JPS6446934A - Detection of quantity of etched surface of solid - Google Patents

Abstract

PURPOSE:To measure the depth of etching simply and rapidly without using a step measuring device by mounting a resist with an opening and a scale pattern arranged near the opening to the etched surface of a solid and observing the quantity of side etching, employing the scale pattern as a reference. CONSTITUTION:Isotropic Si etching is conducted to a substrate 1 to which a resist 2 and a scale pattern 3 are set up. Since etching progresses in an isotropic manner, an etching region is spread both in the thickness direction and cross direction of the substrate 1 from an opening section in the resist 2. Since a certain relationship holds between the quantity of etching (l) in the cross direction and the depth (d) of a groove at that time, the depth (d) of the groove can be determined when the quantity of side etching (l) is caught. The quantity of side etching (l) can be read by observing the scale pattern 3 and the edge section of the etching region by a light microscope because the edge section of the etching region is viewed from an upper section through the resist 2. Accordingly, the quantity of etching can easily be determined quickly without using a step measuring device.