JPS636751U - - Google Patents
Info
- Publication number
- JPS636751U JPS636751U JP10030986U JP10030986U JPS636751U JP S636751 U JPS636751 U JP S636751U JP 10030986 U JP10030986 U JP 10030986U JP 10030986 U JP10030986 U JP 10030986U JP S636751 U JPS636751 U JP S636751U
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- lead frame
- land portion
- electronic circuit
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案に係る電子回路装置の縦断面
図、第２図は、従来の電子回路装置の縦断面図で
ある。 ２１……絶縁板、２２……導電層、２３……素
子取付部、２４……ランド部、２５……リード、
２８……素子、２９……電極、３２……ダミー体
、３４……樹脂。
図、第２図は、従来の電子回路装置の縦断面図で
ある。 ２１……絶縁板、２２……導電層、２３……素
子取付部、２４……ランド部、２５……リード、
２８……素子、２９……電極、３２……ダミー体
、３４……樹脂。
Claims (1)
- 表面に導電層及び素子取付部が形成された絶縁
板を、リードフレームのランド部に接着し、前記
素子取付部に、素子を取付けるとともに、素子の
電極と前記導電層、及び、導電層と前記リードフ
レームのリードとを接続し、全体を樹脂モールド
してなる電子回路装置において、前記リードフレ
ームのランド部裏面に、ランド部表面側に接着し
た構成部品と略同一熱膨脹を有するダミー体を接
着したことを特徴とする電子回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10030986U JPH0334920Y2 (ja) | 1986-06-30 | 1986-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10030986U JPH0334920Y2 (ja) | 1986-06-30 | 1986-06-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS636751U true JPS636751U (ja) | 1988-01-18 |
| JPH0334920Y2 JPH0334920Y2 (ja) | 1991-07-24 |
Family
ID=30970013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10030986U Expired JPH0334920Y2 (ja) | 1986-06-30 | 1986-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334920Y2 (ja) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5461556U (ja) * | 1977-10-07 | 1979-04-28 | ||
| JPS58440U (ja) * | 1981-06-25 | 1983-01-05 | 富士通株式会社 | プラスチツクパツケ−ジ |
| JPS58441U (ja) * | 1981-06-25 | 1983-01-05 | 富士通株式会社 | プラスチツクパツケ−ジ |
| JPS61136249A (ja) * | 1984-12-06 | 1986-06-24 | Nec Kansai Ltd | ハイブリツドｉｃ |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5439370B2 (ja) * | 1971-11-20 | 1979-11-27 | ||
| JPS58441B2 (ja) * | 1978-07-08 | 1983-01-06 | 工業技術院長 | キトサンの製造方法 |
-
1986
- 1986-06-30 JP JP10030986U patent/JPH0334920Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5461556U (ja) * | 1977-10-07 | 1979-04-28 | ||
| JPS58440U (ja) * | 1981-06-25 | 1983-01-05 | 富士通株式会社 | プラスチツクパツケ−ジ |
| JPS58441U (ja) * | 1981-06-25 | 1983-01-05 | 富士通株式会社 | プラスチツクパツケ−ジ |
| JPS61136249A (ja) * | 1984-12-06 | 1986-06-24 | Nec Kansai Ltd | ハイブリツドｉｃ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0334920Y2 (ja) | 1991-07-24 |