JPS639586B2 - - Google Patents

Info

Publication number
JPS639586B2
JPS639586B2 JP5235583A JP5235583A JPS639586B2 JP S639586 B2 JPS639586 B2 JP S639586B2 JP 5235583 A JP5235583 A JP 5235583A JP 5235583 A JP5235583 A JP 5235583A JP S639586 B2 JPS639586 B2 JP S639586B2
Authority
JP
Japan
Prior art keywords
vacuum
station
vacuum chamber
processing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5235583A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59179786A (ja
Inventor
Hideki Tateishi
Tamotsu Shimizu
Susumu Aiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5235583A priority Critical patent/JPS59179786A/ja
Publication of JPS59179786A publication Critical patent/JPS59179786A/ja
Publication of JPS639586B2 publication Critical patent/JPS639586B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)
JP5235583A 1983-03-30 1983-03-30 連続スパツタ装置 Granted JPS59179786A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5235583A JPS59179786A (ja) 1983-03-30 1983-03-30 連続スパツタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5235583A JPS59179786A (ja) 1983-03-30 1983-03-30 連続スパツタ装置

Publications (2)

Publication Number Publication Date
JPS59179786A JPS59179786A (ja) 1984-10-12
JPS639586B2 true JPS639586B2 (enrdf_load_html_response) 1988-02-29

Family

ID=12912498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5235583A Granted JPS59179786A (ja) 1983-03-30 1983-03-30 連続スパツタ装置

Country Status (1)

Country Link
JP (1) JPS59179786A (enrdf_load_html_response)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6052574A (ja) * 1983-09-02 1985-03-25 Hitachi Ltd 連続スパツタ装置
JPS60249328A (ja) * 1984-05-25 1985-12-10 Kokusai Electric Co Ltd 半導体ウエ−ハ用ドライエツチング・化学気相生成装置
JPS61106768A (ja) * 1984-10-31 1986-05-24 Anelva Corp 基体処理装置
JPS61108358U (enrdf_load_html_response) * 1984-12-19 1986-07-09
JPS61159572A (ja) * 1985-01-07 1986-07-19 Hitachi Ltd 連続スパツタ装置
JPS62234539A (ja) * 1986-04-04 1987-10-14 Hitachi Ltd 真空処理装置
JPS6326357A (ja) * 1986-07-17 1988-02-03 Tokyo Electron Ltd スパツタリング装置
JPS6360276A (ja) * 1986-08-30 1988-03-16 Tokyo Electron Ltd スパツタリング装置
JPS63303059A (ja) * 1987-05-30 1988-12-09 Tokuda Seisakusho Ltd 真空処理装置
US5591267A (en) * 1988-01-11 1997-01-07 Ohmi; Tadahiro Reduced pressure device
US5906688A (en) * 1989-01-11 1999-05-25 Ohmi; Tadahiro Method of forming a passivation film
WO1989006437A1 (en) * 1988-01-11 1989-07-13 Tadahiro Ohmi Device for forming thin film
US5683072A (en) * 1988-11-01 1997-11-04 Tadahiro Ohmi Thin film forming equipment
US5789086A (en) * 1990-03-05 1998-08-04 Ohmi; Tadahiro Stainless steel surface having passivation film
JP7522670B2 (ja) * 2021-01-12 2024-07-25 株式会社アルバック 連続処理装置

Also Published As

Publication number Publication date
JPS59179786A (ja) 1984-10-12

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