JPS644903B2 - - Google Patents

Info

Publication number
JPS644903B2
JPS644903B2 JP58117742A JP11774283A JPS644903B2 JP S644903 B2 JPS644903 B2 JP S644903B2 JP 58117742 A JP58117742 A JP 58117742A JP 11774283 A JP11774283 A JP 11774283A JP S644903 B2 JPS644903 B2 JP S644903B2
Authority
JP
Japan
Prior art keywords
film
article
drum
frame
pasted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58117742A
Other languages
English (en)
Japanese (ja)
Other versions
JPS608045A (ja
Inventor
Minoru Ametani
Kenji Oonishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP58117742A priority Critical patent/JPS608045A/ja
Publication of JPS608045A publication Critical patent/JPS608045A/ja
Publication of JPS644903B2 publication Critical patent/JPS644903B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)
JP58117742A 1983-06-27 1983-06-27 粘着フイルム貼付方法 Granted JPS608045A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58117742A JPS608045A (ja) 1983-06-27 1983-06-27 粘着フイルム貼付方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58117742A JPS608045A (ja) 1983-06-27 1983-06-27 粘着フイルム貼付方法

Publications (2)

Publication Number Publication Date
JPS608045A JPS608045A (ja) 1985-01-16
JPS644903B2 true JPS644903B2 (cg-RX-API-DMAC7.html) 1989-01-27

Family

ID=14719176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58117742A Granted JPS608045A (ja) 1983-06-27 1983-06-27 粘着フイルム貼付方法

Country Status (1)

Country Link
JP (1) JPS608045A (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0346046B1 (en) * 1988-06-07 1993-10-27 W.R. Grace & Co.-Conn. Chill roll
JP5113273B2 (ja) * 2006-03-03 2013-01-09 株式会社 ベアック 補強板貼り付け装置、補強板型抜き用金型、補強板生成用裁断装置、フレキシブル基板及び電子機器
JP4719790B2 (ja) * 2006-03-03 2011-07-06 株式会社 ベアック 補強板貼り付け装置
WO2007099645A1 (ja) * 2006-03-03 2007-09-07 Beac Co., Ltd. 補強板貼り付け装置、補強板型抜き用金型及びフレキシブル基板

Also Published As

Publication number Publication date
JPS608045A (ja) 1985-01-16

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