JPS6411448B2 - - Google Patents

Info

Publication number
JPS6411448B2
JPS6411448B2 JP58134643A JP13464383A JPS6411448B2 JP S6411448 B2 JPS6411448 B2 JP S6411448B2 JP 58134643 A JP58134643 A JP 58134643A JP 13464383 A JP13464383 A JP 13464383A JP S6411448 B2 JPS6411448 B2 JP S6411448B2
Authority
JP
Japan
Prior art keywords
plate
laminate
heating
mirror
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58134643A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6025714A (ja
Inventor
Masayuki Noda
Kenichi Karya
Ichiro Suirenya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP58134643A priority Critical patent/JPS6025714A/ja
Publication of JPS6025714A publication Critical patent/JPS6025714A/ja
Publication of JPS6411448B2 publication Critical patent/JPS6411448B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
JP58134643A 1983-07-22 1983-07-22 積層板の製造法 Granted JPS6025714A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58134643A JPS6025714A (ja) 1983-07-22 1983-07-22 積層板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58134643A JPS6025714A (ja) 1983-07-22 1983-07-22 積層板の製造法

Publications (2)

Publication Number Publication Date
JPS6025714A JPS6025714A (ja) 1985-02-08
JPS6411448B2 true JPS6411448B2 (enrdf_load_stackoverflow) 1989-02-23

Family

ID=15133156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58134643A Granted JPS6025714A (ja) 1983-07-22 1983-07-22 積層板の製造法

Country Status (1)

Country Link
JP (1) JPS6025714A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8556611B2 (en) * 2011-06-21 2013-10-15 Xerox Corporation Method for interstitial polymer planarization using a flexible flat plate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS586690Y2 (ja) * 1978-12-28 1983-02-04 日立化成工業株式会社 積層板製造用上板
JPS5670916A (en) * 1979-11-14 1981-06-13 Toshiba Chem Corp Manufacture of lamination sheet
JPS5923693B2 (ja) * 1980-12-08 1984-06-04 日立化成工業株式会社 積層品の成形法

Also Published As

Publication number Publication date
JPS6025714A (ja) 1985-02-08

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