JPS643080B2 - - Google Patents
Info
- Publication number
- JPS643080B2 JPS643080B2 JP11220979A JP11220979A JPS643080B2 JP S643080 B2 JPS643080 B2 JP S643080B2 JP 11220979 A JP11220979 A JP 11220979A JP 11220979 A JP11220979 A JP 11220979A JP S643080 B2 JPS643080 B2 JP S643080B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin plate
- composite
- printed wiring
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 34
- 239000011347 resin Substances 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 24
- 239000002131 composite material Substances 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 13
- 229920005672 polyolefin resin Polymers 0.000 claims description 12
- 239000005062 Polybutadiene Substances 0.000 claims description 11
- 239000011888 foil Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 229920002857 polybutadiene Polymers 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000004745 nonwoven fabric Substances 0.000 claims description 7
- 239000002759 woven fabric Substances 0.000 claims description 7
- 238000010894 electron beam technology Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 150000001336 alkenes Chemical class 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241000156978 Erebia Species 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000012210 heat-resistant fiber Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- -1 vinyl compound Chemical class 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11220979A JPS5636191A (en) | 1979-09-01 | 1979-09-01 | Method of manufacturing hard board for printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11220979A JPS5636191A (en) | 1979-09-01 | 1979-09-01 | Method of manufacturing hard board for printed circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5636191A JPS5636191A (en) | 1981-04-09 |
| JPS643080B2 true JPS643080B2 (en, 2012) | 1989-01-19 |
Family
ID=14580976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11220979A Granted JPS5636191A (en) | 1979-09-01 | 1979-09-01 | Method of manufacturing hard board for printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5636191A (en, 2012) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6065598A (ja) * | 1983-09-20 | 1985-04-15 | 松下電器産業株式会社 | 多層印刷配線板の製造方法 |
| US5164237A (en) * | 1987-10-05 | 1992-11-17 | Tokyo Gas Kabushiki Kaisha | Lining material for pipelines |
-
1979
- 1979-09-01 JP JP11220979A patent/JPS5636191A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5636191A (en) | 1981-04-09 |
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