JPS6377127A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6377127A
JPS6377127A JP61222818A JP22281886A JPS6377127A JP S6377127 A JPS6377127 A JP S6377127A JP 61222818 A JP61222818 A JP 61222818A JP 22281886 A JP22281886 A JP 22281886A JP S6377127 A JPS6377127 A JP S6377127A
Authority
JP
Japan
Prior art keywords
leads
electrodes
lead
semiconductor element
tape carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61222818A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0533824B2 (enrdf_load_stackoverflow
Inventor
Masanobu Obara
小原　雅信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61222818A priority Critical patent/JPS6377127A/ja
Publication of JPS6377127A publication Critical patent/JPS6377127A/ja
Publication of JPH0533824B2 publication Critical patent/JPH0533824B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP61222818A 1986-09-19 1986-09-19 半導体装置 Granted JPS6377127A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61222818A JPS6377127A (ja) 1986-09-19 1986-09-19 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61222818A JPS6377127A (ja) 1986-09-19 1986-09-19 半導体装置

Publications (2)

Publication Number Publication Date
JPS6377127A true JPS6377127A (ja) 1988-04-07
JPH0533824B2 JPH0533824B2 (enrdf_load_stackoverflow) 1993-05-20

Family

ID=16788390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61222818A Granted JPS6377127A (ja) 1986-09-19 1986-09-19 半導体装置

Country Status (1)

Country Link
JP (1) JPS6377127A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0465253A3 (en) * 1990-07-05 1992-07-15 Hewlett-Packard Company Integrated circuit and lead frame assembly

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512791A (en) * 1978-07-14 1980-01-29 Nec Corp Semiconductor device
JPS59152656A (ja) * 1983-02-21 1984-08-31 Nec Corp 半導体装置
JPS6046040A (ja) * 1983-08-24 1985-03-12 Nec Corp 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512791A (en) * 1978-07-14 1980-01-29 Nec Corp Semiconductor device
JPS59152656A (ja) * 1983-02-21 1984-08-31 Nec Corp 半導体装置
JPS6046040A (ja) * 1983-08-24 1985-03-12 Nec Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0465253A3 (en) * 1990-07-05 1992-07-15 Hewlett-Packard Company Integrated circuit and lead frame assembly

Also Published As

Publication number Publication date
JPH0533824B2 (enrdf_load_stackoverflow) 1993-05-20

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