JPS6490589A - Manufacture of ceramic circuit board fired at low temperature - Google Patents

Manufacture of ceramic circuit board fired at low temperature

Info

Publication number
JPS6490589A
JPS6490589A JP24842587A JP24842587A JPS6490589A JP S6490589 A JPS6490589 A JP S6490589A JP 24842587 A JP24842587 A JP 24842587A JP 24842587 A JP24842587 A JP 24842587A JP S6490589 A JPS6490589 A JP S6490589A
Authority
JP
Japan
Prior art keywords
sheet
fired
manufacture
circuit board
low temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24842587A
Other languages
Japanese (ja)
Inventor
Shigeji Muramatsu
Shoichi Iwai
Yoichi Harayama
Takashi Kurihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP24842587A priority Critical patent/JPS6490589A/en
Publication of JPS6490589A publication Critical patent/JPS6490589A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To easily obtain a ceramic board without oxidizing a copper conductor by calcining a green sheet for the board, removing organic binder, then forming a copper wiring pattern on the sheet, and then firing it. CONSTITUTION:A green sheet for a ceramic board is fired at a predetermined temperature in an oxidative atmosphere, and organic binder in the sheet is decomposed and removed. Copper paste is filled in the through hole of the calcined green sheet obtained in this manner, and copper paste is screen printed on the sheet in a predetermined circuit pattern. Predetermined number of the sheets 12 obtained in this manner are set at a jig 10, and fired in a nonoxidative atmosphere. The calcined sheets are softened in its glass component by the firing, and moved to be integrated.
JP24842587A 1987-10-01 1987-10-01 Manufacture of ceramic circuit board fired at low temperature Pending JPS6490589A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24842587A JPS6490589A (en) 1987-10-01 1987-10-01 Manufacture of ceramic circuit board fired at low temperature

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24842587A JPS6490589A (en) 1987-10-01 1987-10-01 Manufacture of ceramic circuit board fired at low temperature

Publications (1)

Publication Number Publication Date
JPS6490589A true JPS6490589A (en) 1989-04-07

Family

ID=17177932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24842587A Pending JPS6490589A (en) 1987-10-01 1987-10-01 Manufacture of ceramic circuit board fired at low temperature

Country Status (1)

Country Link
JP (1) JPS6490589A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5013081A (en) * 1990-03-13 1991-05-07 Huron/St. Clair Incorporated Vehicle spoiler construction
JPH03133160A (en) * 1989-10-06 1991-06-06 Internatl Business Mach Corp <Ibm> Gas-tight package and its manufacture
JPH0615060A (en) * 1991-07-04 1994-01-25 Silver Denken Kk Static electricity remover for renting device for ball of japanese pinball game @(3754/24)pachinko)
US5346274A (en) * 1993-07-16 1994-09-13 General Motors Corporation Spoiler to rear deck lid assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6263488A (en) * 1985-09-13 1987-03-20 株式会社東芝 Manufacturing thick film substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6263488A (en) * 1985-09-13 1987-03-20 株式会社東芝 Manufacturing thick film substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03133160A (en) * 1989-10-06 1991-06-06 Internatl Business Mach Corp <Ibm> Gas-tight package and its manufacture
US5013081A (en) * 1990-03-13 1991-05-07 Huron/St. Clair Incorporated Vehicle spoiler construction
JPH0615060A (en) * 1991-07-04 1994-01-25 Silver Denken Kk Static electricity remover for renting device for ball of japanese pinball game @(3754/24)pachinko)
US5346274A (en) * 1993-07-16 1994-09-13 General Motors Corporation Spoiler to rear deck lid assembly

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