JPS6386554A - 電子的パッケ−ジ - Google Patents

電子的パッケ−ジ

Info

Publication number
JPS6386554A
JPS6386554A JP62175032A JP17503287A JPS6386554A JP S6386554 A JPS6386554 A JP S6386554A JP 62175032 A JP62175032 A JP 62175032A JP 17503287 A JP17503287 A JP 17503287A JP S6386554 A JPS6386554 A JP S6386554A
Authority
JP
Japan
Prior art keywords
metal layer
plate
capacitor
layer
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62175032A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0519983B2 (index.php
Inventor
ミッチェル・ボイド・ブラウン
ミリアム・セーレス・エバート
レオナルド・シードレ・オルソン
リチャード・ロバート・スローマ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS6386554A publication Critical patent/JPS6386554A/ja
Publication of JPH0519983B2 publication Critical patent/JPH0519983B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/20—
    • H10W44/601—
    • H10W70/685—
    • H10W72/07554—
    • H10W72/251—
    • H10W72/547—
    • H10W72/5473—
    • H10W90/724—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP62175032A 1986-09-30 1987-07-15 電子的パッケ−ジ Granted JPS6386554A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US91343586A 1986-09-30 1986-09-30
US913435 1986-09-30

Publications (2)

Publication Number Publication Date
JPS6386554A true JPS6386554A (ja) 1988-04-16
JPH0519983B2 JPH0519983B2 (index.php) 1993-03-18

Family

ID=25433270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62175032A Granted JPS6386554A (ja) 1986-09-30 1987-07-15 電子的パッケ−ジ

Country Status (3)

Country Link
EP (1) EP0262493B1 (index.php)
JP (1) JPS6386554A (index.php)
DE (1) DE3782714T2 (index.php)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2548602B2 (ja) * 1988-04-12 1996-10-30 株式会社日立製作所 半導体実装モジュール
ATE171307T1 (de) * 1989-05-22 1998-10-15 Advanced Micro Devices Inc Leiterstruktur für eine integrierte schaltung
SE470415B (sv) * 1992-07-06 1994-02-14 Ericsson Telefon Ab L M Kondensator med hög kapacitans i ett integrerat funktionsblock eller en integrerad krets, förfarande för framställning av kondensatorn och användning av kondensatorn som en integrerad avkopplingskondensator
DE19520700B4 (de) * 1994-06-09 2004-09-09 Samsung Electronics Co., Ltd., Suwon Halbleiterbausteinanordnung
US6411494B1 (en) 2000-04-06 2002-06-25 Gennum Corporation Distributed capacitor
DE10109220A1 (de) * 2001-02-26 2002-09-12 Infineon Technologies Ag Integrierte Schaltung mit einer Stützkapazität

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821848A (ja) * 1981-07-31 1983-02-08 Nec Corp 集積回路装置用容器
JPS59211251A (ja) * 1983-05-16 1984-11-30 Toshiba Corp 集積回路素子パツケ−ジ
JPS61102770A (ja) * 1984-10-26 1986-05-21 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4231154A (en) * 1979-01-10 1980-11-04 International Business Machines Corporation Electronic package assembly method
JPS5745955A (en) * 1980-09-02 1982-03-16 Seikosha Co Ltd Sealing container
US4386116A (en) * 1981-12-24 1983-05-31 International Business Machines Corporation Process for making multilayer integrated circuit substrate
US4453176A (en) * 1981-12-31 1984-06-05 International Business Machines Corporation LSI Chip carrier with buried repairable capacitor with low inductance leads
JPS61108160A (ja) * 1984-11-01 1986-05-26 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821848A (ja) * 1981-07-31 1983-02-08 Nec Corp 集積回路装置用容器
JPS59211251A (ja) * 1983-05-16 1984-11-30 Toshiba Corp 集積回路素子パツケ−ジ
JPS61102770A (ja) * 1984-10-26 1986-05-21 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法

Also Published As

Publication number Publication date
EP0262493B1 (en) 1992-11-19
DE3782714D1 (de) 1992-12-24
JPH0519983B2 (index.php) 1993-03-18
DE3782714T2 (de) 1993-06-09
EP0262493A2 (en) 1988-04-06
EP0262493A3 (en) 1988-11-09

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