JPS61145696A - Ic card - Google Patents
Ic cardInfo
- Publication number
- JPS61145696A JPS61145696A JP59269022A JP26902284A JPS61145696A JP S61145696 A JPS61145696 A JP S61145696A JP 59269022 A JP59269022 A JP 59269022A JP 26902284 A JP26902284 A JP 26902284A JP S61145696 A JPS61145696 A JP S61145696A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- wire
- rubber
- gel
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 12
- 239000004020 conductor Substances 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- -1 bonding wire Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はＩＣチップをその内部に含むＩＣカードの構成
法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of constructing an IC card containing an IC chip therein.
従来の技術
ＩＣカードのコンセプトおよびＩＣカード構成法につい
ては、たとえば、Ｐａｕｌ Ｐａｒｍｅｎｔｉｅｒ著″
ＩＣ１ｅｃｔｒｏｎｉｃ Ｍｅｍｏｒｙ Ｃａｒｄ ：
Ｔｅｃｈｎｏｌｏｇｉｅｓａｒｒｏｎｎｄ ｉｔ Ｉ
ＭＣ１９８２Ｐｒｏｃｅｅｄｉｎｇｓ 、 Ｔｏｋｙｏ
。Conventional technology IC card concepts and IC card construction methods are discussed, for example, in Paul Parmentier's "
IC1 electronic Memory Card:
Technology Arronnd It I
MC1982Proceedings, Tokyo
.
ＭＩＬ７２４−２６．１９Ｂ２ＰＰ４３９〜４４６に示
されている。MIL724-26.19B2PP439-446.
この文献の中にも示されているが、このＩＣカードのコ
ンセプトは、名刺サイズ大の広く使用されている磁気カ
ードの安全性をよシ高めるために発案されたものであり
、従来と同様の磁気ストライプを有するＰｖＣカードの
内部にＩＣチップを埋設し、その電極部をカード表面に
露出させる構造のものである。ＩＣを埋設する方法とし
て、に）従来のプラスチック、モールドされたＤＩＰパ
ッケージを製造するのと同じ樹脂インジェクション成型
による方法（一般にトランスファーモールドと称−ｊ
） 、（ｉｌ）カードの一部に穴をあけたり、くぼみを
作って、その部分にあらかじめパッケージに封入された
ＩＣ−１ｉ装着する方法、（ｆｉｌ） Ｉ Ｃチップを
ｐｖｃカードを作る過程で内部に埋設する方法、などが
示されている。As shown in this document, the concept of this IC card was devised to improve the security of widely used business card-sized magnetic cards; It has a structure in which an IC chip is embedded inside a PvC card having a magnetic stripe, and its electrode portions are exposed on the card surface. The method for embedding the IC is the same resin injection molding method (generally called transfer molding) used to manufacture conventional plastic molded DIP packages.
), (il) A method of drilling a hole or making a recess in a part of the card and attaching the IC-1i pre-packaged to that part, (fil) A method of inserting an IC chip inside the PVC card in the process of making a PVC card. It shows how to bury it.
また、このＩＣカードは上述のように磁気カードの延長
線上にあるもの左′シて発案されているため、その機械
的強度、とりわけ、曲げ耐性に対しさびしい要求がなさ
れている。Furthermore, since this IC card was invented as an extension of the magnetic card as mentioned above, there are strict requirements for its mechanical strength, particularly its bending resistance.
発明が解決しようとする問題点
上述のようにＩＣカードは曲げ耐性に対し強い要求がな
されている。従来、ＩＣチップをパッケージに封入する
場合、各種パッケージ形式、すなわち、プラスチックＤ
ＩＰ、セラミックＤＩＰ 。Problems to be Solved by the Invention As mentioned above, IC cards are required to have strong bending resistance. Conventionally, when encapsulating an IC chip in a package, various package formats were used, namely plastic D
IP, ceramic DIP.
チップキャリヤ、リードレステップキャリヤ、テープキ
ャリヤなどにおいて上述のような曲げ耐性はそれほど重
視されていなかった。また、前述したＩＣカード内にＩ
Ｃを埋設する３種の方法について獣曲げ耐性については
何ら記述されておらず、曲げ耐性を向上させる手段も何
ら示唆されていない。したがって従来技術の延長線上で
、ＩＣカードにＩＣチップを埋設することを試みても、
良好な曲げ耐性を有する１０カードを得ることは極めて
困難である。In chip carriers, leadless step carriers, tape carriers, etc., the above-mentioned bending resistance has not been given much importance. In addition, there is an I/O in the IC card mentioned above.
Regarding the three methods of embedding C, there is no description of the bending resistance, nor is there any suggestion of means for improving the bending resistance. Therefore, even if an attempt is made to embed an IC chip in an IC card as an extension of the conventional technology,
It is extremely difficult to obtain 10 cards with good bending resistance.
本発明はかかる点に鑑みてなされたものであり、簡単な
構造により曲げ耐性の良好なＩ（ｔカードを得ることを
目的としている。The present invention has been made in view of this point, and aims to obtain an I(t card) with a simple structure and good bending resistance.
問題点を解決するための手段
ワイヤボンディング技術によりＩＣと回路配線部を接続
し、ＩＣチップおよびボンディングワイヤの周辺をゲル
状物質で覆った後、ＰＶＣなどの樹脂で周辺を被覆して
ＩＣカードを構成しようとするものである。Means to solve the problem After connecting the IC and the circuit wiring part using wire bonding technology and covering the area around the IC chip and bonding wire with a gel-like substance, the area is covered with resin such as PVC to form an IC card. This is what we are trying to configure.
作用
本発明は上述した構成により１０チツプをＩＣカード内
に診いて、ゴム弾性接着剤、ボンディングワイヤ、ゲル
状物質のように曲げ応力に対し柔軟に対応しうる材料で
保持しているため、曲げ応力に対し、ＩＣチップの破損
、ボンディングワイヤの断線などの生じる可能性が極め
て少ないＩＣカードを得ることができる・
実施例
図ば本発明め一実施例を示すＸＯカード構成断面図であ
る。図にお゛いて、゛薄型基板１には、□ワイヤポンデ
ィ゛ングパッドｉ１配線′３パおよび端子３“があらあ
・しめパター／化されて形成されているものとする。′
これらのパター′ンはＩ（ｊチップの゛電極ｉＩｃカー
ド表面部にまで連結、導出するためのもめ′であり、た
とえば６０μｍ〜１００μｍ程度の厚すのポリイミドあ
るいはポリエステルのような有機絶線基板の表面に薄い
銅箔を張り合わせ、その銅箔を部分的にエッテンク処理
により除“去して得られる。 ゛ −・ ・
パ、 “ ・ −・・”−′Ｉ’ ｃ−７−ツプ４は、
まずＪゴム弾゛性接着剤２により、薄型基板１にゴム弾
性を有する状態でそのサブストレート部がダイスボンデ
ィングされ、その表面にあるボンディングパッド部はボ
ンディングワイヤ６によりワイヤボンディングパッド３
と接続される。ワイヤボンディングパッド３の表面は必
要に応じアルミあるいは金メッキが施されるべきである
のは云うまでもない。ワイヤボンディングパッド３は配
線３′を介して端子３“に電気的に接続されている。第
１図において、枠７は、ＩＣテップ４およびボンディン
グワイヤ６を含む領域を囲むものであり、一般的には樹
脂材料で作られ図示しないが接着剤などで、パターン形
成された薄型基板１にとりつけられ、その枠で囲まれた
領域内にディスペンサーなどによりゲル素材が注入され
、後に加熱その他の物理化学的処理によりゲル８が形成
される。図より明らかなように、ゲル６はＩ（ｊチップ
４およびボンディングワイヤ６を被覆するものであり、
曲げ応力に対し、ＩＣチップ４およびボンディングワイ
ヤ６を保護するものである。また、導体ゴム８は銀ベー
ストなどの導電性接着剤９により端子３″ と電気的
に接続される。この導体ゴム８は端子３″ のパターン
と同じパターンを有するものであり、端子３″ の電極
をＩＣカード表面にまで導くものである。導体ゴム８は
第１図に示されている状態ではゴムの各電極間に機械的
なつながシはないが、製作時には工０カードの外側に引
き出されている部分で機械的接続を施しておき、ＩＣカ
ードの端子パターンと接続した後ＩＣカードからはみ出
している部分を切断するなどの手段をとればよい。なお
この場合、ゴムのＩＣカードからはみ出している部分を
少し残して切断すれば、その残された部分は電気的接続
リードとをり使い勝手が向上する場合もあシうるのは勿
論である。第１図において、１ｏはＰＶＣ、ポリエステ
ル、エポキシなどの樹脂であり、ＩＣチップ４、枠７、
ゲル６、導体ゴム８が装着、充てんされた後に塗布、硬
化により形成される。樹脂１ｏの塗布厚さは、ＩＣチッ
プ４、枠７、ゲル６′５Ｉ：完全に被覆し、導体ゴム８
０表面を被覆しない厚さとすべきであり、そのためには
導体ゴム８の厚さは、枠７の高さより若干厚手のものと
すべきである。なお、導体ゴム８のＩＣカード表面に出
る部分は他の回路部との接続端子となるため、金メッキ
などの手段によりその表面を安定化するのが望ましいの
は云うまでもない。また、以上の説明においては、ＩＣ
チップ４をゴム弾性接着剤で接着する方法について述べ
たがＩＣチップのサブストレートラ回路アースに接続す
るため薄型基板１上にダストパッドを設け、導電性のあ
るゴム弾性接着剤でＩＣテップ４ｆ：接着してもよいの
は勿論である。Function The present invention has the above-described structure in which 10 chips are placed in an IC card and held with a material that can flexibly respond to bending stress, such as rubber elastic adhesive, bonding wire, or gel material. It is possible to obtain an IC card in which the possibility of damage to the IC chip, breakage of bonding wires, etc. due to stress is extremely low. Embodiment FIG. 1 is a cross-sectional view of the configuration of an XO card showing a first embodiment of the present invention. In the figure, it is assumed that ``wire bonding pad i1 wiring''3'' and terminal 3'' are formed on the thin substrate 1 in a round pattern.''
These patterns are a pattern for connecting and leading out the electrodes of the I (J chip) to the surface of the IC card. It is obtained by pasting a thin copper foil on the surface and partially removing the copper foil by ettenching.
Pa, "・-・・"-'I' c-7-tsupu4 is,
First, the substrate part is die-bonded to the thin substrate 1 in a rubber elastic state using the J rubber elastic adhesive 2, and the bonding pad part on the surface is bonded to the wire bonding pad 3 by the bonding wire 6.
connected to. Needless to say, the surface of the wire bonding pad 3 should be plated with aluminum or gold, if necessary. The wire bonding pad 3 is electrically connected to the terminal 3'' via the wiring 3'. In FIG. is made of a resin material and is attached to a patterned thin substrate 1 with an adhesive (not shown), and a gel material is injected into the area surrounded by the frame using a dispenser or the like, and then heated or otherwise subjected to physical and chemical processes. A gel 8 is formed by this process.As is clear from the figure, the gel 6 covers the I(j chip 4 and the bonding wire 6,
This protects the IC chip 4 and bonding wire 6 from bending stress. Further, the conductive rubber 8 is electrically connected to the terminal 3'' by a conductive adhesive 9 such as silver base.The conductive rubber 8 has the same pattern as that of the terminal 3''. This is to guide the electrodes to the surface of the IC card.The conductor rubber 8 has no mechanical connection between the rubber electrodes in the state shown in Figure 1, but when it is manufactured, it is pulled out to the outside of the card. You can make a mechanical connection at the part that is covered with rubber, and after connecting it with the terminal pattern of the IC card, cut off the part that protrudes from the IC card. Of course, it may be possible to improve the usability by leaving a small portion of the remaining part as an electrical connection lead.In Fig. 1, 1o is made of PVC, polyester, It is a resin such as epoxy, and includes an IC chip 4, a frame 7,
After the gel 6 and conductive rubber 8 are installed and filled, they are applied and cured. The coating thickness of resin 1o is as follows: IC chip 4, frame 7, gel 6'5I: completely covered, conductor rubber 8
The thickness of the conductive rubber 8 should be set so as not to cover the zero surface, and for this purpose the thickness of the conductive rubber 8 should be slightly thicker than the height of the frame 7. Incidentally, since the portion of the conductive rubber 8 exposed on the surface of the IC card serves as a connection terminal with other circuit sections, it goes without saying that it is desirable to stabilize the surface by means such as gold plating. In addition, in the above explanation, IC
The method of bonding the chip 4 with a rubber elastic adhesive has been described.A dust pad is provided on the thin substrate 1 for connection to the substrate circuit ground of the IC chip, and the IC tip 4f is bonded with a conductive rubber elastic adhesive. Of course, it may be bonded.
発明の効果
以上に述べてきたように本発明によれば、きわめて簡単
な構成により、曲げ耐性の強いＩＣカードを得ることが
でき実用的にきわめて有用である。Effects of the Invention As described above, according to the present invention, an IC card with high bending resistance can be obtained with an extremely simple structure, and is extremely useful in practice.
図は本発明の一実施例を示すＩＣカード構成断面図であ
る。
１・・・・・・薄型基板、２・・・・・・ゴム弾性接着
剤、３・・・・・・ワイヤボンディングパッド、３′・
・・・・・配ｍ、３”−・・・・・端子、４・・・・・
・ＩＣチップ、６１９１１９．ボンディングワイヤ、６
・・・・・・ゲル、７・・・・・・枠、８・・・・・・
導体ゴム、９・・・・・・導電性接着剤、１ｏ・・・・
・・樹脂。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名５ボ
ンテンンクｔルトＹ
３、ワ伯イボンテ身ングンゾツド
手続補正書（方式）
昭和６０年６月２を日The figure is a sectional view of an IC card configuration showing an embodiment of the present invention. 1... Thin substrate, 2... Rubber elastic adhesive, 3... Wire bonding pad, 3'.
・・・・・・Measurement, 3”-・・・Terminal, 4・・・・・・
・IC chip, 619119. Bonding wire, 6
...Gel, 7...Frame, 8...
Conductive rubber, 9... Conductive adhesive, 1o...
··resin. Name of agent Patent attorney Toshio Nakao and one other person
Claims (1)
ングパッドパターンが形成された薄型絶縁性基板上にＩ
Ｃチップのサブストレートをゴム弾性接着剤で接着し、
上記基板上のワイヤボンディングパッドとＩＣチップ上
に形成されているボンディングパッドをボンディングワ
イヤにより接続し、上記ワイヤボンディングパッドおよ
びＩＣチップを囲む枠を上記基板上に接着し、この枠内
にＩＣチップおよびボンディングワイヤを保護するため
のゲル素材を充てんし、上記端子パターン部上面に、上
記ＩＣチップを囲む枠の高さより若干厚手の上記端子パ
ターンと同じパターンを有する導体ゴムを導電性接着剤
により接着し、この基板上に、上記ＩＣチップを囲む枠
および、そこに充てんしたゲル素材を覆い、かつ上記導
電性ゴム表面が露出するような高さに熱硬化性樹脂を塗
布し、上記ゲル素材と熱硬化性樹脂および導電性接着剤
を加熱加圧により、ゲル化，硬化させることにより構成
されることを特徴とするＩＣカード。The I
Glue the C-chip substrate with rubber elastic adhesive,
A wire bonding pad on the substrate and a bonding pad formed on the IC chip are connected by a bonding wire, a frame surrounding the wire bonding pad and the IC chip is adhered to the substrate, and the IC chip and the Filled with a gel material to protect the bonding wires, a conductive rubber having the same pattern as the terminal pattern and slightly thicker than the height of the frame surrounding the IC chip is adhered to the upper surface of the terminal pattern portion using a conductive adhesive. , A thermosetting resin is applied onto this substrate at a height that covers the frame surrounding the IC chip and the gel material filled therein, and exposes the surface of the conductive rubber. An IC card characterized in that it is constructed by gelling and curing a curable resin and a conductive adhesive by applying heat and pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59269022A JPS61145696A (en) | 1984-12-19 | 1984-12-19 | Ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59269022A JPS61145696A (en) | 1984-12-19 | 1984-12-19 | Ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61145696A true JPS61145696A (en) | 1986-07-03 |
Family
ID=17466582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59269022A Pending JPS61145696A (en) | 1984-12-19 | 1984-12-19 | Ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61145696A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6444171U (en) * | 1987-09-14 | 1989-03-16 | ||
| US4921160A (en) * | 1988-02-29 | 1990-05-01 | American Telephone And Telegraph Company | Personal data card and method of constructing the same |
| US5272596A (en) * | 1991-06-24 | 1993-12-21 | At&T Bell Laboratories | Personal data card fabricated from a polymer thick-film circuit |
| EP0637841A3 (en) * | 1993-08-04 | 1995-11-29 | Hitachi Ltd | Thin film semiconductor device and fabrication method. |
| US5856662A (en) * | 1995-06-29 | 1999-01-05 | Hitachi Maxell, Ltd. | Information carrier and process for producing same |
| EP0484353B2 (en) † | 1989-07-24 | 2000-11-29 | SCHNEIDER, Edgar | Substrate element with at least one integrated circuit, in particular a substrate element for inclusion in chip cards |
| JP2013109398A (en) * | 2011-11-17 | 2013-06-06 | Fujitsu Semiconductor Ltd | Semiconductor module, method for manufacturing semiconductor module, and card |
| US11081416B2 (en) | 2017-11-08 | 2021-08-03 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Configuring a sealing structure sealing a component embedded in a component carrier for reducing mechanical stress |
-
1984
- 1984-12-19 JP JP59269022A patent/JPS61145696A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6444171U (en) * | 1987-09-14 | 1989-03-16 | ||
| US4921160A (en) * | 1988-02-29 | 1990-05-01 | American Telephone And Telegraph Company | Personal data card and method of constructing the same |
| EP0484353B2 (en) † | 1989-07-24 | 2000-11-29 | SCHNEIDER, Edgar | Substrate element with at least one integrated circuit, in particular a substrate element for inclusion in chip cards |
| US5272596A (en) * | 1991-06-24 | 1993-12-21 | At&T Bell Laboratories | Personal data card fabricated from a polymer thick-film circuit |
| US6051877A (en) * | 1993-08-04 | 2000-04-18 | Hitachi, Ltd. | Semiconductor device and fabrication method |
| US5689136A (en) * | 1993-08-04 | 1997-11-18 | Hitachi, Ltd. | Semiconductor device and fabrication method |
| EP0637841A3 (en) * | 1993-08-04 | 1995-11-29 | Hitachi Ltd | Thin film semiconductor device and fabrication method. |
| US6291877B1 (en) | 1993-08-04 | 2001-09-18 | Hitachi, Ltd. | Flexible IC chip between flexible substrates |
| US6486541B2 (en) | 1993-08-04 | 2002-11-26 | Hitachi, Ltd. | Semiconductor device and fabrication method |
| US5856662A (en) * | 1995-06-29 | 1999-01-05 | Hitachi Maxell, Ltd. | Information carrier and process for producing same |
| JP2013109398A (en) * | 2011-11-17 | 2013-06-06 | Fujitsu Semiconductor Ltd | Semiconductor module, method for manufacturing semiconductor module, and card |
| US11081416B2 (en) | 2017-11-08 | 2021-08-03 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Configuring a sealing structure sealing a component embedded in a component carrier for reducing mechanical stress |
| EP3483929B1 (en) * | 2017-11-08 | 2022-04-20 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with electrically conductive and insulating layers and a component embedded therein and manufacturing method thereof |
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