JPS639749B2 - - Google Patents

Info

Publication number
JPS639749B2
JPS639749B2 JP57080936A JP8093682A JPS639749B2 JP S639749 B2 JPS639749 B2 JP S639749B2 JP 57080936 A JP57080936 A JP 57080936A JP 8093682 A JP8093682 A JP 8093682A JP S639749 B2 JPS639749 B2 JP S639749B2
Authority
JP
Japan
Prior art keywords
metal
semiconductor element
ceramic substrate
metal ring
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57080936A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58197863A (ja
Inventor
Takashi Myamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP57080936A priority Critical patent/JPS58197863A/ja
Publication of JPS58197863A publication Critical patent/JPS58197863A/ja
Publication of JPS639749B2 publication Critical patent/JPS639749B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/685—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H10W70/682—
    • H10W72/07551—
    • H10W72/07554—
    • H10W72/50—
    • H10W72/5445—
    • H10W72/547—
    • H10W90/754—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
JP57080936A 1982-05-14 1982-05-14 半導体装置 Granted JPS58197863A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57080936A JPS58197863A (ja) 1982-05-14 1982-05-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57080936A JPS58197863A (ja) 1982-05-14 1982-05-14 半導体装置

Publications (2)

Publication Number Publication Date
JPS58197863A JPS58197863A (ja) 1983-11-17
JPS639749B2 true JPS639749B2 (index.php) 1988-03-01

Family

ID=13732342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57080936A Granted JPS58197863A (ja) 1982-05-14 1982-05-14 半導体装置

Country Status (1)

Country Link
JP (1) JPS58197863A (index.php)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4705917A (en) * 1985-08-27 1987-11-10 Hughes Aircraft Company Microelectronic package
US5027191A (en) * 1989-05-11 1991-06-25 Westinghouse Electric Corp. Cavity-down chip carrier with pad grid array

Also Published As

Publication number Publication date
JPS58197863A (ja) 1983-11-17

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