JPS6369244A - ウエハ異物検査装置 - Google Patents

ウエハ異物検査装置

Info

Publication number
JPS6369244A
JPS6369244A JP21342486A JP21342486A JPS6369244A JP S6369244 A JPS6369244 A JP S6369244A JP 21342486 A JP21342486 A JP 21342486A JP 21342486 A JP21342486 A JP 21342486A JP S6369244 A JPS6369244 A JP S6369244A
Authority
JP
Japan
Prior art keywords
foreign matter
foreign
effective
pattern
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21342486A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0347736B2 (OSRAM
Inventor
Toshiaki Taniuchi
谷内　俊明
Ryoji Nemoto
亮二 根本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Electronics Engineering Co Ltd
Priority to JP21342486A priority Critical patent/JPS6369244A/ja
Publication of JPS6369244A publication Critical patent/JPS6369244A/ja
Publication of JPH0347736B2 publication Critical patent/JPH0347736B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP21342486A 1986-09-10 1986-09-10 ウエハ異物検査装置 Granted JPS6369244A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21342486A JPS6369244A (ja) 1986-09-10 1986-09-10 ウエハ異物検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21342486A JPS6369244A (ja) 1986-09-10 1986-09-10 ウエハ異物検査装置

Publications (2)

Publication Number Publication Date
JPS6369244A true JPS6369244A (ja) 1988-03-29
JPH0347736B2 JPH0347736B2 (OSRAM) 1991-07-22

Family

ID=16638994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21342486A Granted JPS6369244A (ja) 1986-09-10 1986-09-10 ウエハ異物検査装置

Country Status (1)

Country Link
JP (1) JPS6369244A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108426541A (zh) * 2017-02-13 2018-08-21 发那科株式会社 生成检查系统的动作程序的装置及方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538032A (en) * 1978-09-11 1980-03-17 Hitachi Ltd Method of setting inspection region
JPS5555206A (en) * 1978-10-20 1980-04-23 Hitachi Electronics Eng Co Ltd Inspection data processing system for defect on face plate
JPS5961762A (ja) * 1982-10-01 1984-04-09 Nippon Kogaku Kk <Nikon> 異物検査装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538032A (en) * 1978-09-11 1980-03-17 Hitachi Ltd Method of setting inspection region
JPS5555206A (en) * 1978-10-20 1980-04-23 Hitachi Electronics Eng Co Ltd Inspection data processing system for defect on face plate
JPS5961762A (ja) * 1982-10-01 1984-04-09 Nippon Kogaku Kk <Nikon> 異物検査装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108426541A (zh) * 2017-02-13 2018-08-21 发那科株式会社 生成检查系统的动作程序的装置及方法
US10656097B2 (en) 2017-02-13 2020-05-19 Fanuc Corporation Apparatus and method for generating operation program of inspection system

Also Published As

Publication number Publication date
JPH0347736B2 (OSRAM) 1991-07-22

Similar Documents

Publication Publication Date Title
US7551767B2 (en) Pattern inspection apparatus
JPH0318708A (ja) 表面検査方法及び装置
JPH0160767B2 (OSRAM)
US20070165938A1 (en) Pattern inspection apparatus and method and workpiece tested thereby
US20070064998A1 (en) Pattern inspection apparatus, pattern inspection method, and inspection sample
JPH1027839A (ja) ウェハの回転方向検出方法
JPH0515219B2 (OSRAM)
JPS6369244A (ja) ウエハ異物検査装置
JPH0516740B2 (OSRAM)
KR100515376B1 (ko) 반도체 웨이퍼 검사장비 및 검사방법
JPH0159521B2 (OSRAM)
JP3219094B2 (ja) チップサイズ検出方法およびチップピッチ検出方法およびチップ配列データ自動作成方法ならびにそれを用いた半導体基板の検査方法および装置
US20010012391A1 (en) Pattern inspection method and apparatus
JPH03125945A (ja) ウエハ異物検査装置
JP3621222B2 (ja) 半導体基板のパターン配列認識方法
JPH0384441A (ja) レチクルの検査方法
JPH0375055B2 (OSRAM)
KR970007974B1 (ko) 반도체 공정결함 검사방법
JPH0375054B2 (OSRAM)
JPH04361548A (ja) 欠陥検査方法及び検査装置
JPH07270329A (ja) ウエハ異物検査装置
JPH0621179A (ja) Ｉｃチップの除去エリアの消去方法
JP2991204B2 (ja) 検査装置
JPS6211148A (ja) 異物検査装置
JPH0375053B2 (OSRAM)