JPS63155634U - - Google Patents
Info
- Publication number
- JPS63155634U JPS63155634U JP1987049713U JP4971387U JPS63155634U JP S63155634 U JPS63155634 U JP S63155634U JP 1987049713 U JP1987049713 U JP 1987049713U JP 4971387 U JP4971387 U JP 4971387U JP S63155634 U JPS63155634 U JP S63155634U
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- connection conductor
- electrode
- emitter
- collector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73257—Bump and wire connectors
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の実施例に係わるトランジスタ
を含む回路装置の一部を切断して示す断面図、第
２図は本考案の別の実施例に係わるトランジスタ
を含む回路装置の一部を切断して示す断面図であ
る。 １……基板、２……エミツタ接続導体層、３…
…ベース接続導体層、４……コレクタ接続導体層
、５……厚膜抵抗、６……トランジスタチツプ、
１０，１１……バンプ、１２……ワイヤ。
を含む回路装置の一部を切断して示す断面図、第
２図は本考案の別の実施例に係わるトランジスタ
を含む回路装置の一部を切断して示す断面図であ
る。 １……基板、２……エミツタ接続導体層、３…
…ベース接続導体層、４……コレクタ接続導体層
、５……厚膜抵抗、６……トランジスタチツプ、
１０，１１……バンプ、１２……ワイヤ。
Claims (1)
- 【実用新案登録請求の範囲】 エミツタ接続導体層とベース接続導体層とコレ
クタ接続導体層とを有する絶縁基板と、 一方の主面にエミツタ電極とベース電極とを有
し、他方の主面にコレクタ電極を有し、前記エミ
ツタ電極と前記ベース電極とがバンプによつて前
記エミツタ接続導体層とベース接続導体層とにそ
れぞれ接続され、前記コレクタ電極と前記コレク
タ接続導体層との間がワイヤで接続されているト
ランジスタチツプと を具備していることを特徴とする回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987049713U JPS63155634U (ja) | 1987-03-31 | 1987-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987049713U JPS63155634U (ja) | 1987-03-31 | 1987-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63155634U true JPS63155634U (ja) | 1988-10-12 |
Family
ID=30872421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987049713U Pending JPS63155634U (ja) | 1987-03-31 | 1987-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63155634U (ja) |
-
1987
- 1987-03-31 JP JP1987049713U patent/JPS63155634U/ja active Pending