JPS6437535A - Thin film semiconductor element - Google Patents

Thin film semiconductor element

Info

Publication number
JPS6437535A
JPS6437535A JP62193541A JP19354187A JPS6437535A JP S6437535 A JPS6437535 A JP S6437535A JP 62193541 A JP62193541 A JP 62193541A JP 19354187 A JP19354187 A JP 19354187A JP S6437535 A JPS6437535 A JP S6437535A
Authority
JP
Japan
Prior art keywords
electrode
layer
insulating layer
wiring
shorting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62193541A
Other languages
Japanese (ja)
Inventor
Naoki Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP62193541A priority Critical patent/JPS6437535A/en
Publication of JPS6437535A publication Critical patent/JPS6437535A/en
Pending legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Thin Film Transistor (AREA)

Abstract

PURPOSE:To prevent the shorting in the crossed parts of the wiring of a 1st electrode and the wiring of a 2nd electrode while averting the complication of stages by forming a 1st insulating layer and the 1st electrode to substantially equal thicknesses and laminating a 2nd insulating layer thereon. CONSTITUTION:The insulating film 3 consisting of silicon nitride (SiNx) is formed atop a glass substrate 1. The 1st insulating layer 3a constituting the lower layer of the insulating film 3 has the same layer thickness as the layer thickness of the gate electrode 2 and the surfaces of the gate electrode 2 and the 1st insulating layer 3a are flat. The 2nd insulating layer 3b constituting the upper layer is formed atop the same. An a-Si:H (amorphous silicon added with hydrogen atom) semiconductor layer 4 and an n<+>a-Si:H ohmic contact layer 5 are successively laminated and formed in this order on the insulating film 3. Since the 2nd insulating layer 3b is formed flatly on the 1st electrode 2 and the 1st insulating layer 3a in such a manner, the shorting between the 1st electrode 2 and the 2nd electrode 7 is no longer generated and the number of shorting in the crossed parts between the wiring of the gate electrode 2 and the wiring of the drain electrode 7 is decreased.
JP62193541A 1987-07-31 1987-07-31 Thin film semiconductor element Pending JPS6437535A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62193541A JPS6437535A (en) 1987-07-31 1987-07-31 Thin film semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62193541A JPS6437535A (en) 1987-07-31 1987-07-31 Thin film semiconductor element

Publications (1)

Publication Number Publication Date
JPS6437535A true JPS6437535A (en) 1989-02-08

Family

ID=16309787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62193541A Pending JPS6437535A (en) 1987-07-31 1987-07-31 Thin film semiconductor element

Country Status (1)

Country Link
JP (1) JPS6437535A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100277501B1 (en) * 1998-02-16 2001-01-15 윤종용 LCD and its manufacturing method
KR100333983B1 (en) * 1999-05-13 2002-04-26 윤종용 thin film transistor array panel for liquid crystal display having wide viewing angle and manufacturing method thereof
KR100333984B1 (en) * 1999-06-03 2002-04-26 윤종용 Liquid crystal display and manufacturing method thereof
KR100351874B1 (en) * 1999-09-14 2002-09-12 엘지.필립스 엘시디 주식회사 Thin film transistor liquid crystal display device
WO2006117907A1 (en) * 2005-04-28 2006-11-09 Sharp Kabushiki Kaisha Methods for manufacturing semiconductor element and circuit board, and semiconductor element and circuit board
WO2006117909A1 (en) * 2005-04-28 2006-11-09 Sharp Kabushiki Kaisha Pattern thin film, method for manufacturing semiconductor element and circuit board, resist material, semiconductor element and circuit board
US7961263B2 (en) 1997-11-20 2011-06-14 Samsung Electronics Co., Ltd. Liquid crystal displays and manufacturing methods thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7961263B2 (en) 1997-11-20 2011-06-14 Samsung Electronics Co., Ltd. Liquid crystal displays and manufacturing methods thereof
KR100277501B1 (en) * 1998-02-16 2001-01-15 윤종용 LCD and its manufacturing method
KR100333983B1 (en) * 1999-05-13 2002-04-26 윤종용 thin film transistor array panel for liquid crystal display having wide viewing angle and manufacturing method thereof
KR100333984B1 (en) * 1999-06-03 2002-04-26 윤종용 Liquid crystal display and manufacturing method thereof
KR100351874B1 (en) * 1999-09-14 2002-09-12 엘지.필립스 엘시디 주식회사 Thin film transistor liquid crystal display device
WO2006117907A1 (en) * 2005-04-28 2006-11-09 Sharp Kabushiki Kaisha Methods for manufacturing semiconductor element and circuit board, and semiconductor element and circuit board
WO2006117909A1 (en) * 2005-04-28 2006-11-09 Sharp Kabushiki Kaisha Pattern thin film, method for manufacturing semiconductor element and circuit board, resist material, semiconductor element and circuit board
US8283218B2 (en) 2005-04-28 2012-10-09 Sharp Kabushiki Kaisha Production methods of a patterned thin film, semiconductor element, and circuit substrate using fluid resist material

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