JPS6431496A - Manufacture of ceramics wiring board - Google Patents

Abstract

PURPOSE:To construct a fine pattern circuit and prepare a wiring board inexpensively by forming a metal layer on the surface of a ceramics substrate by a metallizing method followed by the formation of a circuit, and forming a resistance layer by printing and baking a resistor paste on the wiring board at a desired portion of the same after heating the same, and further trimming said resistance layer at need. CONSTITUTION:A circuit is formed by etching. By this method, a fine pattern having its line width and interline interval, both being 30mum, can be formed of a base metal conductor of reduced wiring resistance. In succession, the ceramics substrate 1 is heated in the nitrogen atmosphere. The temperature of the heating preferably ranges from 400 to 1000 deg.C. Although the time required for the heating is not particularly limited, a range from 1 to 100 minutes is prefable. The heating may be done in the nitrogen atmosphere or inclusion of a small amount of oxygen of 2-200PPM may be allowed at need. Successively, a resistor paste is printed on the ceramics substrate 1 on which the circuit is formed as described above, and then dried and baked to form a resistor layer 3.