JPS6444045A - Wiring structure of semiconductor device - Google Patents

Wiring structure of semiconductor device

Info

Publication number
JPS6444045A
JPS6444045A JP20109287A JP20109287A JPS6444045A JP S6444045 A JPS6444045 A JP S6444045A JP 20109287 A JP20109287 A JP 20109287A JP 20109287 A JP20109287 A JP 20109287A JP S6444045 A JPS6444045 A JP S6444045A
Authority
JP
Japan
Prior art keywords
film
approx
thick
electromigration resistance
excellent electromigration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20109287A
Other languages
Japanese (ja)
Other versions
JPH06103694B2 (en
Inventor
Takuya Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62201092A priority Critical patent/JPH06103694B2/en
Publication of JPS6444045A publication Critical patent/JPS6444045A/en
Publication of JPH06103694B2 publication Critical patent/JPH06103694B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To obtain a structure having excellent electromigration resistance by covering the bottom of a main wiring material with a different type of conductive film having excellent electromigration resistance, and covering the side face and the upper face with an insulating film which contains main ingredients of the essential wiring material as constituents. CONSTITUTION:A titanium-tungsten alloy film 5 is formed by a sputtering method approx. 2000Angstrom thick on an interlayer insulating film 4, and an aluminum film 6 is further formed approx. 1mum thick by a sputtering method. Then, the films 6, 5 are patterned by a normal photoresist step to form it in a predetermined wiring shape, and a resist is then removed. Thereafter, it is dipped in water at approx. 60-100 deg.C to form an aluminum hydroxide film 7 on the film 6 approx. 2000Angstrom thick. Thus. a wiring structure having excellent electromigration resistance can be obtained.
JP62201092A 1987-08-11 1987-08-11 Wiring structure of semiconductor device Expired - Lifetime JPH06103694B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62201092A JPH06103694B2 (en) 1987-08-11 1987-08-11 Wiring structure of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62201092A JPH06103694B2 (en) 1987-08-11 1987-08-11 Wiring structure of semiconductor device

Publications (2)

Publication Number Publication Date
JPS6444045A true JPS6444045A (en) 1989-02-16
JPH06103694B2 JPH06103694B2 (en) 1994-12-14

Family

ID=16435263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62201092A Expired - Lifetime JPH06103694B2 (en) 1987-08-11 1987-08-11 Wiring structure of semiconductor device

Country Status (1)

Country Link
JP (1) JPH06103694B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05182969A (en) * 1992-01-06 1993-07-23 Nec Yamagata Ltd Semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
APPLIED PHYSICS LETTERS=1976 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05182969A (en) * 1992-01-06 1993-07-23 Nec Yamagata Ltd Semiconductor device

Also Published As

Publication number Publication date
JPH06103694B2 (en) 1994-12-14

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