JPS6454720A - Manufacture of laminated type ceramic chip capacitor - Google Patents
Manufacture of laminated type ceramic chip capacitorInfo
- Publication number
- JPS6454720A JPS6454720A JP21198787A JP21198787A JPS6454720A JP S6454720 A JPS6454720 A JP S6454720A JP 21198787 A JP21198787 A JP 21198787A JP 21198787 A JP21198787 A JP 21198787A JP S6454720 A JPS6454720 A JP S6454720A
- Authority
- JP
- Japan
- Prior art keywords
- layers
- electrode layer
- capacitor element
- metal
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Capacitors (AREA)
Abstract
PURPOSE:To improve the stability of the connection of an internal electrode layer and an external electrode layer by interposing and connecting a metal of a different kind between the internal electrode layer and the external electrode layer exposed to the sidewall surface of both ends of an element. CONSTITUTION:Conductive paste mainly comprising a metal Pd is applied onto the surface of a ceramic dielectric 4 processed to a sheet shape to a desired figure shape, and a required number of the sheets are laminated and monolithic- molded, cut and worked, and baked, thus manufacturing a piece-shaped capacitor element. Electroless plating metallic layers 6 are attached to the broken-out section and peripheral section of an exposed stratiform internal electrode layer 5 in the capacitor element. The layer 6 used at that time is composed of a metal different from the layer 5. Conductive paste mainly comprising silver is applied selectively so as to coat the layers 6 at a pair of opposed both end sections of the capacitor element, and baked at a high temperature, thus forming external electrode layers 7. Accordingly, the stability of the connection of the layers 5 and the layers 7 is improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21198787A JPS6454720A (en) | 1987-08-26 | 1987-08-26 | Manufacture of laminated type ceramic chip capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21198787A JPS6454720A (en) | 1987-08-26 | 1987-08-26 | Manufacture of laminated type ceramic chip capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6454720A true JPS6454720A (en) | 1989-03-02 |
Family
ID=16615014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21198787A Pending JPS6454720A (en) | 1987-08-26 | 1987-08-26 | Manufacture of laminated type ceramic chip capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6454720A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002271031A (en) * | 2001-03-13 | 2002-09-20 | Ibiden Co Ltd | Printed wiring board and manufacturing method therefor |
US7345868B2 (en) | 2002-10-07 | 2008-03-18 | Presidio Components, Inc. | Multilayer ceramic capacitor with terminal formed by electroless plating |
US7576968B2 (en) | 2002-04-15 | 2009-08-18 | Avx Corporation | Plated terminations and method of forming using electrolytic plating |
JP2012043842A (en) * | 2010-08-13 | 2012-03-01 | Murata Mfg Co Ltd | Laminated ceramic electronic component |
US8553391B2 (en) | 2010-09-16 | 2013-10-08 | Murata Manufacturing Co., Ltd. | Electronic component |
US20160189864A1 (en) * | 2002-04-15 | 2016-06-30 | Avx Corporation | Plated terminations |
-
1987
- 1987-08-26 JP JP21198787A patent/JPS6454720A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002271031A (en) * | 2001-03-13 | 2002-09-20 | Ibiden Co Ltd | Printed wiring board and manufacturing method therefor |
US7576968B2 (en) | 2002-04-15 | 2009-08-18 | Avx Corporation | Plated terminations and method of forming using electrolytic plating |
US20160189864A1 (en) * | 2002-04-15 | 2016-06-30 | Avx Corporation | Plated terminations |
US9666366B2 (en) | 2002-04-15 | 2017-05-30 | Avx Corporation | Method of making multi-layer electronic components with plated terminations |
US10020116B2 (en) | 2002-04-15 | 2018-07-10 | Avx Corporation | Plated terminations |
US10366835B2 (en) | 2002-04-15 | 2019-07-30 | Avx Corporation | Plated terminations |
US11195659B2 (en) | 2002-04-15 | 2021-12-07 | Avx Corporation | Plated terminations |
US7345868B2 (en) | 2002-10-07 | 2008-03-18 | Presidio Components, Inc. | Multilayer ceramic capacitor with terminal formed by electroless plating |
US8163331B2 (en) | 2002-10-07 | 2012-04-24 | Presidio Components, Inc. | Multilayer ceramic capacitor with terminal formed by electroless plating |
JP2012043842A (en) * | 2010-08-13 | 2012-03-01 | Murata Mfg Co Ltd | Laminated ceramic electronic component |
US8553391B2 (en) | 2010-09-16 | 2013-10-08 | Murata Manufacturing Co., Ltd. | Electronic component |
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