JPS6454720A - Manufacture of laminated type ceramic chip capacitor - Google Patents

Manufacture of laminated type ceramic chip capacitor

Info

Publication number
JPS6454720A
JPS6454720A JP21198787A JP21198787A JPS6454720A JP S6454720 A JPS6454720 A JP S6454720A JP 21198787 A JP21198787 A JP 21198787A JP 21198787 A JP21198787 A JP 21198787A JP S6454720 A JPS6454720 A JP S6454720A
Authority
JP
Japan
Prior art keywords
layers
electrode layer
capacitor
metal
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21198787A
Other languages
Japanese (ja)
Inventor
Hisashi Nakamura
Kazuyuki Takano
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Priority to JP21198787A priority Critical patent/JPS6454720A/en
Publication of JPS6454720A publication Critical patent/JPS6454720A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve the stability of the connection of an internal electrode layer and an external electrode layer by interposing and connecting a metal of a different kind between the internal electrode layer and the external electrode layer exposed to the sidewall surface of both ends of an element. CONSTITUTION:Conductive paste mainly comprising a metal Pd is applied onto the surface of a ceramic dielectric 4 processed to a sheet shape to a desired figure shape, and a required number of the sheets are laminated and monolithic- molded, cut and worked, and baked, thus manufacturing a piece-shaped capacitor element. Electroless plating metallic layers 6 are attached to the broken-out section and peripheral section of an exposed stratiform internal electrode layer 5 in the capacitor element. The layer 6 used at that time is composed of a metal different from the layer 5. Conductive paste mainly comprising silver is applied selectively so as to coat the layers 6 at a pair of opposed both end sections of the capacitor element, and baked at a high temperature, thus forming external electrode layers 7. Accordingly, the stability of the connection of the layers 5 and the layers 7 is improved.
JP21198787A 1987-08-26 1987-08-26 Manufacture of laminated type ceramic chip capacitor Pending JPS6454720A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21198787A JPS6454720A (en) 1987-08-26 1987-08-26 Manufacture of laminated type ceramic chip capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21198787A JPS6454720A (en) 1987-08-26 1987-08-26 Manufacture of laminated type ceramic chip capacitor

Publications (1)

Publication Number Publication Date
JPS6454720A true JPS6454720A (en) 1989-03-02

Family

ID=16615014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21198787A Pending JPS6454720A (en) 1987-08-26 1987-08-26 Manufacture of laminated type ceramic chip capacitor

Country Status (1)

Country Link
JP (1) JPS6454720A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002271031A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
US7345868B2 (en) 2002-10-07 2008-03-18 Presidio Components, Inc. Multilayer ceramic capacitor with terminal formed by electroless plating
US7576968B2 (en) 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
JP2012043842A (en) * 2010-08-13 2012-03-01 Murata Mfg Co Ltd Laminated ceramic electronic component
US8553391B2 (en) 2010-09-16 2013-10-08 Murata Manufacturing Co., Ltd. Electronic component
US20160189864A1 (en) * 2002-04-15 2016-06-30 Avx Corporation Plated terminations

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002271031A (en) * 2001-03-13 2002-09-20 Ibiden Co Ltd Printed wiring board and manufacturing method therefor
US9666366B2 (en) 2002-04-15 2017-05-30 Avx Corporation Method of making multi-layer electronic components with plated terminations
US7576968B2 (en) 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
US10366835B2 (en) 2002-04-15 2019-07-30 Avx Corporation Plated terminations
US20160189864A1 (en) * 2002-04-15 2016-06-30 Avx Corporation Plated terminations
US10020116B2 (en) 2002-04-15 2018-07-10 Avx Corporation Plated terminations
US8163331B2 (en) 2002-10-07 2012-04-24 Presidio Components, Inc. Multilayer ceramic capacitor with terminal formed by electroless plating
US7345868B2 (en) 2002-10-07 2008-03-18 Presidio Components, Inc. Multilayer ceramic capacitor with terminal formed by electroless plating
JP2012043842A (en) * 2010-08-13 2012-03-01 Murata Mfg Co Ltd Laminated ceramic electronic component
US8553391B2 (en) 2010-09-16 2013-10-08 Murata Manufacturing Co., Ltd. Electronic component

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