JPS6447086U - - Google Patents
Info
- Publication number
- JPS6447086U JPS6447086U JP14181187U JP14181187U JPS6447086U JP S6447086 U JPS6447086 U JP S6447086U JP 14181187 U JP14181187 U JP 14181187U JP 14181187 U JP14181187 U JP 14181187U JP S6447086 U JPS6447086 U JP S6447086U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- board
- lands
- wiring board
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 claims 1
- 239000006185 dispersion Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図はこの考案の第１の実施例のプリント配
線板の一部分にチツプ部品を搭載した平面図、第
２図は第１図のＢ―Ｂ矢視断面図、第３図はこの
考案の第２の実施例のプリント配線板の一部分に
チツプ部品を搭載した平面図、第４図はこの考案
の第３の実施例のプリント配線板の一部分にチツ
プ部品を搭載した平面図、第５図はこの考案の第
４の実施例のプリント配線板の一部分にチツプ部
品を搭載した平面図、第６図および第７図はそれ
ぞれプリント配線板に応力をかけてチツプ部品の
割れを生じさせる試験方法を示す説明図、第８図
は従来のプリント配線板の一部分にチツプ部品を
搭載した平面図、第９図は第８図のＡ―Ａ矢視断
面図、第１０図は第９図に示す断面のプリント配
線板に応力をかけてチツプ部品に割れを生じさせ
た状態の断面図である。
１：基板、２ａ，２ｂ：ランド、３：チツプ部
品、４ａ，４ｂ，１４ａ，１４ｂ，２４ａ，２４
ｂ，３４ａ，３４ｂ：孔。
Figure 1 is a plan view of a part of the printed wiring board of the first embodiment of this invention with chip components mounted, Figure 2 is a sectional view taken along the line B--B in Figure 1, and Figure 3 is a diagram of the invention. FIG. 4 is a plan view showing chip components mounted on a portion of the printed wiring board of the second embodiment; FIG. 4 is a plan view showing chip components mounted on a portion of the printed wiring board of the third embodiment of this invention; FIG. is a plan view of a chip component mounted on a portion of a printed wiring board according to the fourth embodiment of this invention, and FIGS. 6 and 7 respectively show a test method in which stress is applied to the printed wiring board to cause cracking of the chip component. 8 is a plan view showing a part of a conventional printed wiring board with chip components mounted on it, FIG. 9 is a sectional view taken along the line A-A in FIG. 8, and FIG. 10 is shown in FIG. 9. FIG. 3 is a cross-sectional view of a printed wiring board in cross section in which stress is applied to cause cracks in chip components. 1: Board, 2a, 2b: Land, 3: Chip parts, 4a, 4b, 14a, 14b, 24a, 24
b, 34a, 34b: hole.
Claims (1)
抗器、コンデンサなどのチツプ部品を搭載して半
田付け接続したプリント配線板において、半田付
けされるランド周辺またはランドに重なるように
基板に加わる曲げ応力を分散させるための孔を基
板に設けたことを特徴とするプリント配線板。 In printed wiring boards in which chip parts such as resistors and capacitors are mounted on lands printed on the surface of the board and connected by soldering, bending stress applied to the board around or overlapping the soldered lands is reduced. A printed wiring board characterized by having holes in the substrate for dispersion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14181187U JPS6447086U (en) | 1987-09-17 | 1987-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14181187U JPS6447086U (en) | 1987-09-17 | 1987-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6447086U true JPS6447086U (en) | 1989-03-23 |
Family
ID=31407214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14181187U Pending JPS6447086U (en) | 1987-09-17 | 1987-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6447086U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021168356A (en) * | 2020-04-10 | 2021-10-21 | 株式会社デンソー | Electronic device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057152B2 (en) * | 1978-03-15 | 1985-12-13 | 株式会社日立製作所 | magnetic tape playback device |
-
1987
- 1987-09-17 JP JP14181187U patent/JPS6447086U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057152B2 (en) * | 1978-03-15 | 1985-12-13 | 株式会社日立製作所 | magnetic tape playback device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021168356A (en) * | 2020-04-10 | 2021-10-21 | 株式会社デンソー | Electronic device |
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