JPS6416698A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPS6416698A
JPS6416698A JP62170908A JP17090887A JPS6416698A JP S6416698 A JPS6416698 A JP S6416698A JP 62170908 A JP62170908 A JP 62170908A JP 17090887 A JP17090887 A JP 17090887A JP S6416698 A JPS6416698 A JP S6416698A
Authority
JP
Japan
Prior art keywords
barrier
hole
surrounding
card
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62170908A
Other languages
English (en)
Inventor
Keiji Miyamoto
Atsushi Nakamura
Tsuneo Sato
Kazuo Kojima
Masayuki Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62170908A priority Critical patent/JPS6416698A/ja
Publication of JPS6416698A publication Critical patent/JPS6416698A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Credit Cards Or The Like (AREA)
JP62170908A 1987-07-10 1987-07-10 Semiconductor device and manufacture thereof Pending JPS6416698A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62170908A JPS6416698A (en) 1987-07-10 1987-07-10 Semiconductor device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62170908A JPS6416698A (en) 1987-07-10 1987-07-10 Semiconductor device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6416698A true JPS6416698A (en) 1989-01-20

Family

ID=15913568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62170908A Pending JPS6416698A (en) 1987-07-10 1987-07-10 Semiconductor device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6416698A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002358493A (ja) * 2001-06-01 2002-12-13 Fujitsu Ltd 非接触型ｉｃカード及びその製造方法
JP2009128971A (ja) * 2007-11-20 2009-06-11 Dainippon Printing Co Ltd Ｉｃモジュール、ｉｃモジュールの作製方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002358493A (ja) * 2001-06-01 2002-12-13 Fujitsu Ltd 非接触型ｉｃカード及びその製造方法
JP2009128971A (ja) * 2007-11-20 2009-06-11 Dainippon Printing Co Ltd Ｉｃモジュール、ｉｃモジュールの作製方法

Similar Documents

Publication Publication Date Title
US4803542A (en) Carrier element for an IC-module
EP0246893A3 (en) Semiconductor device comprising an insulating wiring substrate and method of manufacturing it
ATE49481T1 (de) Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben.
MY123249A (en) A semiconductor device and a method of manufacturing the same and an electronic device
KR970006534B1 (en) Semiconductor integrated circuit package and its manufacture and its mounting method
KR860005438A (ko) 반도체칩과 기판과의 접합구조가 개선된 반도체장치
JPS55111151A (en) Integrated circuit device
IE822564L (en) Fabrication a semiconductor device having a phosphosilicate glass layer
JPS577147A (en) Mounting construction of semiconductor device
JPS5571052A (en) Substrate for semiconductor device
JPS6416698A (en) Semiconductor device and manufacture thereof
JPS5471986A (en) Semiconductor device and production thereof
JPS55121669A (en) Method of forming inactive layer on integrated circuit device having substrate of semiconductor material
JPH01106455A (ja) 半導体集積回路装置
JPS6444056A (en) Hybrid integrated circuit
JPS57209578A (en) Card
JPS55138241A (en) Sealing structure for semiconductor device
JPS56133857A (en) Manufacture of hybrid ic
JPS5753371A (en) Tape carrier of thermal head and manufacture thereof
JPS5768053A (en) Integrated circuit package
JPS56155556A (en) Semiconductor device
JPS56146256A (en) Hybrid ic device
JPS52116073A (en) Hermetic structure in which integrated circuit element is sealed up ai rtightly
ATE51455T1 (de) Datenverarbeitungssystem in einer karte und verfahren zu dessen herstellung.
JPS57208162A (en) Semiconductor integrated circuit