JPS6367754A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6367754A
JPS6367754A JP61213123A JP21312386A JPS6367754A JP S6367754 A JPS6367754 A JP S6367754A JP 61213123 A JP61213123 A JP 61213123A JP 21312386 A JP21312386 A JP 21312386A JP S6367754 A JPS6367754 A JP S6367754A
Authority
JP
Japan
Prior art keywords
film
silicon
gate
molybdenum silicide
phosphorus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61213123A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0529139B2 (https=
Inventor
Hiroshi Kawashita
川下　浩
Koichi Nakagawa
中川　興一
Ko Shimomura
興 下村
Katsuhiro Hirata
勝弘 平田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61213123A priority Critical patent/JPS6367754A/ja
Publication of JPS6367754A publication Critical patent/JPS6367754A/ja
Publication of JPH0529139B2 publication Critical patent/JPH0529139B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP61213123A 1986-09-09 1986-09-09 半導体装置 Granted JPS6367754A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61213123A JPS6367754A (ja) 1986-09-09 1986-09-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61213123A JPS6367754A (ja) 1986-09-09 1986-09-09 半導体装置

Publications (2)

Publication Number Publication Date
JPS6367754A true JPS6367754A (ja) 1988-03-26
JPH0529139B2 JPH0529139B2 (https=) 1993-04-28

Family

ID=16633956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61213123A Granted JPS6367754A (ja) 1986-09-09 1986-09-09 半導体装置

Country Status (1)

Country Link
JP (1) JPS6367754A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7679191B2 (en) 2005-07-13 2010-03-16 Nec Electronics Corporation Polysilicon film with increased roughness

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7679191B2 (en) 2005-07-13 2010-03-16 Nec Electronics Corporation Polysilicon film with increased roughness

Also Published As

Publication number Publication date
JPH0529139B2 (https=) 1993-04-28

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