JPS6386462A - ソリツド・ステ−ト・リレ−の製造方法 - Google Patents

ソリツド・ステ−ト・リレ−の製造方法

Info

Publication number
JPS6386462A
JPS6386462A JP61232883A JP23288386A JPS6386462A JP S6386462 A JPS6386462 A JP S6386462A JP 61232883 A JP61232883 A JP 61232883A JP 23288386 A JP23288386 A JP 23288386A JP S6386462 A JPS6386462 A JP S6386462A
Authority
JP
Japan
Prior art keywords
frame
circuit board
printed circuit
heat spreader
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61232883A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0579176B2 (show.php
Inventor
Susumu Fujiwara
藤原 享
Hiroyuki Yamamoto
弘之 山本
Hajime Deguchi
出口 肇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP61232883A priority Critical patent/JPS6386462A/ja
Publication of JPS6386462A publication Critical patent/JPS6386462A/ja
Publication of JPH0579176B2 publication Critical patent/JPH0579176B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H10W90/756

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP61232883A 1986-09-29 1986-09-29 ソリツド・ステ−ト・リレ−の製造方法 Granted JPS6386462A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61232883A JPS6386462A (ja) 1986-09-29 1986-09-29 ソリツド・ステ−ト・リレ−の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61232883A JPS6386462A (ja) 1986-09-29 1986-09-29 ソリツド・ステ−ト・リレ−の製造方法

Publications (2)

Publication Number Publication Date
JPS6386462A true JPS6386462A (ja) 1988-04-16
JPH0579176B2 JPH0579176B2 (show.php) 1993-11-01

Family

ID=16946333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61232883A Granted JPS6386462A (ja) 1986-09-29 1986-09-29 ソリツド・ステ−ト・リレ−の製造方法

Country Status (1)

Country Link
JP (1) JPS6386462A (show.php)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2078171A2 (es) * 1993-12-28 1995-12-01 Smartpack Tecnologia S A Procedimiento de fabricacion de modulos de potencia con elementos semiconductores.
US11688823B2 (en) 2018-11-21 2023-06-27 Kabushiki Kaisha Toshiba Photocoupler

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2078171A2 (es) * 1993-12-28 1995-12-01 Smartpack Tecnologia S A Procedimiento de fabricacion de modulos de potencia con elementos semiconductores.
US11688823B2 (en) 2018-11-21 2023-06-27 Kabushiki Kaisha Toshiba Photocoupler

Also Published As

Publication number Publication date
JPH0579176B2 (show.php) 1993-11-01

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term