JPS6429790A - Inspecting device for parts packed on substrate - Google Patents

Inspecting device for parts packed on substrate

Info

Publication number
JPS6429790A
JPS6429790A JP62186005A JP18600587A JPS6429790A JP S6429790 A JPS6429790 A JP S6429790A JP 62186005 A JP62186005 A JP 62186005A JP 18600587 A JP18600587 A JP 18600587A JP S6429790 A JPS6429790 A JP S6429790A
Authority
JP
Japan
Prior art keywords
pin
substrate
tip
pins
frames
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62186005A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0553235B2 (enrdf_load_stackoverflow
Inventor
Masanobu Akinaga
Hiroshi Mitsube
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP62186005A priority Critical patent/JPS6429790A/ja
Publication of JPS6429790A publication Critical patent/JPS6429790A/ja
Publication of JPH0553235B2 publication Critical patent/JPH0553235B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Geophysics And Detection Of Objects (AREA)
JP62186005A 1987-07-24 1987-07-24 Inspecting device for parts packed on substrate Granted JPS6429790A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62186005A JPS6429790A (en) 1987-07-24 1987-07-24 Inspecting device for parts packed on substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62186005A JPS6429790A (en) 1987-07-24 1987-07-24 Inspecting device for parts packed on substrate

Publications (2)

Publication Number Publication Date
JPS6429790A true JPS6429790A (en) 1989-01-31
JPH0553235B2 JPH0553235B2 (enrdf_load_stackoverflow) 1993-08-09

Family

ID=16180701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62186005A Granted JPS6429790A (en) 1987-07-24 1987-07-24 Inspecting device for parts packed on substrate

Country Status (1)

Country Link
JP (1) JPS6429790A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5777410A (en) * 1995-12-04 1998-07-07 Asmo Co., Ltd. Motor actuator and method of making the same
US6711354B2 (en) 2001-03-05 2004-03-23 Yazaki Corporation Auxiliary module use relaying component and auxiliary module
US7066041B2 (en) * 2000-10-03 2006-06-27 Linak A/S Linear actuator
JP2010123589A (ja) * 2008-11-17 2010-06-03 Sharp Corp 電子部品の端子構造

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5777410A (en) * 1995-12-04 1998-07-07 Asmo Co., Ltd. Motor actuator and method of making the same
US7066041B2 (en) * 2000-10-03 2006-06-27 Linak A/S Linear actuator
US6711354B2 (en) 2001-03-05 2004-03-23 Yazaki Corporation Auxiliary module use relaying component and auxiliary module
JP2010123589A (ja) * 2008-11-17 2010-06-03 Sharp Corp 電子部品の端子構造

Also Published As

Publication number Publication date
JPH0553235B2 (enrdf_load_stackoverflow) 1993-08-09

Similar Documents

Publication Publication Date Title
US3813022A (en) Wire bonder apparatus
ATE343536T1 (de) Vorrichtung zum greifen von packstücken
US5186719A (en) Apparatus for conveying semiconductor lead frame strip using guide rails
JPS6429790A (en) Inspecting device for parts packed on substrate
US5264002A (en) Method for conveying semiconductor lead frame strip with an apparatus having vertically movable guide rails
JPS6440100A (en) Press and its production
JPH0373551A (ja) チップトレイ
CN212646555U (zh) 一种焊接质量检测装置
JPS6298513U (enrdf_load_stackoverflow)
JPS6375905A (ja) 部品の位置決め装置
JP2600392B2 (ja) Ｉｃデバイスのコンタクト機構
JPS57158571A (en) Measuring socket for small-sized semiconductor device
CN210426475U (zh) 一种3d测量机
JP2623760B2 (ja) ペレットボンディング用コレット
JPS57124446A (en) Die bond apparatus
JPS55138852A (en) Wire bonding apparatus
JPS6465860A (en) Socket for semiconductor package
JPS602179Y2 (ja) 部分メツキ装置
JPH0312423Y2 (enrdf_load_stackoverflow)
JPS5763844A (en) Dividing method for semiconductor wafer
JPS6141704Y2 (enrdf_load_stackoverflow)
JPH11139186A (ja) トロリ線高さ追随装置
JPS5453409A (en) Device for automatically measuring wear of electric- current collecting shoe
SU1609657A1 (ru) Устройство дл шагового перемещени и фиксации форм
JPH0131922Y2 (enrdf_load_stackoverflow)