JPS6421884A - Molding method for connector pin of multilayer ceramics circuit board - Google Patents
Molding method for connector pin of multilayer ceramics circuit boardInfo
- Publication number
- JPS6421884A JPS6421884A JP17717987A JP17717987A JPS6421884A JP S6421884 A JPS6421884 A JP S6421884A JP 17717987 A JP17717987 A JP 17717987A JP 17717987 A JP17717987 A JP 17717987A JP S6421884 A JPS6421884 A JP S6421884A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- pin
- metal mold
- hole
- copper pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17717987A JPS6421884A (en) | 1987-07-17 | 1987-07-17 | Molding method for connector pin of multilayer ceramics circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17717987A JPS6421884A (en) | 1987-07-17 | 1987-07-17 | Molding method for connector pin of multilayer ceramics circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6421884A true JPS6421884A (en) | 1989-01-25 |
Family
ID=16026561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17717987A Pending JPS6421884A (en) | 1987-07-17 | 1987-07-17 | Molding method for connector pin of multilayer ceramics circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6421884A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104259716A (zh) * | 2014-09-19 | 2015-01-07 | 常熟泓淋电子有限公司 | 适于刮锡拖焊焊接的导线焊接用夹具结构 |
-
1987
- 1987-07-17 JP JP17717987A patent/JPS6421884A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104259716A (zh) * | 2014-09-19 | 2015-01-07 | 常熟泓淋电子有限公司 | 适于刮锡拖焊焊接的导线焊接用夹具结构 |
CN104259716B (zh) * | 2014-09-19 | 2015-10-28 | 常熟泓淋电子有限公司 | 适于刮锡拖焊焊接的导线焊接用夹具结构 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2030826A1 (en) | Composite circuit board with thick embedded conductor and method of manufacturing the same | |
JPS6421884A (en) | Molding method for connector pin of multilayer ceramics circuit board | |
EP0380289A3 (en) | A process of manufacturing a multi-layer ceramic substrate assembly | |
JPS6468915A (en) | Chip component | |
JPH01111398A (ja) | 混成集積回路装置 | |
JP2684446B2 (ja) | プリント回路基板の射出成形方法および装置 | |
JPH0635499Y2 (ja) | 両面プリント基板 | |
JPS6370483A (ja) | バツクボ−ド用プリント配線板 | |
JPS6412595A (en) | Mounting structure of printed board | |
JPH01135663U (ja) | ||
JPS5827395A (ja) | 印刷配線基板の接続装置 | |
JPH01167054U (ja) | ||
JPS6481392A (en) | Injection molding of printed circuit board | |
JPH0298654U (ja) | ||
JPS6420767U (ja) | ||
JPS61232698A (ja) | 多層印刷配線板の製造方法 | |
JPH03117867U (ja) | ||
JPS6419788A (en) | Surface mounting printed wiring board | |
JPS6373976U (ja) | ||
JPS649689A (en) | Circuit board | |
JPS5936192U (ja) | コネクタピン整形器 | |
JPS60131263U (ja) | 熱圧着半田付装置 | |
JPH0371689A (ja) | 金属ベース配線基板 | |
JPS6311799B2 (ja) | ||
JPS6437078A (en) | Manufacture of copper-clad laminate for printed wiring board |