JPS6444171U - - Google Patents
Info
- Publication number
- JPS6444171U JPS6444171U JP14074887U JP14074887U JPS6444171U JP S6444171 U JPS6444171 U JP S6444171U JP 14074887 U JP14074887 U JP 14074887U JP 14074887 U JP14074887 U JP 14074887U JP S6444171 U JPS6444171 U JP S6444171U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- card
- card according
- resin
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 27
- 230000001070 adhesive effect Effects 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- IJVRPNIWWODHHA-UHFFFAOYSA-N 2-cyanoprop-2-enoic acid Chemical compound OC(=O)C(=C)C#N IJVRPNIWWODHHA-UHFFFAOYSA-N 0.000 claims 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- 239000004831 Hot glue Substances 0.000 claims 1
- 229920000459 Nitrile rubber Polymers 0.000 claims 1
- 239000004830 Super Glue Substances 0.000 claims 1
- 229920001807 Urea-formaldehyde Polymers 0.000 claims 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims 1
- 229920002678 cellulose Polymers 0.000 claims 1
- 239000001913 cellulose Substances 0.000 claims 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 229920006174 synthetic rubber latex Polymers 0.000 claims 1
- 239000011111 cardboard Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
第１図ａ〜ｃは本考案の一実施例を示すもので
あり、第１図ａはＩＣカードの正面図、第１図ｂ
は同じく側面図、第１図ｃは同じく底面図、第２
図は第１図におけるＡ―Ａ矢視断面図、第３図は
第１図におけるＢ―Ｂ矢視断面図、第４図は従来
のＩＣカードを示す斜視図である。
１……プリント配線板、２……カード基板、３
……外部接続端子列、４……絵柄印刷ラベル、５
……ＩＣカード、６……カードフレーム、６ａ１
……第１の凹部、６ａ２……第２の凹部、７……
ＩＣチツプ、８……外部接続端子列、９……プリ
ント配線板、１０……絵柄印刷ラベル、１１……
プリント配線パターン、１２……ボンデイングワ
イヤ、１３……スルーホール、１４……ダイ用パ
ターン、１５……ダイボンデイングペースト、１
６……封止樹脂用枠、１７……エポキシ樹脂、１
８……弾性を有する第１の接着剤、１９……硬質
の第２の接着剤、２０……第３の接着剤。
Figures 1a to 1c show an embodiment of the present invention; Figure 1a is a front view of the IC card; Figure 1b is a front view of the IC card;
is also a side view, Figure 1c is a bottom view, and Figure 2 is a bottom view.
The figures are a sectional view taken along the line AA in FIG. 1, FIG. 3 is a sectional view taken along the line BB in FIG. 1, and FIG. 4 is a perspective view showing a conventional IC card. 1...Printed wiring board, 2...Card board, 3
...External connection terminal row, 4...Picture printed label, 5
...IC card, 6...Card frame, 6a 1
...First recess, 6a 2 ...Second recess, 7...
IC chip, 8...External connection terminal row, 9...Printed wiring board, 10...Picture printed label, 11...
Printed wiring pattern, 12...Bonding wire, 13...Through hole, 14...Die pattern, 15...Die bonding paste, 1
6... Frame for sealing resin, 17... Epoxy resin, 1
8... Elastic first adhesive, 19... Hard second adhesive, 20... Third adhesive.
Claims (1)
トされると共に他面側に外部接続端子列が形成さ
れたプリント配線板を、カードフレームに形成さ
れた凹部に取付けてなるＩＣカードにおいて、前
記ＩＣチツプを封止した樹脂部と、カードフレー
ムの凹部底面とを弾性を有する第１の接着剤を介
して接着し、かつ少なくとも前記プリント配線板
の外部接続端子列形成部分と対応した反対側の面
と、当該面が接するカードフレームの凹部面とを
硬質の第２の接着剤を介して接着し一体化したこ
とを特徴とするＩＣカード。 ２ 第１の接着剤としてα―シアノアクリレート
系の接着剤を用いるようにした実用新案登録請求
の範囲第１項記載のＩＣカード。 ３ 第１の接着剤として酢酸ビニル樹脂系の接着
剤を用いるようにした実用新案登録請求の範囲第
１項記載のＩＣカード。 ４ 第１の接着剤として塩化ビニル樹脂系の接着
剤を用いるようにした実用新案登録請求の範囲第
１項記載のＩＣカード。 ５ 第１の接着剤としてセルロース系の接着剤を
用いるようにした実用新案登録請求の範囲第１項
記載のＩＣカード。 ６ 第１の接着剤としてホツトメルト型の接着剤
を用いるようにした実用新案登録請求の範囲第１
項記載のＩＣカード。 ７ 第１の接着剤としてユリア樹脂系の接着剤を
用いるようにした実用新案登録請求の範囲第１項
記載のＩＣカード。 ８ 第１の接着剤としてクロロプレン系の接着剤
を用いるようにした実用新案登録請求の範囲第１
項記載のＩＣカード。 ９ 第１の接着剤としてニトリルゴム系の接着剤
を用いるようにした実用新案登録請求の範囲第１
項記載のＩＣカード。 １０ 第１の接着剤として合成ゴムラテツクス系
の接着剤を用いるようにした実用新案登録請求の
範囲第１項記載のＩＣカード。 １１ 第２の接着剤としてエポキシ樹脂系の接着
剤を用いるようにした実用新案登録請求の範囲第
１項記載のＩＣカード。 １２ 第２の接着剤としてフエノール樹脂系の接
着剤を用いるようにした実用新案登録請求の範囲
第１項記載のＩＣカード。 １３ 第２の接着剤としてポリウレタン系の接着
剤を用いるようにした実用新案登録請求の範囲第
１項記載のＩＣカード。[Claims for Utility Model Registration] 1. A printed wiring board having a resin-sealed IC chip mounted on one side and a row of external connection terminals formed on the other side is attached to a recess formed in a card frame. In the IC card, the resin portion encapsulating the IC chip and the bottom surface of the recess of the card frame are bonded via a first adhesive having elasticity, and at least a row of external connection terminals of the printed wiring board is formed. An IC card characterized in that a surface on the opposite side corresponding to the portion and a concave surface of a card frame in contact with the surface are bonded and integrated via a hard second adhesive. 2. The IC card according to claim 1, wherein an α-cyanoacrylate adhesive is used as the first adhesive. 3. The IC card according to claim 1, wherein a vinyl acetate resin adhesive is used as the first adhesive. 4. The IC card according to claim 1, wherein a vinyl chloride resin adhesive is used as the first adhesive. 5. The IC card according to claim 1, wherein a cellulose adhesive is used as the first adhesive. 6 Utility model registration claim 1 in which a hot melt adhesive is used as the first adhesive
IC card listed in section. 7. The IC card according to claim 1, wherein a urea resin adhesive is used as the first adhesive. 8 Utility model registration claim 1 in which a chloroprene adhesive is used as the first adhesive
IC card listed in section. 9 Utility model registration claim No. 1 in which a nitrile rubber adhesive is used as the first adhesive
IC card listed in section. 10. The IC card according to claim 1, wherein a synthetic rubber latex adhesive is used as the first adhesive. 11. The IC card according to claim 1, wherein an epoxy resin adhesive is used as the second adhesive. 12. The IC card according to claim 1, wherein a phenolic resin adhesive is used as the second adhesive. 13. The IC card according to claim 1, wherein a polyurethane adhesive is used as the second adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987140748U JPH0753988Y2 (en) | 1987-09-14 | 1987-09-14 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987140748U JPH0753988Y2 (en) | 1987-09-14 | 1987-09-14 | IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6444171U true JPS6444171U (en) | 1989-03-16 |
| JPH0753988Y2 JPH0753988Y2 (en) | 1995-12-13 |
Family
ID=31405204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987140748U Expired - Lifetime JPH0753988Y2 (en) | 1987-09-14 | 1987-09-14 | IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0753988Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006318508A (en) * | 2006-08-14 | 2006-11-24 | Toshiba Corp | Ic card |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5556639A (en) * | 1978-10-19 | 1980-04-25 | Cii | Strip for carrying device for processing electric signal and method of manufacturing same |
| JPS5626451A (en) * | 1979-05-17 | 1981-03-14 | Gao Ges Automation Org | Identification card having ic chip and method of manufacturing same |
| JPS6143388A (en) * | 1984-08-08 | 1986-03-01 | Mitsubishi Plastics Ind Ltd | Memory card |
| JPS61145696A (en) * | 1984-12-19 | 1986-07-03 | Matsushita Electric Ind Co Ltd | Ic card |
| JPS61241192A (en) * | 1985-04-12 | 1986-10-27 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | Method and device for manufacturing electronic identification card |
| JPS6280673U (en) * | 1985-11-11 | 1987-05-23 |
-
1987
- 1987-09-14 JP JP1987140748U patent/JPH0753988Y2/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5556639A (en) * | 1978-10-19 | 1980-04-25 | Cii | Strip for carrying device for processing electric signal and method of manufacturing same |
| JPS5626451A (en) * | 1979-05-17 | 1981-03-14 | Gao Ges Automation Org | Identification card having ic chip and method of manufacturing same |
| JPS6143388A (en) * | 1984-08-08 | 1986-03-01 | Mitsubishi Plastics Ind Ltd | Memory card |
| JPS61145696A (en) * | 1984-12-19 | 1986-07-03 | Matsushita Electric Ind Co Ltd | Ic card |
| JPS61241192A (en) * | 1985-04-12 | 1986-10-27 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | Method and device for manufacturing electronic identification card |
| JPS6280673U (en) * | 1985-11-11 | 1987-05-23 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006318508A (en) * | 2006-08-14 | 2006-11-24 | Toshiba Corp | Ic card |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0753988Y2 (en) | 1995-12-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6444171U (en) | ||
| JPS62185072U (en) | ||
| JPH031540U (en) | ||
| JPH0328742U (en) | ||
| JPS6446275U (en) | ||
| JPS63194773U (en) | ||
| JPS6444170U (en) | ||
| JPH01145140U (en) | ||
| JPS6318277U (en) | ||
| JPS6444637U (en) | ||
| JPS61133373U (en) | ||
| JPS59182926U (en) | electronic components | |
| JPS62114772U (en) | ||
| JPS6092818U (en) | Chip type electronic components | |
| JPH0359639U (en) | ||
| JPH01125544U (en) | ||
| JPS6099542U (en) | Chip carrier type semiconductor device | |
| JPS6420738U (en) | ||
| JPH02102740U (en) | ||
| JPS6344449U (en) | ||
| JPS60144242U (en) | Resin-encapsulated integrated circuit | |
| JPS62201941U (en) | ||
| JPS59177963U (en) | light emitting diode | |
| JPH0385636U (en) | ||
| JPH01107157U (en) |