JPS63121444U - - Google Patents
Info
- Publication number
- JPS63121444U JPS63121444U JP1331087U JP1331087U JPS63121444U JP S63121444 U JPS63121444 U JP S63121444U JP 1331087 U JP1331087 U JP 1331087U JP 1331087 U JP1331087 U JP 1331087U JP S63121444 U JPS63121444 U JP S63121444U
- Authority
- JP
- Japan
- Prior art keywords
- resin plate
- conductive layer
- conductive layers
- electronic circuit
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
第１図は、本考案に係る電子回路装置の要部の
みの拡大断面図、第２図は、従来の電子回路装置
の断面図、第３図は、第２図の要部の拡大断面図
である。 ２４…樹脂板、２５…表裏面導電層、２６…素
子取付部、２７…ダミー導電層、２８…素子。
みの拡大断面図、第２図は、従来の電子回路装置
の断面図、第３図は、第２図の要部の拡大断面図
である。 ２４…樹脂板、２５…表裏面導電層、２６…素
子取付部、２７…ダミー導電層、２８…素子。
Claims (1)
- 樹脂板の表裏両面に導電層を形成するとともに
、裏面導電層を樹脂板に穿設した貫通孔を介して
表面に導出し、これら導電層と樹脂板表面の素子
取付部に固着した素子の電極とを、ボンデイング
結線するようにした電子回路装置において、前記
樹脂板の裏面導電層間に、表面導電層のボンデイ
ング位置に対応して、ダミー導電層を形成したこ
とを特徴とする電子回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1331087U JPS63121444U (ja) | 1987-01-30 | 1987-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1331087U JPS63121444U (ja) | 1987-01-30 | 1987-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63121444U true JPS63121444U (ja) | 1988-08-05 |
Family
ID=30802253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1331087U Pending JPS63121444U (ja) | 1987-01-30 | 1987-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63121444U (ja) |
-
1987
- 1987-01-30 JP JP1331087U patent/JPS63121444U/ja active Pending