JPS55138852A - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
JPS55138852A
JPS55138852A JP4687779A JP4687779A JPS55138852A JP S55138852 A JPS55138852 A JP S55138852A JP 4687779 A JP4687779 A JP 4687779A JP 4687779 A JP4687779 A JP 4687779A JP S55138852 A JPS55138852 A JP S55138852A
Authority
JP
Japan
Prior art keywords
tool
sliding plate
downwardly
wire bonding
bonding apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4687779A
Other languages
Japanese (ja)
Other versions
JPS5824015B2 (en
Inventor
Takeshi Hasegawa
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP54046877A priority Critical patent/JPS5824015B2/en
Publication of JPS55138852A publication Critical patent/JPS55138852A/en
Publication of JPS5824015B2 publication Critical patent/JPS5824015B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent the variations in the contacting position and surface of a tool in a wire bonding apparatus by vertically moving two slide plates and the tool. CONSTITUTION:When a tool 22 is moved to a bonding point, the first sliding plate 4 moves downwardly on the first supporting guide passage 1a, and the second sliding plate 10 moves downwardly by its own weight and being pushed by a reciprocating bar 23 of a linear actuator 23. When the tool 22 is grounded on a specimen, the first sliding plate 4 is further moved downwardly, but the second sliding plate 10 stops moving downwardly with the tool 22 as a stopper and imparts a bonding load thereto.
JP54046877A 1979-04-17 1979-04-17 wire bonding equipment Expired JPS5824015B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54046877A JPS5824015B2 (en) 1979-04-17 1979-04-17 wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54046877A JPS5824015B2 (en) 1979-04-17 1979-04-17 wire bonding equipment

Publications (2)

Publication Number Publication Date
JPS55138852A true JPS55138852A (en) 1980-10-30
JPS5824015B2 JPS5824015B2 (en) 1983-05-18

Family

ID=12759574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54046877A Expired JPS5824015B2 (en) 1979-04-17 1979-04-17 wire bonding equipment

Country Status (1)

Country Link
JP (1) JPS5824015B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4598853A (en) * 1984-05-21 1986-07-08 Hughes Aircraft Company Open-center flexural pivot wire bonding head
JPH0292929U (en) * 1989-01-10 1990-07-24

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59142775U (en) * 1983-03-15 1984-09-25 株式会社測機舎 Battery device for light wave distance meter
JP2514852Y2 (en) * 1988-04-08 1996-10-23 旭精密 株式会社 Electronic surveying machine with handle
JPH0260814U (en) * 1989-10-19 1990-05-07

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4598853A (en) * 1984-05-21 1986-07-08 Hughes Aircraft Company Open-center flexural pivot wire bonding head
JPH0292929U (en) * 1989-01-10 1990-07-24

Also Published As

Publication number Publication date
JPS5824015B2 (en) 1983-05-18

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