JPS639400B2 - - Google Patents

Info

Publication number
JPS639400B2
JPS639400B2 JP54025806A JP2580679A JPS639400B2 JP S639400 B2 JPS639400 B2 JP S639400B2 JP 54025806 A JP54025806 A JP 54025806A JP 2580679 A JP2580679 A JP 2580679A JP S639400 B2 JPS639400 B2 JP S639400B2
Authority
JP
Japan
Prior art keywords
chucks
electronic component
component
cam
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54025806A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55118690A (en
Inventor
Yoshiaki Makisawa
Katsuyuki Yamamoto
Kanji Hata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2580679A priority Critical patent/JPS55118690A/ja
Priority to US06/125,657 priority patent/US4346514A/en
Priority to CA346,888A priority patent/CA1126936A/en
Publication of JPS55118690A publication Critical patent/JPS55118690A/ja
Publication of JPS639400B2 publication Critical patent/JPS639400B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2580679A 1979-03-05 1979-03-05 Device for carrying electronic part Granted JPS55118690A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2580679A JPS55118690A (en) 1979-03-05 1979-03-05 Device for carrying electronic part
US06/125,657 US4346514A (en) 1979-03-05 1980-02-28 Apparatus for mounting electronic components
CA346,888A CA1126936A (en) 1979-03-05 1980-03-04 Apparatus for mounting electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2580679A JPS55118690A (en) 1979-03-05 1979-03-05 Device for carrying electronic part

Publications (2)

Publication Number Publication Date
JPS55118690A JPS55118690A (en) 1980-09-11
JPS639400B2 true JPS639400B2 (enEXAMPLES) 1988-02-29

Family

ID=12176100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2580679A Granted JPS55118690A (en) 1979-03-05 1979-03-05 Device for carrying electronic part

Country Status (3)

Country Link
US (1) US4346514A (enEXAMPLES)
JP (1) JPS55118690A (enEXAMPLES)
CA (1) CA1126936A (enEXAMPLES)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8001114A (nl) * 1980-02-25 1981-09-16 Philips Nv Inrichting voor de montage van aansluitdraadloze plaat- of blokvormige elektronische onderdelen op een substraat.
US4438559A (en) * 1980-06-27 1984-03-27 Fuji Machine Mfg. Co. Ltd. Apparatus for automatically mounting non-lead electronic components on printed-circuit
JPS57138587A (en) * 1981-02-13 1982-08-26 Matsushita Electric Industrial Co Ltd Shifter for article
JPS57140000A (en) * 1981-02-23 1982-08-30 Matsushita Electric Industrial Co Ltd Electronic part supplying device
US4501064A (en) * 1981-09-08 1985-02-26 Usm Corporation Micro component assembly machine
US4392300A (en) * 1981-10-22 1983-07-12 Amp Incorporated Applicator tool for loose miniature spring sockets
NL8201653A (nl) * 1982-04-21 1983-11-16 Philips Nv Werkwijze en inrichting voor het plaatsen van chipvormige electrische en/of electronische onderdelen op een substraat.
JPS58191499A (ja) * 1982-04-30 1983-11-08 松下電工株式会社 リニヤ−パ−ツフイダ−
JPS59111400A (ja) * 1982-12-16 1984-06-27 松下電器産業株式会社 電子部品の実装装置
SE454643B (sv) * 1983-06-13 1988-05-16 Sincotron Aps Sett och anordning for att pa ett kretskort montera elektroniska komponenter
SE452428B (sv) * 1983-07-11 1987-11-30 Asea Ab Robotinstallation for montering
US4555623A (en) * 1983-12-05 1985-11-26 Irvine Sensors Corporation Pre-amplifier in focal plane detector array
CA1228427A (en) * 1983-12-27 1987-10-20 Usm Corporation Placement head for micro-component assembly machine
US4627156A (en) * 1983-12-27 1986-12-09 Usm Corporation Placement head for micro-component assembly machine
US4770599A (en) * 1984-01-23 1988-09-13 Dynapert Precima Limited Pick-up head for handling electric components
WO1985003404A1 (en) * 1984-01-23 1985-08-01 Dyna/Pert - Precima Limited Head for handling electrical components
US4605152A (en) * 1984-02-24 1986-08-12 Pace, Incorporated Device for attaching modular electronic components to or removing them from an insulative substrate
GB8406129D0 (en) * 1984-03-08 1984-04-11 Dyna Pert Precima Ltd Orienting electrical components
DE3532500C2 (de) * 1984-09-17 1996-03-14 Tdk Corp Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette
EP0190372A1 (en) * 1985-01-29 1986-08-13 TEKMA KINOMAT S.p.A. Process for the automatic positioning of chips on printed circuits and machine for carrying out the same
JPH0410982Y2 (enEXAMPLES) * 1985-03-16 1992-03-18
US4681208A (en) * 1985-08-05 1987-07-21 American Telephone And Telegraph Company, At&T Technologies, Inc. Method and apparatus for presenting an article to a work station
US4802816A (en) * 1985-10-08 1989-02-07 Excellon Industries Pick and place machine having improved centering jaws
US4705311A (en) * 1986-02-27 1987-11-10 Universal Instruments Corporation Component pick and place spindle assembly with compact internal linear and rotary displacement motors and interchangeable tool assemblies
US4909418A (en) * 1989-03-14 1990-03-20 Grumman Aerospace Corporation Rivet set
KR900015590A (ko) * 1989-03-23 1990-10-27 프레데릭 얀 스미트 캐리어상에 부품을 배치하는 방법 및 그 방법을 수행하기 위한 장치
US5671527A (en) * 1995-11-01 1997-09-30 Fuji Machine Mfg. Co., Ltd. Electronic-component mounting system
JP3149782B2 (ja) * 1996-05-07 2001-03-26 松下電器産業株式会社 ダイボンディング装置およびダイボンディング方法
US6256869B1 (en) * 1996-07-30 2001-07-10 Fuji Machine Mfg. Co., Ltd. Electronic-component mounting system
JP3574666B2 (ja) * 1996-11-19 2004-10-06 松下電器産業株式会社 電子部品実装装置及び方法
KR100254323B1 (ko) * 1997-08-01 2000-05-01 윤종용 집적회로 납땜 장치 및 방법
US6385842B1 (en) 2000-01-14 2002-05-14 Delaware Capital Formation, Inc. Tube feeder having a zone on which components can pivot
JP3992486B2 (ja) * 2001-12-07 2007-10-17 富士機械製造株式会社 電気部品装着システム
CA2494487A1 (en) * 2002-08-02 2004-02-12 Symbol Technologies, Inc. Method and apparatus for high volume assembly of radio frequency identification tags
US6915551B2 (en) 2002-08-02 2005-07-12 Matrics, Inc. Multi-barrel die transfer apparatus and method for transferring dies therewith
US7023347B2 (en) * 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US7223320B2 (en) * 2003-06-12 2007-05-29 Symbol Technologies, Inc. Method and apparatus for expanding a semiconductor wafer
US7479614B2 (en) * 2004-01-12 2009-01-20 Symbol Technologies Radio frequency identification tag inlay sortation and assembly
US7370808B2 (en) * 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
US20050224590A1 (en) * 2004-04-13 2005-10-13 John Melngailis Method and system for fabricating integrated circuit chips with unique identification numbers
US20060012387A1 (en) * 2004-06-29 2006-01-19 Symbol Technologies, Inc. Systems and methods for testing radio frequency identification tags
EP1784803A4 (en) * 2004-08-17 2010-07-14 Symbol Technologies Inc SINGULATION OF LABELS OF HIGH FREQUENCY IDENTIFICATION (RFID) FOR TESTING AND / OR PROGRAMMING
US20060223225A1 (en) * 2005-03-29 2006-10-05 Symbol Technologies, Inc. Method, system, and apparatus for transfer of integrated circuit dies using an attractive force
EP1864266A2 (en) * 2005-03-29 2007-12-12 Symbol Technologies, Inc. Smart radio frequency identification (rfid) items
US20060225273A1 (en) * 2005-03-29 2006-10-12 Symbol Technologies, Inc. Transferring die(s) from an intermediate surface to a substrate
US7364983B2 (en) * 2005-05-04 2008-04-29 Avery Dennison Corporation Method and apparatus for creating RFID devices
WO2006125206A2 (en) * 2005-05-19 2006-11-23 Avery Dennison Corporation Method and apparatus for rfid device assembly
US20070107186A1 (en) * 2005-11-04 2007-05-17 Symbol Technologies, Inc. Method and system for high volume transfer of dies to substrates
US20070131016A1 (en) * 2005-12-13 2007-06-14 Symbol Technologies, Inc. Transferring die(s) from an intermediate surface to a substrate
US20070139057A1 (en) * 2005-12-15 2007-06-21 Symbol Technologies, Inc. System and method for radio frequency identification tag direct connection test
US20070158024A1 (en) * 2006-01-11 2007-07-12 Symbol Technologies, Inc. Methods and systems for removing multiple die(s) from a surface
US20070244657A1 (en) * 2006-04-11 2007-10-18 Drago Randall A Methods and systems for testing radio frequency identification (RFID) tags having multiple antennas
US7560303B2 (en) * 2006-11-07 2009-07-14 Avery Dennison Corporation Method and apparatus for linear die transfer
JP5903668B2 (ja) * 2013-02-21 2016-04-13 パナソニックＩｐマネジメント株式会社 部品実装装置および部品実装方法
JP2014160788A (ja) * 2013-02-21 2014-09-04 Panasonic Corp 部品実装装置および部品実装方法
WO2020257311A1 (en) 2019-06-21 2020-12-24 Lam Research Corporation Bidirectional indexing apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS443578Y1 (enEXAMPLES) * 1966-06-18 1969-02-08
JPS5325368A (en) * 1976-08-23 1978-03-09 Hitachi Ltd Pellet attaching collet
JPS5520455Y2 (enEXAMPLES) * 1977-02-25 1980-05-16
US4135630A (en) * 1977-12-08 1979-01-23 Universal Instruments Corporation Centering device for automatic placement of chip components in hybrid circuits

Also Published As

Publication number Publication date
CA1126936A (en) 1982-07-06
JPS55118690A (en) 1980-09-11
US4346514A (en) 1982-08-31

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