JPS644473A - Sputtering device - Google Patents
Sputtering deviceInfo
- Publication number
- JPS644473A JPS644473A JP15779787A JP15779787A JPS644473A JP S644473 A JPS644473 A JP S644473A JP 15779787 A JP15779787 A JP 15779787A JP 15779787 A JP15779787 A JP 15779787A JP S644473 A JPS644473 A JP S644473A
- Authority
- JP
- Japan
- Prior art keywords
- target
- gas
- inlet part
- gaseous
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To adjust the gas flow rate and gas pressure distribution and to prevent the deterioration in the quality of a film formed on a substrate by providing plural nozzles of the title sputtering device in the vicinity of a target, and making the conductance of each nozzle freely adjustable. CONSTITUTION:A gas inlet part 4 is provided in the vicinity of the target 13 and in parallel with the long side of the target 3. The upper gaseous O2 inlet part 4a of the gas inlet part 4 is placed on the lower gaseous Ar inlet part 4b. The reactive gaseous O2 is injected toward the target 13 from the nozzle 12a, and inert gaseous Ar is injected from the nozzle 12b. The amt. of the gas to be injected is adjusted by the male screws 14a and 14b. By this method, the gas flow rate is uniformized, the gas pressure distribution is improved, the deterioration in the quality of a film to be formed on the substrate is prevented, and the number of the substrates to be treated is increased.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15779787A JPS644473A (en) | 1987-06-26 | 1987-06-26 | Sputtering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15779787A JPS644473A (en) | 1987-06-26 | 1987-06-26 | Sputtering device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS644473A true JPS644473A (en) | 1989-01-09 |
Family
ID=15657497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15779787A Pending JPS644473A (en) | 1987-06-26 | 1987-06-26 | Sputtering device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS644473A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02225663A (en) * | 1989-02-27 | 1990-09-07 | Tokuda Seisakusho Ltd | Sputtering device |
JPH02131547U (en) * | 1989-03-29 | 1990-11-01 | ||
US5340459A (en) * | 1991-11-22 | 1994-08-23 | Nec Corporation | Reactive sputtering system |
JPH0790572A (en) * | 1993-04-22 | 1995-04-04 | Balzers Ag | Apparatus and method for introduction of gas |
JPH10212575A (en) * | 1997-01-29 | 1998-08-11 | Sony Corp | Sputtering device |
JP2007332434A (en) * | 2006-06-16 | 2007-12-27 | Showa Shinku:Kk | Film deposition apparatus |
JP2008266794A (en) * | 1997-09-10 | 2008-11-06 | Sony Corp | Device for controlling amount of gas to be sprayed in vacuum tank |
WO2023132130A1 (en) * | 2022-01-07 | 2023-07-13 | 芝浦機械株式会社 | Surface treatment device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6137964A (en) * | 1984-07-30 | 1986-02-22 | Matsushita Electric Ind Co Ltd | Sputtering device |
-
1987
- 1987-06-26 JP JP15779787A patent/JPS644473A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6137964A (en) * | 1984-07-30 | 1986-02-22 | Matsushita Electric Ind Co Ltd | Sputtering device |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02225663A (en) * | 1989-02-27 | 1990-09-07 | Tokuda Seisakusho Ltd | Sputtering device |
JPH02131547U (en) * | 1989-03-29 | 1990-11-01 | ||
US5340459A (en) * | 1991-11-22 | 1994-08-23 | Nec Corporation | Reactive sputtering system |
JPH0790572A (en) * | 1993-04-22 | 1995-04-04 | Balzers Ag | Apparatus and method for introduction of gas |
JPH10212575A (en) * | 1997-01-29 | 1998-08-11 | Sony Corp | Sputtering device |
JP2008266794A (en) * | 1997-09-10 | 2008-11-06 | Sony Corp | Device for controlling amount of gas to be sprayed in vacuum tank |
JP2007332434A (en) * | 2006-06-16 | 2007-12-27 | Showa Shinku:Kk | Film deposition apparatus |
WO2023132130A1 (en) * | 2022-01-07 | 2023-07-13 | 芝浦機械株式会社 | Surface treatment device |
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