−ムの貼り合せ方法ならびに装置 | |
| JPH0143459B2 (forum.php) | ||
| JPH01267264A (ja) | 薄板と粘着テープの貼着方法 |