JPS6387733A - 自動ワイヤボンデイング方法 - Google Patents

自動ワイヤボンデイング方法

Info

Publication number
JPS6387733A
JPS6387733A JP61233602A JP23360286A JPS6387733A JP S6387733 A JPS6387733 A JP S6387733A JP 61233602 A JP61233602 A JP 61233602A JP 23360286 A JP23360286 A JP 23360286A JP S6387733 A JPS6387733 A JP S6387733A
Authority
JP
Japan
Prior art keywords
bonding
tool
pellet
point
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61233602A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0523499B2 (enrdf_load_stackoverflow
Inventor
Takao Ishibashi
石橋　隆雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61233602A priority Critical patent/JPS6387733A/ja
Publication of JPS6387733A publication Critical patent/JPS6387733A/ja
Publication of JPH0523499B2 publication Critical patent/JPH0523499B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP61233602A 1986-09-30 1986-09-30 自動ワイヤボンデイング方法 Granted JPS6387733A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61233602A JPS6387733A (ja) 1986-09-30 1986-09-30 自動ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61233602A JPS6387733A (ja) 1986-09-30 1986-09-30 自動ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS6387733A true JPS6387733A (ja) 1988-04-19
JPH0523499B2 JPH0523499B2 (enrdf_load_stackoverflow) 1993-04-02

Family

ID=16957625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61233602A Granted JPS6387733A (ja) 1986-09-30 1986-09-30 自動ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS6387733A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0523499B2 (enrdf_load_stackoverflow) 1993-04-02

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