JPS6169828U - - Google Patents
Info
- Publication number
- JPS6169828U JPS6169828U JP1984153183U JP15318384U JPS6169828U JP S6169828 U JPS6169828 U JP S6169828U JP 1984153183 U JP1984153183 U JP 1984153183U JP 15318384 U JP15318384 U JP 15318384U JP S6169828 U JPS6169828 U JP S6169828U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- protruding electrodes
- film
- film substrate
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Description
第１図および第２図はこの考案の一実施例を示
し、第１図はフイルムに電極配線パターンを形成
する工程を示す図、第２図はフイルムの電極配線
パターンに半導体を取り付ける工程を示す図、第
３図は本考案の他の実施例を示す断面図、第４図
は従来のフイルム回路基板の断面図である。 １０……透明フイルム、１４……電極配線パタ
ーン、１７……半導体チツプ、１７ｃ……電極パ
ツド、１８……異方性導電膜。
し、第１図はフイルムに電極配線パターンを形成
する工程を示す図、第２図はフイルムの電極配線
パターンに半導体を取り付ける工程を示す図、第
３図は本考案の他の実施例を示す断面図、第４図
は従来のフイルム回路基板の断面図である。 １０……透明フイルム、１４……電極配線パタ
ーン、１７……半導体チツプ、１７ｃ……電極パ
ツド、１８……異方性導電膜。
Claims (1)
- 高分子材料からなるフイルム基板と、このフイ
ルム基板に形成された突出電極を有する配線パタ
ーンと、この配線パターンの前記突出電極に接続
される半導体チツプとを具備してなるフイルム回
路基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984153183U JPS6169828U (ja) | 1984-10-12 | 1984-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984153183U JPS6169828U (ja) | 1984-10-12 | 1984-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6169828U true JPS6169828U (ja) | 1986-05-13 |
Family
ID=30711218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984153183U Pending JPS6169828U (ja) | 1984-10-12 | 1984-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6169828U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63160350A (ja) * | 1986-12-24 | 1988-07-04 | Seikosha Co Ltd | Ｉｃチップのボンディング構造 |
-
1984
- 1984-10-12 JP JP1984153183U patent/JPS6169828U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63160350A (ja) * | 1986-12-24 | 1988-07-04 | Seikosha Co Ltd | Ｉｃチップのボンディング構造 |