JPS6431493A - Metallized structure of ceramics substrate - Google Patents
Metallized structure of ceramics substrateInfo
- Publication number
- JPS6431493A JPS6431493A JP18827587A JP18827587A JPS6431493A JP S6431493 A JPS6431493 A JP S6431493A JP 18827587 A JP18827587 A JP 18827587A JP 18827587 A JP18827587 A JP 18827587A JP S6431493 A JPS6431493 A JP S6431493A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- ceramics
- baking
- layer
- ceramics substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
PURPOSE:To enhance the strength of metallization and solderability by forming in succession on a ceramics substrate a baking layer of metal paste, which contains a predetermined amount of ceramics components involved in the substrate with respect to metal components involved in the same, and a metal layer. CONSTITUTION:Metallized films 2, 3 are formed on the surface of a ceramics substrate 1 with a 2MgO.2Al2O3.5SiO2 dopant. A baking layer 2 is formed by printing a paste containing about 5-15wt.% of the ceramics component of the ceramics substrate with respect to the metal component of the same on a metal paste made of metal components such as Pd, Ag, Ag-Pd, and Cd, etc., and baking the former on the latter. The metal layer 3 is formed on said baking layer 2 by printing or baking a metal paste involving neither frit nor any ceramics component on said baking layer 2 or by electroplating the former to the latter. Upon formation of a wiring pattern and a terminal part on the ceramics substrate, a wiring pattern is formed on the surface of the ceramics substrate 1 with use of the baking layer 2, and further the metal layer 3 is formed only on a portion in need of soldering, such as a terminal portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18827587A JPS6431493A (en) | 1987-07-28 | 1987-07-28 | Metallized structure of ceramics substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18827587A JPS6431493A (en) | 1987-07-28 | 1987-07-28 | Metallized structure of ceramics substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6431493A true JPS6431493A (en) | 1989-02-01 |
Family
ID=16220808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18827587A Pending JPS6431493A (en) | 1987-07-28 | 1987-07-28 | Metallized structure of ceramics substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6431493A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02196491A (en) * | 1989-01-25 | 1990-08-03 | Toshiba Corp | Thick film circuit board |
JPH08239265A (en) * | 1994-12-23 | 1996-09-17 | Korea Advanced Inst Of Sci Technol | Dielectric ceramic composition,laminated ceramic capacitor made thereof and its production |
US8088495B2 (en) | 2003-01-14 | 2012-01-03 | Sharp Kabushiki Kaisha | Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof |
-
1987
- 1987-07-28 JP JP18827587A patent/JPS6431493A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02196491A (en) * | 1989-01-25 | 1990-08-03 | Toshiba Corp | Thick film circuit board |
JPH08239265A (en) * | 1994-12-23 | 1996-09-17 | Korea Advanced Inst Of Sci Technol | Dielectric ceramic composition,laminated ceramic capacitor made thereof and its production |
US8088495B2 (en) | 2003-01-14 | 2012-01-03 | Sharp Kabushiki Kaisha | Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof |
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